专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07943844B2 Thermoelectric module and manufacturing method for same 有权
标题翻译：热电模块及其制造方法相同
公开(公告)号：US07943844B2
公开(公告)日：2011-05-17
申请号：US11351117
申请日：2006-02-10
申请人： Hidetoshi Yasutake
发明人： Hidetoshi Yasutake
IPC分类号： H01L35/28
CPC分类号： H01L35/08
摘要： A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.
摘要翻译：一种热电模块及其制造方法，其能够防止由焊料引起的电极之间的短路，而不会导致尺寸或成本的增加。热电模块配置有在下基板的内表面上形成有与上基板相对置的下电极，其内表面形成上电极; 热电元件的端面焊接到下电极和上电极。每个电极由铜层，形成在铜层的一个面上的镍层和形成在镍层的一个表面上的金层的三层构成; 在镍层中形成向外突出的遮阳板部分，从而当将热电元件定位在电极上方并将电极焊接到热电元件上时，防止焊料18a从电极的侧部流向绝缘基板。

2. 发明申请

US20070175506A1 THERMOELECTRIC MODULE, METHOD OF FORMING A THERMOELECTRIC ELEMENT, AND METHOD OF THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块，形成热电元件的方法和热电模块的方法
公开(公告)号：US20070175506A1
公开(公告)日：2007-08-02
申请号：US11623982
申请日：2007-01-17
申请人： Yuma Horio , Hidetoshi Yasutake
发明人： Yuma Horio , Hidetoshi Yasutake
IPC分类号： H01L35/12 , H01L35/34
CPC分类号： H01L35/32 , H01L35/34
摘要： A method of forming thermoelectric elements includes introducing a molten thermoelectric-material in a plurality of holes of a mold, and solidifying the molten thermoelectric-material in the plurality of holes, thereby forming a plurality of thermoelectric elements in the plurality of holes without wafer-slicing process or chip-dicing process.
摘要翻译：形成热电元件的方法包括将熔融的热电材料引入模具的多个孔中，并使多个孔中的熔融热电材料固化，从而在多个孔中形成多个热电元件，切片工艺或芯片切割工艺。

3. 发明申请

US20070125411A1 THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块
公开(公告)号：US20070125411A1
公开(公告)日：2007-06-07
申请号：US11567090
申请日：2006-12-05
申请人： HIDETOSHI YASUTAKE
发明人： HIDETOSHI YASUTAKE
IPC分类号： H01L35/00
CPC分类号： H05K3/46 , H01L35/08 , H01L35/32 , Y10T29/49155
摘要： A thermoelectric module may include a first substrate having a mounting portion and an extension portion and a second substrate facing to the mounting portion. First electrodes are disposed on the mounting portion and have a first surface layer of gold. Second electrodes are disposed on the second substrate and have a second surface layer of gold. Thermoelectric elements are electrically bonded between the first and second arrays of electrodes by solder. A bonding layer is disposed on the extension portion and has a third surface layer of gold. The first surface layer of gold is distanced by a gap from the first surface layer of gold. A metal layer underlies the gap. The metal layer has a solder-wettability that is lower than that of the first and third surface layers of gold.
摘要翻译：热电模块可以包括具有安装部分和延伸部分的第一基板和面向安装部分的第二基板。第一电极设置在安装部分上并且具有金的第一表面层。第二电极设置在第二基板上并具有金的第二表面层。热电元件通过焊料电连接在第一和第二电极阵列之间。接合层设置在延伸部分上并具有金的第三表面层。金的第一表面层与金的第一表面层的间隙隔开。金属层位于间隙之上。金属层的焊料润湿性低于金的第一和第三表面层的焊料润湿性。

4. 发明授权

US08084191B2 Thermoelectric module and manufacturing method for same 有权
公开(公告)号：US08084191B2
公开(公告)日：2011-12-27
申请号：US12580186
申请日：2009-10-15
申请人： Hidetoshi Yasutake
发明人： Hidetoshi Yasutake
IPC分类号： H01L35/34
CPC分类号： H01L35/08
摘要： A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.

