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1. 发明申请

US20130223061A1 MULTI-LAYER ARRAY TYPE LED DEVICE HAVING A MULTI-LAYER HEAT DISSIPATION STRUCTURE 审中-公开
标题翻译：具有多层散热结构的多层阵列型LED装置
公开(公告)号：US20130223061A1
公开(公告)日：2013-08-29
申请号：US13409095
申请日：2012-02-29
申请人： JON-FWU HWU , Yung-Fu Wu , Kui-Chiang Liu
发明人： JON-FWU HWU , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： F21V11/00 , F21V29/00
CPC分类号： F21V29/89 , F21K9/232 , F21K9/238 , F21V3/00 , F21V23/006 , F21V29/74 , F21V29/75 , F21V29/773 , F21V29/83 , F21Y2115/10
摘要： A multi-layer array type LED device having a multi-layer heat dissipation structure includes a heat dissipation seat, an optical module, a housing, a power supply module, a wireless transmission module, a diffusion cover and a lamp head. In the present invention, the heat-generating components include the optical module, the power supply module and the wireless transmission module, and the heat-generating components are separately installed so that the heat accumulation effect can be decreased. In the present invention, the heat dissipation seat is used together with the housing having a plurality of the heat dissipation holes. The heat dissipation seat having excellent heat conductivity is used for rapidly absorbing heat and transferring it to the surrounding environment, and the surrounding air can be introduced into the housing via the heat dissipation holes for further increasing the heat dissipation efficiency.
摘要翻译：具有多层散热结构的多层阵列型LED器件包括散热座，光学模块，外壳，电源模块，无线传输模块，漫射罩和灯头。在本发明中，发热部件包括光学模块，电源模块和无线传输模块，并且分别安装发热部件，从而能够降低热积聚效果。在本发明中，散热座与具有多个散热孔的壳体一起使用。具有优良导热性的散热座用于快速吸收热量并将其转移到周围环境，并且可以通过散热孔将周围的空气引入壳体中，以进一步提高散热效率。

2. 发明授权

US08338923B1 Package structure of multi-layer array type LED device 有权
标题翻译：多层阵列式LED器件的封装结构
公开(公告)号：US08338923B1
公开(公告)日：2012-12-25
申请号：US13224330
申请日：2011-09-02
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01L23/495
CPC分类号： H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： A package structure of multi-layer array type LED device is disclosed, wherein a peripheral area of a substrate and a surface of lead frame are respectively installed with a convex/concave surface structure. The convex/concave surface structure increases the surface roughness of the peripheral area of the substrate and the surface of the lead frame, so a liquid package material can be filled in cavities and concave parts; thus a package member formed through the package material being solidified can be firmly combined with the substrate and the lead frame as one piece. In addition, the bottom of a lens is provided with a binder for increasing the sealing level of the lens. Moreover, the present invention adopted a soldering paste added with material having good heat conductivity, so heat generated by LED dices can be rapidly dissipated to the exterior.
摘要翻译：公开了一种多层阵列型LED器件的封装结构，其中基片的周边区域和引线框架的表面分别安装有凸/凹表面结构。凸/凹表面结构增加了基板周边区域和引线框架表面的表面粗糙度，因此液体封装材料可以填充在空腔和凹部中; 因此通过固化的封装材料形成的封装构件可以与衬底和引线框架一体地牢固地组合。此外，透镜的底部设置有用于增加透镜的密封水平的粘合剂。此外，本发明采用添加了具有良好导热性的材料的焊膏，因此可以将由LED芯片产生的热迅速地散发到外部。

3. 发明授权

US08247969B2 Optical lens having fluorescent layer adapted for LED packaging structure 有权
标题翻译：具有适用于LED封装结构的荧光层的光学透镜
公开(公告)号：US08247969B2
公开(公告)日：2012-08-21
申请号：US12892893
申请日：2010-09-28
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H05B33/04 , H01L33/10
CPC分类号： G02B27/0955 , G02B19/0028 , G02B19/0066 , H01L33/507 , H01L33/58 , H01L2224/48137 , H01L2224/48247
摘要： An optical lens having a fluorescent layer is provided. The optical lens is adapted for being employed in an LED packaging structure. The optical lens includes a substrate, at least one lens body, a lens shade, and a packaging member. The substrate is positioned at a bottommost side of the packaging structure, and the lens shade is positioned at a topmost side of the packaging structure. The lens body is positioned over the substrate and beneath the lens shade. A plurality of light emitting units are disposed on the substrate. The packaging member is adapted for packaging the substrate and the lens shade. The lens body is secured by the packing member so as to be positioned over the light emitting units. The lens body includes a fluorescent layer buried inside the lens body, and the lens body is positioned apart from the light emitting units for a certain distance.
摘要翻译：提供具有荧光层的光学透镜。光学透镜适用于LED封装结构。光学透镜包括基板，至少一个透镜体，透镜遮光板和包装部件。基板位于包装结构的最底侧，透镜遮光板位于包装结构的最上侧。透镜主体位于基板上方，并位于透镜遮光板下方。多个发光单元设置在基板上。包装构件适于包装基底和透镜遮蔽物。透镜体由密封构件固定，以便定位在发光单元之上。透镜体包括埋在透镜体内的荧光层，并且透镜体与发光单元隔开一定距离。

