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1. 发明授权

US08853551B2 Wired circuit board and producing method thereof 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US08853551B2
公开(公告)日：2014-10-07
申请号：US13067149
申请日：2011-05-12
申请人： Katsutoshi Kamei , Yuu Sugimoto , Kimihide Kitamura
发明人： Katsutoshi Kamei , Yuu Sugimoto , Kimihide Kitamura
IPC分类号： H05K1/03 , H05K1/00 , H05K1/09 , H05K1/11 , H05K1/14
CPC分类号： H05K1/118 , H05K1/147 , H05K2201/0338 , Y10T29/49162
摘要： A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.
摘要翻译：布线电路板包括绝缘层，以及形成在绝缘层上的第一导电图案和第二导电图案。第一导电图案包括设置有金属镀层的第一外部端子，要被焊接的第一内部端子和连接第一外部端子和第一内部端子的第一导线。第二导电图案包括要被焊接的第二外部端子，要被焊接的第二内部端子和连接第二外部端子和第二内部端子的第二导线。第一内端子和第二内端子以彼此相对的关系布置，以便与公共电气部件焊接，并且在其上进行预过程处理，并且金属镀层设置在第二导线上。

2. 发明申请

US20130014976A1 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US20130014976A1
公开(公告)日：2013-01-17
申请号：US13485274
申请日：2012-05-31
申请人： Saori ISHIGAKI , Jun ISHII , Yoshito FUJIMURA , Yuu SUGIMOTO
发明人： Saori ISHIGAKI , Jun ISHII , Yoshito FUJIMURA , Yuu SUGIMOTO
IPC分类号： H05K1/00 , H05K3/10 , H05K1/05
CPC分类号： H05K1/189 , G11B5/484 , G11B5/4853 , G11B5/4873 , H05K3/321 , H05K2201/0385 , H05K2201/053 , H05K2201/09072 , H05K2201/10083
摘要： [Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability.[Solving Means] A suspension board with circuit 3 includes power-source wires 25B, and piezoelectric-side terminals 40 formed continuously to the power-source wires 25B and electrically connected thereunder to piezoelectric elements 5. Each of the piezoelectric-side terminals 40 includes an outer contact portion 51, and an inner contact portion 53 provided around the outer contact portion 51 to protrude below the outer contact portion 51.
摘要翻译： [目的]提供一种布线电路基板，其中可以抑制导电粘合剂泄漏到外部，同时抑制端子的尺寸增加，并且还提高连接可靠性。具体实施方式具有电路3的悬挂基板包括电源线25B和压电侧端子40，压电侧端子40与电源线25B连续地形成，并且与压电元件5电连接。各压电侧端子40包括外接触部51和设置在外接触部51周围的内接触部53，突出到外接触部51的下方。

3. 发明授权

US08869391B2 Producing method of wired circuit board 有权
标题翻译：有线电路板的生产方法
公开(公告)号：US08869391B2
公开(公告)日：2014-10-28
申请号：US13317648
申请日：2011-10-25
申请人： Katsutoshi Kamei , Yuu Sugimoto , Hitoki Kanagawa
发明人： Katsutoshi Kamei , Yuu Sugimoto , Hitoki Kanagawa
IPC分类号： H05K3/10 , H05K3/42 , G11B5/48 , H05K1/05
CPC分类号： H05K3/421 , G11B5/486 , H05K1/056 , H05K3/108 , H05K2201/09509 , H05K2203/1105 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155
摘要： A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.
摘要翻译：布线电路基板的制造方法包括以下步骤：制备金属支撑层，在金属支撑层上形成绝缘层以形成开口，在绝缘层和金属支撑层上形成导电薄膜，从绝缘层的开口露出，加热导电薄膜，在形成于绝缘层上的导电薄膜上形成导电图案，并在导电薄膜上形成与导电图案连续的金属连接部分形成在从绝缘层的开口露出的金属支撑层上的膜。