5. 发明申请

US20060180191A1 Thermoelectric module and manufacturing method for same 有权
标题翻译：热电模块及其制造方法相同
公开(公告)号：US20060180191A1
公开(公告)日：2006-08-17
申请号：US11351117
申请日：2006-02-10
申请人： Hidetoshi Yasutake
发明人： Hidetoshi Yasutake
IPC分类号： H01L37/00 , H01L35/34 , H01L35/30 , H01L35/28
CPC分类号： H01L35/08
摘要： A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.
摘要翻译：一种热电模块及其制造方法，其能够防止由焊料引起的电极之间的短路，而不会导致尺寸或成本的增加。热电模块配置有在下基板的内表面上形成有与上基板相对置的下电极，其内表面形成上电极; 热电元件的端面焊接到下电极和上电极。每个电极由铜层，形成在铜层的一个面上的镍层和形成在镍层的一个表面上的金层的三层构成; 在镍层中形成向外突出的面板部分，使得当将电极元件放置在电极上方并将电极焊接到热电元件上时，焊料18a从电极的侧部流向绝缘基板是防止了

6. 发明授权

US06942399B2 Optical fiber coupler reinforcing member and optical fiber coupler 失效
标题翻译：光纤耦合器加强件和光纤耦合器
公开(公告)号：US06942399B2
公开(公告)日：2005-09-13
申请号：US10603783
申请日：2003-06-26
申请人： Nanayuki Takeuchi , Toshiharu Hoshi , Kenzaburou Iijima , Hidetoshi Yasutake , Yoshikazu Ishii , Satoru Tomaru , BooSeok Hwang
发明人： Nanayuki Takeuchi , Toshiharu Hoshi , Kenzaburou Iijima , Hidetoshi Yasutake , Yoshikazu Ishii , Satoru Tomaru , BooSeok Hwang
IPC分类号： G02B6/287 , G02B6/28 , G02B6/36 , G02B6/255
CPC分类号： G02B6/3636 , G02B6/2821
摘要： An optical fiber coupler reinforcing member comprises an approximately rectangular member formed by a hard material, and has a flat surface along the longitudinal direction thereof. In addition, the shape thereof in cross-section is a hexagonal shape which inscribes a cylindrical member. Furthermore, a recess having a U-shaped cross-section is formed in the longitudinal direction of the above-mentioned approximately rectangular member and houses coupling section. The coupling section housed within the recess is fixed at both ends of the recess by an adhesive or the like. In addition, both ends of the inner wall surface of the recess have been given bevel sections. As a result, the optical fiber coupler reinforcing member having high reliability at low cost, with which the strength with respect to external force is improved and with which processability and the assembly operations of the optical fiber coupler are easy, are provided.
摘要翻译：一种光纤耦合器加强件包括由硬质材料形成的大致矩形的部件，并且沿着其长度方向具有平坦的表面。此外，其截面形状是一个六边形形状，其内嵌有圆柱形构件。此外，在上述近似矩形构件的纵向方向上形成具有U形横截面的凹部，并且容纳联接部。容纳在凹部内的联接部通过粘合剂等固定在凹部的两端。此外，凹部的内壁表面的两端已经被给予斜面部分。结果，提供了具有高成本的高可靠性的光纤耦合器加强构件，其中相对于外力的强度得到改善，并且光纤耦合器的加工性和组装操作容易。

7. 发明申请

US20100096357A1 THERMOELECTRIC MODULE AND MANUFACTURING METHOD FOR SAME 有权
标题翻译：热电模块及其制造方法
公开(公告)号：US20100096357A1
公开(公告)日：2010-04-22
申请号：US12580186
申请日：2009-10-15
申请人： HIDETOSHI YASUTAKE
发明人： HIDETOSHI YASUTAKE
IPC分类号： B44C1/22 , H01L35/34
CPC分类号： H01L35/08
摘要： A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.
摘要翻译：一种热电模块及其制造方法，其能够防止由焊料引起的电极之间的短路，而不会导致尺寸或成本的增加。热电模块配置有在下基板的内表面上形成有与上基板相对置的下电极，其内表面形成上电极; 热电元件的端面焊接到下电极和上电极。每个电极由铜层，形成在铜层的一个面上的镍层和形成在镍层的一个表面上的金层的三层构成; 在镍层中形成向外突出的面板部分，使得当将电极元件放置在电极上方并将电极焊接到热电元件上时，阻止焊料18a从电极侧部流到绝缘基板的流动。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式