4. 发明申请

US20120074837A1 OPTICAL LENS HAVING FLUORESCENT LAYER ADAPTED FOR LED PACKAGING STRUCTURE 有权
标题翻译：具有适用于LED封装结构的荧光层的光学透镜
公开(公告)号：US20120074837A1
公开(公告)日：2012-03-29
申请号：US12892893
申请日：2010-09-28
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H01J1/66
CPC分类号： G02B27/0955 , G02B19/0028 , G02B19/0066 , H01L33/507 , H01L33/58 , H01L2224/48137 , H01L2224/48247
摘要： An optical lens having a fluorescent layer is provided. The optical lens is adapted for being employed in an LED packaging structure. The optical lens includes a substrate, at least one lens body, a lens shade, and a packaging member. The substrate is positioned at a bottommost side of the packaging structure, and the lens shade is positioned at a topmost side of the packaging structure. The lens body is positioned over the substrate and beneath the lens shade. A plurality of light emitting units are disposed on the substrate. The packaging member is adapted for packaging the substrate and the lens shade. The lens body is secured by the packing member so as to be positioned over the light emitting units. The lens body includes a fluorescent layer buried inside the lens body, and the lens body is positioned apart from the light emitting units for a certain distance.
摘要翻译：提供具有荧光层的光学透镜。光学透镜适用于LED封装结构。光学透镜包括基板，至少一个透镜体，透镜遮光板和包装部件。基板位于包装结构的最底侧，透镜遮光板位于包装结构的最上侧。透镜主体位于基板上方，并位于透镜遮光板下方。多个发光单元设置在基板上。包装构件适于包装基底和透镜遮蔽物。透镜体由密封构件固定，以便定位在发光单元之上。透镜体包括埋在透镜体内的荧光层，并且透镜体与发光单元隔开一定距离。

5. 发明授权

US07211371B2 Method of manufacturing a TFT array panel for a LCD 有权
标题翻译：制造液晶显示器用TFT阵列面板的方法
公开(公告)号：US07211371B2
公开(公告)日：2007-05-01
申请号：US10673326
申请日：2003-09-30
申请人： Chi-Shen Lee , Yung-Fu Wu , Chi-Lin Chen , Cheng-Chung Chen
发明人： Chi-Shen Lee , Yung-Fu Wu , Chi-Lin Chen , Cheng-Chung Chen
IPC分类号： G03F7/00
CPC分类号： G02F1/1368 , G02F1/136213 , H01L27/1255 , H01L27/1288
摘要： A method of manufacturing a TFT array panel for a LCD disclosers that the gate electrode wiring, transparent conducting electrode, and the first electrode of the storage capacity are formed while the first mask is processing. Then, the selective deposition method is used to process the growth of the first metal wiring. This, therefore, can reduce the numbers of the mask processes. Further, the metal deposition with photo-resist lift-off step is used to implement the layout of the second metal wiring for the consequent transmission lines in the manufacturing process. Finally, the process of the passivation layer deposition is used to implement associated circuits of a TFT array panel for a LCD. The TFT array panel for a LCD for manufacturing circuits can simplify the manufacturing process and reduce the cost.
摘要翻译：制造LCD阵列面板的方法公开了在第一掩模处理期间形成栅电极布线，透明导电电极和存储容量的第一电极。然后，选择性沉积法用于处理第一金属布线的生长。因此，这可以减少掩模处理的数量。此外，利用光刻胶剥离工序进行金属蒸镀，以在制造工序中实现用于后续传输线的第二金属布线的布局。最后，钝化层沉积的过程用于实现用于LCD的TFT阵列面板的相关电路。用于制造电路的LCD的TFT阵列面板可以简化制造工艺并降低成本。