4. 发明申请

US20120160406A1 METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY ELEMENT 有权
标题翻译：制造液晶显示元件的方法
公开(公告)号：US20120160406A1
公开(公告)日：2012-06-28
申请号：US13351714
申请日：2012-01-17
申请人： Yuu Sugimoto , Seiji Umemoto , Takuya Nakazono
发明人： Yuu Sugimoto , Seiji Umemoto , Takuya Nakazono
IPC分类号： B32B38/10
CPC分类号： B32B43/003 , B32B37/025 , B32B37/12 , B32B37/182 , B32B38/0004 , B32B41/00 , B32B2307/42 , B32B2310/0843 , B32B2457/202 , G02F1/1303 , G02F1/1333 , Y10T156/1052 , Y10T156/1056 , Y10T156/1057 , Y10T156/1062 , Y10T156/1064 , Y10T156/1082 , Y10T156/1084 , Y10T156/1085
摘要： A method for manufacturing a liquid crystal display element, includes: providing a long sheet material including a laminate of an optical film containing a polarizer, a pressure-sensitive adhesive layer, and a carrier film temporarily bonded to the pressure-sensitive adhesive layer; cutting the long sheet material at predetermined intervals, while maintaining the continuity of the carrier film; peeling off the carrier film by a tensile force; and continuously bonding the resulting optical film pieces to liquid crystal panels, respectively, through the pressure-sensitive adhesive layer exposed by the peeling off, while feeding the resulting optical film pieces, wherein the cutting is performed to such a depth as to substantially reach the carrier film, and the carrier film is cut to a depth less than half of the thickness of the carrier film at least both end portions in the width direction of the carrier film.
摘要翻译：一种制造液晶显示元件的方法，包括：提供一种长片材料，其包括含有偏光片，粘合剂层和暂时粘合到所述压敏粘合剂层上的载体膜的光学膜的叠层; 在保持载体膜的连续性的同时以预定间隔切割长片材; 用拉力剥离载体膜; 并将所得到的光学膜片分别连续地粘合到通过剥离而暴露的压敏粘合剂层的液晶面板，同时进给所得到的光学膜片，其中进行切割至基本达到并且载体膜在载体膜的宽度方向上的至少两个端部被切割成小于载体膜的厚度的一半的深度。

5. 发明申请

US20120124829A1 Producing method of wired circuit board 有权
标题翻译：有线电路板的生产方法
公开(公告)号：US20120124829A1
公开(公告)日：2012-05-24
申请号：US13317648
申请日：2011-10-25
申请人： Katsutoshi Kamei , Yuu Sugimoto , Hitoki Kanagawa
发明人： Katsutoshi Kamei , Yuu Sugimoto , Hitoki Kanagawa
IPC分类号： H05K3/10
CPC分类号： H05K3/421 , G11B5/486 , H05K1/056 , H05K3/108 , H05K2201/09509 , H05K2203/1105 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155
摘要： A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.
摘要翻译：布线电路基板的制造方法包括以下步骤：制备金属支撑层，在金属支撑层上形成绝缘层以形成开口，在绝缘层和金属支撑层上形成导电薄膜，从绝缘层的开口露出，加热导电薄膜，在形成于绝缘层上的导电薄膜上形成导电图案，并在导电薄膜上形成与导电图案连续的金属连接部分形成在从绝缘层的开口露出的金属支撑层上的膜。

6. 发明授权

US09241410B2 Wired circuit board and producing method thereof 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US09241410B2
公开(公告)日：2016-01-19
申请号：US13485274
申请日：2012-05-31
申请人： Saori Ishigaki , Jun Ishii , Yoshito Fujimura , Yuu Sugimoto
发明人： Saori Ishigaki , Jun Ishii , Yoshito Fujimura , Yuu Sugimoto
IPC分类号： H05K1/16 , H05K1/18 , H05K3/32 , G11B5/48
CPC分类号： H05K1/189 , G11B5/484 , G11B5/4853 , G11B5/4873 , H05K3/321 , H05K2201/0385 , H05K2201/053 , H05K2201/09072 , H05K2201/10083
摘要： A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.
摘要翻译：布线电路板包括绝缘层和导电层，导电层包括被绝缘层覆盖的导线，以及连接到导线的端子，以将导线电连接到电子元件。绝缘层形成有露出端子的绝缘开口，并且端子形成为在厚度方向上凹陷的图案。

7. 发明授权

US08547663B2 Suspension board with circuit having an electrically conductive layer interposed between a support terminal and metal plating layer 有权
标题翻译：具有插入在支撑端子和金属电镀层之间的导电层的电路的悬挂板
公开(公告)号：US08547663B2
公开(公告)日：2013-10-01
申请号：US13317599
申请日：2011-10-24
申请人： Yuu Sugimoto
发明人： Yuu Sugimoto
IPC分类号： G11B5/48 , H05K1/09
CPC分类号： H05K1/11 , G11B5/486 , H05K1/0268 , H05K1/056 , H05K3/4007 , H05K2201/0341 , H05K2203/0323
摘要： A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.
摘要翻译：具有电路的悬挂板包括金属支撑板; 绝缘层，形成在所述金属支撑板上，具有沿其形成的厚度方向贯通的开口; 以及形成在绝缘层上的导电图案，包括与外部电路电连接的外侧端子。外侧端子填充在绝缘层的开口部中。在金属支撑板中，设置有与周围金属支撑板电绝缘并与外部侧端子电连接的支撑端子。具有电路的悬挂板包括形成在支撑端子下方的金属镀层和插入在支撑端子和金属镀层之间的厚度为10nm以上至200nm以下的导电层。

