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1. 发明授权

US09024341B2 Refractive index tuning of wafer level package LEDs 有权
$Refractive index tuning of wafer level package LEDs$
标题翻译：晶圆级封装LED的折射率调谐
公开(公告)号：US09024341B2
公开(公告)日：2015-05-05
申请号：US12912900
申请日：2010-10-27
申请人： Hsiao-Wen Lee , Shang-Yu Tsai , Tien-Ming Lin , Chyi Shyuan Chern , Hsin-Hsien Wu , Fu-Wen Liu , Huai-En Lai , Yu-Sheng Tang
发明人： Hsiao-Wen Lee , Shang-Yu Tsai , Tien-Ming Lin , Chyi Shyuan Chern , Hsin-Hsien Wu , Fu-Wen Liu , Huai-En Lai , Yu-Sheng Tang
IPC分类号： H01L33/00 , H01L33/54 , H01L33/44 , H01L33/50 , H01L33/56
CPC分类号： H01L33/54 , H01L33/44 , H01L33/504 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2924/0002 , H01L2924/1305 , H01L2924/13091 , H01L2933/005 , H01L2924/00 , H01L2924/00014
摘要： Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.
摘要翻译：在封装的LED模具上形成两个或多个模制的椭圆体透镜，该胶片通过将胶料注入到LED模具中的模具中并固化胶料。固化后，与LED芯片接触的透镜的折射率大于不直接接触LED芯片的透镜的折射率。对于不直接接触LED管芯的透镜中的至少一个，将至少一种磷光体材料结合到胶合材料中。直接接触LED芯片的透镜还可以包括一种或多种荧光体材料。可以在LED管芯和透镜之间施加高折射率涂层。

2. 发明授权

US08486724B2 Wafer level reflector for LED packaging 有权
标题翻译：晶圆级反射器用于LED封装
公开(公告)号：US08486724B2
公开(公告)日：2013-07-16
申请号：US12910363
申请日：2010-10-22
申请人： Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
发明人： Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Ming Lin , Shang-Yu Tsai
IPC分类号： H01L21/00
CPC分类号： H01L27/15 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/10253 , H01L2924/12035 , H01L2924/12041 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
摘要翻译：通过将发光二极管（LED）裸片结合到封装晶片，电连接LED管芯和封装晶片，在封装晶片上的LED管芯上形成荧光体涂层，在LED上模制透镜来制造光发射器在封装晶片上模制，在封装晶片上模制反射器，并将晶片切割成至少一个光发射器。

3. 发明申请

US20090267488A1 Wavelength converting material and use of same 有权
标题翻译：波长转换材料及其用途
公开(公告)号：US20090267488A1
公开(公告)日：2009-10-29
申请号：US12453014
申请日：2009-04-28
申请人： Yu-Sheng Tang , Ru-Shi Liu , Shu-Fen Hu , Chien-Yuan Wang
发明人： Yu-Sheng Tang , Ru-Shi Liu , Shu-Fen Hu , Chien-Yuan Wang
IPC分类号： H01J1/62 , C09K11/55 , C09K11/61 , C01F7/50
CPC分类号： C09K11/7734 , C01F7/002 , C09K11/7739 , Y02B20/181
摘要： This invention discloses a wavelength converting material. The wavelength converting material comprises a metal haloaluminate compound phosphor with a chemical formula Mw-pAlyOzXq:Rp, wherein M is at least one element selected from the group of Be, Mg, Ca, Sr, Ba and Zn; X is at least one element selected from the group of F, Cl, Br, and I; R is one or more elements selected from the group of the transition metals and at least one element selected from the lanthanide series. Because the emitting wavelength of the metal haloaluminate compound phosphor is 550˜650 nm which is from the green to the red light spectrum, the white light mixed by the converted light of the metal haloaluminate phosphor and the blue light has better color rendering index. Besides, this invention also discloses the optoelectronic devices comprising the metal haloaluminate compound phosphor.
摘要翻译：本发明公开了一种波长转换材料。波长转换材料包括化学式为Mw-pAlyOzXq：Rp的卤化铝酸盐化合物荧光体，其中M为选自Be，Mg，Ca，Sr，Ba和Zn中的至少一种元素; X是选自F，Cl，Br和I的至少一种元素; R是选自过渡金属和至少一种选自镧系元素的元素中的一种或多种元素。由于卤化铝酸盐化合物的荧光体的发光波长为从绿色到红色光谱的550〜650nm，由卤化铝酸盐荧光体和蓝色光的转换光混合的白色光具有更好的显色指数。此外，本发明还公开了包含金属卤代铝酸盐化合物荧光体的光电器件。

