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    • 3. 发明授权
    • Over-current protection device
    • 过电流保护装置
    • US06809626B2
    • 2004-10-26
    • US10614958
    • 2003-07-08
    • Edward Fu-Hua ChuDavid Shau-Chew WangYun-Ching Ma
    • Edward Fu-Hua ChuDavid Shau-Chew WangYun-Ching Ma
    • H01H85147
    • H01C1/1406H01C7/02
    • An over-current protection device comprises a positive temperature coefficient material layer, an upper electrode foil, a lower electrode foil, a first metal terminal layer, a second metal terminal layer and at least one insulating layer. The upper electrode foil is disposed on the upper surface of the positive temperature coefficient material layer, and the lower electrode foil is disposed on the lower surface of the positive temperature coefficient material layer. The first metal terminal layer electrically connects the upper electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole, and the second metal terminal layer electrically connects the lower electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole. The insulating layer isolates the upper electrode foil from the second metal terminal layer and the lower electrode foil from the first metal terminal layer.
    • 过电流保护装置包括正温度系数材料层,上电极箔,下电极箔,第一金属端子层,第二金属端子层和至少一个绝缘层。 上电极箔设置在正温度系数材料层的上表面上,下电极箔设置在正温度系数材料层的下表面上。 第一金属端子层将上电极箔与至少一个非全圆形导电通孔和至少一个全圆形导电通孔电连接,并且第二金属端子层将下电极箔与至少一个 非全圆导电通孔和至少一个全圆导电通孔。 绝缘层将上电极箔与第二金属端子层和下电极箔隔离开第一金属端子层。
    • 5. 发明授权
    • Surface mountable over-current protecting apparatus
    • 表面贴装式过电流保护装置
    • US06665164B2
    • 2003-12-16
    • US10100977
    • 2002-03-19
    • Edward Fu-Hua ChuDavid Shau-Chew WangYun-Ching Ma
    • Edward Fu-Hua ChuDavid Shau-Chew WangYun-Ching Ma
    • H02H504
    • H01C17/28H01C1/14H01C1/1406H01C7/02H05K1/181H05K3/3426H05K3/3442H05K2201/10515Y02P70/613
    • The present invention relates to an over-current protecting apparatus, which comprises at least one PTC over-current protecting component and a body. The PTC over-current protecting component has a PTC material, electrodes covering the PTC material, and metal terminations electrically connected to the electrodes. The body has an insulating layer and a first conductive and second conductive regions covering the insulating layer. An end of the first conductive region and second conductive region are electrically connected to the metal terminations, and another ends of the first conductive and second conductive regions are mounted to a PCB. The metal material occupies over 20% area of the sidewall of the first conductive and second conductive regions for increasing solderability. Besides, the top of the PTC over-current protecting component can be adhered to another body to form a symmetrical bodies.
    • 本发明涉及一种过电流保护装置,其包括至少一个PTC过电流保护部件和主体。 PTC过电流保护元件具有PTC材料,覆盖PTC材料的电极和电连接到电极的金属端子。 主体具有覆盖绝缘层的绝缘层和第一导电和第二导电区域。 第一导电区域和第二导电区域的端部电连接到金属端子,并且第一导电区域和第二导电区域的另一端安装到PCB。 金属材料占据第一导电和第二导电区域的侧壁的超过20%的面积,以增加可焊性。 此外,PTC过电流保护部件的顶部可以粘附到另一个主体以形成对称的主体。
    • 7. 发明授权
    • Printed circuit board comprising an embedded functional element therein
    • 其中包括嵌入式功能元件的印刷电路板
    • US06487084B1
    • 2002-11-26
    • US10072505
    • 2002-02-05
    • Edward Fu-Hua ChuYun-Ching MaDavid Shau-Chew Wang
    • Edward Fu-Hua ChuYun-Ching MaDavid Shau-Chew Wang
    • H05K118
    • H05K1/167H05K1/0201H05K1/095H05K3/429H05K3/4644H05K2201/09309H05K2201/10022H05K2201/10151Y10T428/24917
    • A PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.
    • 一种PCB,包括衬底,至少一个电路层和至少一个绝缘层,其特征在于,所述PCB还包括至少一个嵌入式功能材料,例如PTC,以及NTC和ZTC材料。 如果在本发明中应用PTC材料,则本发明的正常电阻将显着小于常规PTC保护装置的电阻,因为本发明的PTC材料的面积大于常规PTC保护的面积 仪器。 此外,通过导电孔,分别位于功能材料的顶表面和底表面上的上电极和下电极分别与安装在PCB的表面上的装置连接以形成导电电路。 因此,通常安装在PCB的表面上的至少一个过电流保护装置被消除,并且改善了PCB的表面利用率。