8. 发明申请

US20120111608A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20120111608A1
公开(公告)日：2012-05-10
申请号：US13317365
申请日：2011-10-17
申请人： Katsutoshi Kamei , Kouji Ichinose , Yuu Sugimoto
发明人： Katsutoshi Kamei , Kouji Ichinose , Yuu Sugimoto
IPC分类号： H05K1/09
CPC分类号： H05K3/4092 , G11B5/486 , H05K3/108 , H05K2201/09845
摘要： A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.
摘要翻译：布线电路板包括绝缘基底层，层压在绝缘基底层上的导电图案和层叠在绝缘基底层上以覆盖导电图案的绝缘覆盖层。导电图案包括当在绝缘基底层的层压方向上投射导电图案和绝缘覆盖层时，导电图案包括从基底绝缘层和绝缘覆盖层露出的端子部分。端子部分包括暴露的表面，其暴露于外部端子侧。在露出的表面上形成有与外部端子的接触方向突出的突出部。

9. 发明申请

US20110284274A1 Wired circuit board and producing method thereof 有权
标题翻译：有线电路板及其制造方法
公开(公告)号：US20110284274A1
公开(公告)日：2011-11-24
申请号：US13067149
申请日：2011-05-12
申请人： Katsutoshi Kamei , Yuu Sugimoto , Kimihide Kitamura
发明人： Katsutoshi Kamei , Yuu Sugimoto , Kimihide Kitamura
IPC分类号： H05K1/09 , H05K3/10 , H05K1/00
CPC分类号： H05K1/118 , H05K1/147 , H05K2201/0338 , Y10T29/49162
摘要： A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.
摘要翻译：布线电路板包括绝缘层，以及形成在绝缘层上的第一导电图案和第二导电图案。第一导电图案包括设置有金属镀层的第一外部端子，要被焊接的第一内部端子和连接第一外部端子和第一内部端子的第一导线。第二导电图案包括要被焊接的第二外部端子，要被焊接的第二内部端子和连接第二外部端子和第二内部端子的第二导线。第一内端子和第二内端子以彼此相对的关系布置，以便与公共电气部件焊接，并且在其上进行预过程处理，并且金属镀层设置在第二导线上。

10. 发明申请

US20100236702A1 METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY ELEMENT 有权
标题翻译：制造液晶显示元件的方法
公开(公告)号：US20100236702A1
公开(公告)日：2010-09-23
申请号：US12715079
申请日：2010-03-01
申请人： Yuu Sugimoto , Seiji Umemoto , Takuya Nakazono
发明人： Yuu Sugimoto , Seiji Umemoto , Takuya Nakazono
IPC分类号： B32B38/04
CPC分类号： B32B43/003 , B32B37/025 , B32B37/12 , B32B37/182 , B32B38/0004 , B32B41/00 , B32B2307/42 , B32B2310/0843 , B32B2457/202 , G02F1/1303 , G02F1/1333 , Y10T156/1052 , Y10T156/1056 , Y10T156/1057 , Y10T156/1062 , Y10T156/1064 , Y10T156/1082 , Y10T156/1084 , Y10T156/1085
摘要： A method for manufacturing a liquid crystal display element is provided which simultaneously achieves the object of cutting an optical film without causing degradation in appearance and the object of preventing the film from being broken in a continuous bonding process, and includes: providing a long sheet material including a laminate of an optical film containing a polarizer, a pressure-sensitive adhesive layer, and a carrier film temporarily bonded to the pressure-sensitive adhesive layer; cutting the long sheet material at predetermined intervals, while maintaining the continuity of the carrier film; peeling off the carrier film by a tensile force; and continuously bonding the resulting optical film pieces to liquid crystal panels, respectively, through the pressure-sensitive adhesive layer exposed by the peeling off, while feeding the resulting optical film pieces, wherein the cutting is performed to such a depth as to substantially reach the carrier film, and the carrier film is cut to a depth less than half of the thickness of the carrier film at least both end portions in the width direction of the carrier film.
摘要翻译：提供一种制造液晶显示元件的方法，其同时实现了在不引起外观劣化的情况下切割光学膜的目的，并且在连续粘合工艺中防止膜破裂的目的，并且包括：提供长的片材包括含有偏光片的光学膜，粘合剂层和临时接合在压敏粘合剂层上的载体膜的叠层体; 在保持载体膜的连续性的同时以预定间隔切割长片材; 用拉力剥离载体膜; 并将所得到的光学膜片分别连续地粘合到通过剥离而暴露的压敏粘合剂层的液晶面板，同时进给所得到的光学膜片，其中进行切割至基本达到并且载体膜在载体膜的宽度方向上的至少两个端部被切割成小于载体膜的厚度的一半的深度。

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