4. 发明授权

US08754440B2 Light-emitting diode (LED) package systems and methods of making the same 有权
标题翻译：发光二极管（LED）封装系统及其制造方法
公开(公告)号：US08754440B2
公开(公告)日：2014-06-17
申请号：US13053607
申请日：2011-03-22
申请人： Yu-Sheng Tang , Hsin-Hung Chen , Hao-Wei Ku
发明人： Yu-Sheng Tang , Hsin-Hung Chen , Hao-Wei Ku
IPC分类号： H01L33/50 , H01L33/52 , H01L33/54
CPC分类号： H01L33/505 , H01L24/73 , H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/507 , H01L33/54 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1305 , H01L2924/15788 , H01L2924/1815 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012 , H01L2224/85 , H01L2924/00
摘要： A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.
摘要翻译：发光二极管（LED）封装系统包括设置在衬底的表面上的LED。成型材料覆盖LED。含有荧光体的材料通过模塑材料设置在LED的上方并与LED间隔开。

5. 发明申请

US20140091329A1 LED Emitter with Improved White Color Appearance 有权
标题翻译： LED发光体，具有改善的白色外观
公开(公告)号：US20140091329A1
公开(公告)日：2014-04-03
申请号：US13629677
申请日：2012-09-28
申请人： Hsiao-Wen Lee , Chi-Xiang Tseng , Yu-Sheng Tang , Jung-Tang Chu
发明人： Hsiao-Wen Lee , Chi-Xiang Tseng , Yu-Sheng Tang , Jung-Tang Chu
IPC分类号： H01L33/44
CPC分类号： H01L33/50 , F21K9/00 , F21K9/90 , F21S6/00 , F21V29/74 , F21Y2101/00 , F21Y2115/10 , H01L25/0753 , H01L33/56 , H01L33/644 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board substrate. The lighting instrument includes a plurality of light-emitting diode (LED) dies disposed on the substrate. The LED dies are spaced apart from one another. Each LED die is covered with a respective individual phosphor coating that is coated around the LED die conformally. Due at least in part to the individual phosphor coatings, the LED dies and the lighting instrument may assume a substantially white appearance in an off state. The lighting instrument also includes an encapsulation structure disposed over the substrate. The encapsulation structure may be a diffuser cap that encapsulates the light-emitting dies within. A diffuser gel fills the space between the encapsulation structure and the LED dies.
摘要翻译：本公开涉及一种照明器具。照明器具包括板或基板，例如印刷电路板基板。照明器具包括设置在基板上的多个发光二极管（LED）管芯。 LED管芯彼此间隔开。每个LED管芯被相应的单独的磷光体涂层覆盖，所述磷光体涂层被保持在LED管周围。至少部分地由于单独的磷光体涂层，LED管芯和照明器具可能在断开状态下呈现基本上白色的外观。照明器具还包括设置在衬底上的封装结构。封装结构可以是将发光管封装在其内的扩散器盖。扩散器凝胶填充封装结构和LED管芯之间的空间。

6. 发明申请

US20120299017A1 BATWING LED WITH REMOTE PHOSPHOR CONFIGURATION 有权
标题翻译：带远程磷光体配置的LED灯
公开(公告)号：US20120299017A1
公开(公告)日：2012-11-29
申请号：US13114730
申请日：2011-05-24
申请人： Ching-Yi CHEN , Yu-Sheng TANG , Hao-Yu YANG , Hsin-Hung CHEN , Tzu-Wen SHIH
发明人： Ching-Yi CHEN , Yu-Sheng TANG , Hao-Yu YANG , Hsin-Hung CHEN , Tzu-Wen SHIH
IPC分类号： H01L33/08 , H01L33/60
CPC分类号： H01L33/58 , F21K9/64 , F21V13/02 , F21V13/14 , H01L25/0753 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2924/00 , H01L2924/00012
摘要： An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.
摘要翻译： LED发射器使用具有嵌入在周向沟槽中的磷光体材料的模制透镜来产生蝙蝠光束图案。在将透镜模制在其上具有连接的LED管的封装衬底上之后，将荧光体材料模制，注入或分配到周向沟槽中。模制的透镜被成形为使得由一个或多个LED管芯发射的大部分光被顶表面反射通过荧光体材料的侧表面。

