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    • 1. 发明申请
    • THERMOELECTRIC MODULE DEVICE AND HEAT EXCHANGER USED THEREIN
    • 热电模块装置和热交换器
    • US20090301540A1
    • 2009-12-10
    • US12468592
    • 2009-05-19
    • Yuma Horio
    • Yuma Horio
    • H01L35/30F25B21/02
    • H01L35/32H01L35/30
    • A thermoelectric module device absorbs heat from the hot side, and transfers the heat to the cold side; the thermoelectric module device is constituted by a heat sink on the hot side, another heat sink on the cold side and a series of Peltier elements, and the series of Peltier elements is formed from pairs of semiconductor elements of different conductivity types, endoergic metal electrodes and exoergic metal electrodes; since the entire major surfaces of heat sinks are not available for the endoergic metal electrodes and exoergic metal electrodes due to fitting holes and vapor-proof sealing walls, the ratio of area occupied with the metal electrodes to available area and the ratio of area not available for the metal electrodes to entire major surface are not less than 50% and not greater than 20%.
    • 热电模块装置从热侧吸收热量,并将热量传递到冷侧; 热电模块装置由热侧的散热器,冷侧的另一个散热器和一系列珀耳帖元件构成,并且该系列的珀耳帖元件由成对的不同导电类型的半导体元件,耐热金属电极 和散热金属电极; 由于散热器的整个主表面由于安装孔和防蒸气密封壁而不能用于耐热金属电极和散热金属电极,所以与金属电极占据的面积与可用面积的比率以及不可用的面积比率 对于整个主表面的金属电极不小于50%且不大于20%。