6. 发明申请

US20060292757A1 Thin-film transistor (TFT) for driving organic light-emitting diode (OLED) and method for manufacturing the same 审中-公开
公开(公告)号：US20060292757A1
公开(公告)日：2006-12-28
申请号：US11201150
申请日：2005-08-11
申请人： Yung-Fu Wu , Yu-Jung Liu , Yung-Hui Yeh
发明人： Yung-Fu Wu , Yu-Jung Liu , Yung-Hui Yeh
IPC分类号： H01L21/84
CPC分类号： H01L27/1288 , H01L27/1214 , H01L27/1218 , H01L27/322
摘要： A thin-film transistor (TFT) and a method for manufacturing the thin-film transistor using a color filter as a dielectric layer so as to drive an organic light-emitting diode. The thin-film transistor comprises: a substrate; a first poly-silicon mesa formed on the substrate; an insulating layer formed on the substrate and covering the first poly-silicon mesa; a gate metal layer formed on the insulating layer; a color-filtering dielectric layer formed on the insulating layer and covering the gate metal layer, the dielectric layer being provided with a plurality of contact holes penetrating through the dielectric layer and the insulating layer; and a conductive layer formed on the dielectric layer and coupled to the first poly-silicon mesa through the contact holes. The method comprises steps of: providing a substrate; forming a first poly-silicon mesa and a second poly-silicon mesa on the substrate; doping the first poly-silicon mesa with an n-type dopant using ion implantation; forming an insulating layer on the substrate, the insulating layer covering the first poly-silicon mesa and the second poly-silicon mesa; forming a gate metal layer on the insulating layer corresponding to the first poly-silicon mesa and the second poly-silicon mesa; doping the first poly-silicon mesa with an n-type dopant using ion implantation; doping the second poly-silicon mesa with a p-type dopant using ion implantation; forming a dielectric layer capable of color filtering on the insulating layer, the dielectric layer covering the gate metal layer; forming a plurality of contact holes in the dielectric layer, the plurality of contact holes penetrating the dielectric layer and the insulating layer so as to contact the first poly-silicon mesa and the second poly-silicon mesa; forming a conductive layer on the dielectric layer; and etching the conductive layer.

7. 发明申请

US20060262538A1 LIGHT-EMITTING DIODE COMPONENT HAVING A LIGHT DIRECTION-CHANGING UNIT AND RELATED LIGHT DIRECTION-CHANGING UNIT AND MODULE 有权
标题翻译：具有轻型方向改变单元的发光二极管组件和相关的光方向改变单元和模块
公开(公告)号：US20060262538A1
公开(公告)日：2006-11-23
申请号：US11162466
申请日：2005-09-12
申请人： Zhi-Feng Li , Yung-Fu Wu , Po-Hsien Lee
发明人： Zhi-Feng Li , Yung-Fu Wu , Po-Hsien Lee
IPC分类号： F21V7/00 , F21V3/00 , F21V5/00
CPC分类号： H01L33/54 , Y10S362/80
摘要： A light-emitting diode (LED) component includes a circuit board, an LED chip installed on the circuit board for emitting light, and a light direction-changing unit. The LED chip is composed of a plurality of light-emitting points. The unit has a covering surface covering the LED chip, and a reflecting surface having a plurality of reflecting points. A smallest included angle of a plurality of included angles between a normal line of at least one of the reflecting points and a plurality of connection lines passing through the reflecting point and the light-emitting points is larger than sin−1(1/n), where n is the reflection index of the light direction-changing unit.
摘要翻译：发光二极管（LED）部件包括电路板，安装在用于发光的电路板上的LED芯片和光转向单元。 LED芯片由多个发光点组成。该单元具有覆盖LED芯片的覆盖面和具有多个反射点的反射面。至少一个反射点的法线与穿过反射点和发光点的多个连接线之间的多个夹角的最小夹角大于sin-1（1 / n），其中n是光方向改变单元的反射指数。

