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    • 2. 发明授权
    • Over-current and over-voltage protection assembly apparatus
    • 过电流和过电压保护装置
    • US07965479B2
    • 2011-06-21
    • US11857839
    • 2007-09-19
    • Pao Hsuan ChenChing Han YuTong Cheng Tsai
    • Pao Hsuan ChenChing Han YuTong Cheng Tsai
    • H02H3/00
    • H02H9/025H02H9/041
    • An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of the OVP device is electrically connected to a third connection point, and the other end is electrically connected to the second connection point. The second connection point is a common point. The OCP device and the OVP device are modularized and integrated to an assembly. The first, second, and third connection points are connected to an external circuit to be protected, such that the OCP device is connected in series to the circuit to be protected, and the OVP device is connected in parallel to the circuit to be protected.
    • 提供了包括过电流保护(OCP)装置和过压保护(OVP)装置)的过电流和过电压保护组装装置。 OCP装置的一端电连接到第一连接点,另一端电连接到第二连接点。 OVP器件的一端电连接到第三连接点,另一端电连接到第二连接点。 第二个连接点是一个共同点。 OCP设备和OVP设备被模块化并集成到组件中。 第一,第二和第三连接点连接到要被保护的外部电路,使得OCP设备与要保护的电路串联连接,并且OVP设备与待保护的电路并联连接。
    • 3. 发明申请
    • VARIABLE IMPEDANCE COMPOSITION
    • 可变阻抗组成
    • US20090224213A1
    • 2009-09-10
    • US12043550
    • 2008-03-06
    • Pao Hsuan ChenDavid Shau Chew WangChing Han YuTong Cheng Tsai
    • Pao Hsuan ChenDavid Shau Chew WangChing Han YuTong Cheng Tsai
    • H01B1/08H01B1/02H01B1/12
    • H01C7/10H01C7/105H01C7/108
    • A variable impedance composition according to this aspect of the present invention comprises a conductive powder in an amount from 10% to 30% of the weight of the variable impedance composition, a semi-conductive power in an amount from 30% to 90% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 3% to 50% of the weight of the variable impedance composition. According to one embodiment of the present invention, the variable impedance material presents a high resistance at a low applied voltage and a low resistance at a high applied voltage. As the variable impedance material is positioned in a gap between two conductors of an over-voltage protection device, the over-voltage protection device as a whole presents a high resistance to a low voltage applied across the gap and a low resistance to a high voltage applied across the gap.
    • 根据本发明的该方面的可变阻抗组合物包含导电粉末的量为可变阻抗组合物重量的10%至30%,半导电功率为30%至90% 可变阻抗组合物的重量以及可变阻抗组合物的重量的3%至50%的量的绝缘粘合剂。 根据本发明的一个实施例,可变阻抗材料在低施加电压下呈现高电阻,并且在高施加电压下呈现低电阻。 由于可变阻抗材料位于过电压保护装置的两个导体之间的间隙中,因此整个过电压保护装置对跨越间隙施加的低电压具有高电阻,并且对高电压具有低电阻 应用于差距。
    • 4. 发明申请
    • OVER-CURRENT AND OVER-VOLTAGE PROTECTION ASSEMBLY APPARATUS
    • 过流和过压保护装置
    • US20080100981A1
    • 2008-05-01
    • US11857839
    • 2007-09-19
    • Pao Hsuan CHENChing Han YuTong Cheng Tsai
    • Pao Hsuan CHENChing Han YuTong Cheng Tsai
    • H02H3/26
    • H02H9/025H02H9/041
    • An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of the OVP device is electrically connected to a third connection point, and the other end is electrically connected to the second connection point. The second connection point is a common point. The OCP device and the OVP device are modularized and integrated to an assembly. The first, second, and third connection points are connected to an external circuit to be protected, such that the OCP device is connected in series to the circuit to be protected, and the OVP device is connected in parallel to the circuit to be protected.