7. 发明申请

US20120104435A1 REFRACTIVE INDEX TUNING OF WAFER LEVEL PACKAGE LEDS 有权
标题翻译：水平包装LED的折射率调整
公开(公告)号：US20120104435A1
公开(公告)日：2012-05-03
申请号：US12912900
申请日：2010-10-27
申请人： Hsiao-Wen LEE , Shang-Yu TSAI , Tien-Ming LIN , Chyi Shyuan CHERN , Hsin-Hsien WU , Fu-Wen LIU , Huai-En LAI , Yu-Sheng TANG
发明人： Hsiao-Wen LEE , Shang-Yu TSAI , Tien-Ming LIN , Chyi Shyuan CHERN , Hsin-Hsien WU , Fu-Wen LIU , Huai-En LAI , Yu-Sheng TANG
IPC分类号： H01L33/50 , H01L23/24
CPC分类号： H01L33/54 , H01L33/44 , H01L33/504 , H01L33/507 , H01L33/56 , H01L2224/48091 , H01L2924/0002 , H01L2924/1305 , H01L2924/13091 , H01L2933/005 , H01L2924/00 , H01L2924/00014
摘要： Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.
摘要翻译：在封装的LED模具上形成两个或多个模制的椭圆体透镜，该胶片通过将胶料注入到LED模具中的模具中并固化胶料。固化后，与LED芯片接触的透镜的折射率大于不直接接触LED芯片的透镜的折射率。对于不直接接触LED管芯的透镜中的至少一个，将至少一种磷光体材料结合到胶合材料中。直接接触LED芯片的透镜还可以包括一种或多种荧光体材料。可以在LED管芯和透镜之间施加高折射率涂层。

8. 发明授权

US08497519B2 Batwing LED with remote phosphor configuration 有权
标题翻译：蝙蝠LED与远程荧光粉配置
公开(公告)号：US08497519B2
公开(公告)日：2013-07-30
申请号：US13114730
申请日：2011-05-24
申请人： Ching-Yi Chen , Yu-Sheng Tang , Hao-Yu Yang , Hsin-Hung Chen , Tzu-Wen Shih
发明人： Ching-Yi Chen , Yu-Sheng Tang , Hao-Yu Yang , Hsin-Hung Chen , Tzu-Wen Shih
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , F21K9/64 , F21V13/02 , F21V13/14 , H01L25/0753 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2924/00 , H01L2924/00012
摘要： An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.
摘要翻译： LED发射器使用具有嵌入在周向沟槽中的磷光体材料的模制透镜来产生蝙蝠光束图案。在将透镜模制在其上具有连接的LED管的封装衬底上之后，将荧光体材料模制，注入或分配到周向沟槽中。模制的透镜被成形为使得由一个或多个LED管芯发射的大部分光被顶表面反射通过荧光体材料的侧表面。

9. 发明授权

US08496353B2 Light-emitting diode (LED) module with light sensor configurations for optical feedback 有权
标题翻译：具有光传感器配置的发光二极管（LED）模块，用于光学反馈
公开(公告)号：US08496353B2
公开(公告)日：2013-07-30
申请号：US12881566
申请日：2010-09-14
申请人： Yu-Sheng Tang , Yi-Tsuo Wu
发明人： Yu-Sheng Tang , Yi-Tsuo Wu
IPC分类号： F21V33/00 , F21V9/00 , H05B37/02
CPC分类号： H01L33/60 , H01L2224/48091 , H01L2924/1305 , H01L2924/13091 , H05B33/0869 , H01L2924/00014 , H01L2924/00
摘要： An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.
摘要翻译：本公开的实施例包括LED模块。提供基板。光传感器位于基板中。 LED芯片附着在基板上。 LED芯片具有第一面和第二面。第二面被具有开口的不透明层覆盖。开口基本上与光传感器对准。光传感器通过开口接收从LED芯片发出的光输出。

10. 发明申请

US20120062113A1 LIGHT-EMITTING DIODE (LED) MODULE WITH LIGHT SENSOR CONFIGURATIONS FOR OPTICAL FEEDBACK 有权
标题翻译：具有光传感器配置的发光二极管（LED）模块，用于光纤反馈
公开(公告)号：US20120062113A1
公开(公告)日：2012-03-15
申请号：US12881566
申请日：2010-09-14
申请人： Yu-Sheng TANG , Yi-Tsuo WU
发明人： Yu-Sheng TANG , Yi-Tsuo WU
IPC分类号： F21V23/00 , H01J9/00 , H05B37/02
CPC分类号： H01L33/60 , H01L2224/48091 , H01L2924/1305 , H01L2924/13091 , H05B33/0869 , H01L2924/00014 , H01L2924/00
摘要： An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.
摘要翻译：本公开的实施例包括LED模块。提供基板。光传感器位于基板中。 LED芯片附着在基板上。 LED芯片具有第一面和第二面。第二面被具有开口的不透明层覆盖。开口基本上与光传感器对准。光传感器通过开口接收从LED芯片发出的光输出。

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