8. 发明授权

US06943371B2 Thin film transistor and fabrication method for same 有权
标题翻译：薄膜晶体管及其制造方法相同
公开(公告)号：US06943371B2
公开(公告)日：2005-09-13
申请号：US10651009
申请日：2003-08-29
申请人： Chen-Ming Chen , Yung-Fu Wu
发明人： Chen-Ming Chen , Yung-Fu Wu
IPC分类号： G02F1/1368 , H01L21/28 , H01L21/336 , H01L21/77 , H01L21/84 , H01L27/12 , H01L29/417 , H01L29/423 , H01L29/49 , H01L29/786 , H01L51/50 , H01L29/04 , H01L31/036 , H01L31/0376 , H01L31/20
CPC分类号： H01L27/1288 , H01L27/124 , H01L29/41733 , H01L29/66757
摘要： A thin film transistor and a method for fabricating the same. The thin film transistor comprises a substrate and a patterned semiconductive layer formed on the substrate, wherein the semiconductive layer comprises a channel region and doped regions adjacent to the channel region. A gate insulating layer is formed on the above structure. A gate electrode is located on the gate insulating layer above the channel region. Source and drain electrodes are located on the gate insulating layer adjacent to the semiconductive layer. A dielectric layer having contact holes is formed on the above structure and a patterned conductive layer is formed on predetermined parts of the dielectric layer electrically connecting the doped regions to the source and drain electrode through the contact holes.
摘要翻译：一种薄膜晶体管及其制造方法。薄膜晶体管包括衬底和形成在衬底上的图案化半导体层，其中半导体层包括沟道区和与沟道区相邻的掺杂区。在上述结构上形成栅极绝缘层。栅极电极位于沟道区域上方的栅极绝缘层上。源极和漏极位于与半导体层相邻的栅极绝缘层上。在上述结构上形成具有接触孔的电介质层，并且在介电层的预定部分上形成图案化导电层，该电介质层通过接触孔将掺杂区域电连接到源电极和漏电极。

9. 发明授权

US09121579B2 Method for manufacturing integrally formed multi-layer light-emitting device 有权
标题翻译：一体形成的多层发光装置的制造方法
公开(公告)号：US09121579B2
公开(公告)日：2015-09-01
申请号：US13457833
申请日：2012-04-27
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： H05K3/30 , F21V7/22 , F21K99/00 , F21V29/77 , F21V23/00 , F21Y101/02
CPC分类号： F21V7/22 , F21K9/00 , F21K9/90 , F21V23/002 , F21V29/773 , F21Y2115/10 , Y10T29/49117
摘要： A method for manufacturing an integrally formed multi-layer light-emitting device is provided, in which a seat is integrally formed in such a manner that the light-emitting elements can be directly disposed in the chamber. The lens mask is used to seal the light-emitting elements in the chamber of the seat so that some packaging steps can be omitted, and the manufacturing process is simplified. The seat is made of metal having good thermal conductivity instead of plastic materials. The consumption of the package material is reduced, and the heat-dissipation efficiency is increased in the present invention.
摘要翻译：提供一种制造整体形成的多层发光装置的方法，其中座椅一体地形成，使得发光元件可以直接设置在腔室中。透镜掩模用于密封座的腔室中的发光元件，使得可以省略一些包装步骤，并且简化了制造过程。座椅由金属制成，具有良好的导热性，而不是塑料材料。减少了包装材料的消耗，并且在本发明中增加了散热效率。

10. 发明授权

US08789976B2 Integrated multi-layered illuminating unit and integrated multi-layered illuminating assembling unit 有权
标题翻译：集成多层照明单元和集成多层照明组装单元
公开(公告)号：US08789976B2
公开(公告)日：2014-07-29
申请号：US13542664
申请日：2012-07-06
申请人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
发明人： Jon-Fwu Hwu , Yung-Fu Wu , Kui-Chiang Liu
IPC分类号： F21V29/00 , F21V21/00 , F21V19/00
CPC分类号： F21V29/763 , F21K9/00 , F21K9/232 , F21S2/005 , F21V19/003 , F21V23/002 , F21V23/045 , F21V29/76 , F21Y2107/00 , F21Y2115/10 , H01L25/0753 , H01L33/642 , H01L2924/0002 , H01L2924/00
摘要： An integrated multi-layered illuminating unit and an integrated multi-layered illuminating assembling unit are provided in the disclosure. The illuminating unit provided in the present invention can be adapted to different purposes and locations of use through a flexible number of heat dissipating bases used and adaptable assembling methods, in other words, the present invention provides an illuminating unit which can be assembled into specific forms depending on different applications and purposes. The illuminating unit and can provide various irradiation intensity and rage, wherein the heat dissipating bases are connected and assembled with each other through connecting members with an easy, fast and convenient method, thus the illuminating unit provided is very time and effort saving regarding its production and maintenance.
摘要翻译：本发明提供集成的多层照明单元和集成多层照明组装单元。本发明中提供的照明单元可以通过柔性数量的散热基座和适用的组装方法适应于不同的用途和使用位置，换句话说，本发明提供一种照明单元，其可组装成具体形式取决于不同的应用和目的。照明单元并且可以提供各种照射强度和愤怒，其中散热基座通过连接构件以简单，快速和方便的方式彼此连接和组装，因此所提供的照明单元在其生产上非常节省时间和精力和维护。

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