    • 提供了包括过电流保护(OCP)装置和过压保护(OVP)装置)的过电流和过电压保护组装装置。 OCP装置的一端电连接到第一连接点,另一端电连接到第二连接点。 OVP器件的一端电连接到第三连接点,另一端电连接到第二连接点。 第二个连接点是一个共同点。 OCP设备和OVP设备被模块化并集成到组件中。 第一,第二和第三连接点连接到要被保护的外部电路,使得OCP设备与要保护的电路串联连接,并且OVP设备与待保护的电路并联连接。
    • 7. 发明申请
    • PROTECTIVE CIRCUIT BOARD AND OVERCURRENT PROTECTION DEVICE THEREOF
    • 保护电路板及其过流保护装置
    • US20080253050A1
    • 2008-10-16
    • US11923741
    • 2007-10-25
    • Ching Han YuDavid Shau Chew WangPao Hsuan Chen
    • Ching Han YuDavid Shau Chew WangPao Hsuan Chen
    • H02H5/04H02H3/08
    • H01C7/02H01C1/01H01C1/1406H01M10/425H01M10/48H01M2200/106
    • The over-current protection device of the present invention can be used for over-current protection to PCM. The over-current protection device comprises a PTC device, at least one insulation layer; at least one electrode layer and at least one conductive channel. The insulation layer is placed on a surface of the PTC device, and the electrode layer is formed on the insulation layer afterwards. As a result, the insulation layer is between the electrode layer and the PTC device. The electrode layer serves as a surface of the over-current protection device. The conductive channel electrically connects the PTC device and the electrode layer. In an embodiment, the conductive channel is a blind hole penetrating through the electrode layer and the insulation layer and ending at the surface of the PTC device, and the surface of the blind hole is coated with a conductive layer to electrically connect the PTC device and the electrode layer.
    • 本发明的过电流保护装置可用于PCM的过电流保护。 过电流保护装置包括PTC器件,至少一个绝缘层; 至少一个电极层和至少一个导电通道。 绝缘层放置在PTC器件的表面上,之后在绝缘层上形成电极层。 结果,绝缘层位于电极层和PTC器件之间。 电极层用作过电流保护装置的表面。 导电通道电连接PTC器件和电极层。 在一个实施例中,导电通道是贯穿电极层和绝缘层并终止于PTC器件表面的盲孔,并且盲孔的表面涂覆有导电层以将PTC器件和 电极层。
    • 9. 发明授权
    • Protective circuit board and overcurrent protection device thereof
    • 保护电路板及其过流保护装置
    • US07852192B2
    • 2010-12-14
    • US11923741
    • 2007-10-25
    • Ching Han YuDavid Shau Chew WangPao Hsuan Chen
    • Ching Han YuDavid Shau Chew WangPao Hsuan Chen
    • H01C7/10
    • H01C7/02H01C1/01H01C1/1406H01M10/425H01M10/48H01M2200/106
    • The over-current protection device of the present invention can be used for over-current protection to PCM. The over-current protection device comprises a PTC device, at least one insulation layer; at least one electrode layer and at least one conductive channel. The insulation layer is placed on a surface of the PTC device, and the electrode layer is formed on the insulation layer afterwards. As a result, the insulation layer is between the electrode layer and the PTC device. The electrode layer serves as a surface of the over-current protection device. The conductive channel electrically connects the PTC device and the electrode layer. In an embodiment, the conductive channel is a blind hole penetrating through the electrode layer and the insulation layer and ending at the surface of the PTC device, and the surface of the blind hole is coated with a conductive layer to electrically connect the PTC device and the electrode layer.
    • 本发明的过电流保护装置可用于PCM的过电流保护。 过电流保护装置包括PTC器件,至少一个绝缘层; 至少一个电极层和至少一个导电通道。 绝缘层放置在PTC器件的表面上,之后在绝缘层上形成电极层。 结果,绝缘层位于电极层和PTC器件之间。 电极层用作过电流保护装置的表面。 导电通道电连接PTC器件和电极层。 在一个实施例中,导电通道是贯穿电极层和绝缘层并终止于PTC器件表面的盲孔,并且盲孔的表面涂覆有导电层以将PTC器件和 电极层。