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1. 发明授权

US08500331B2 Hybrid air foil bearing and method of manufacture 有权
标题翻译：混合气垫轴承及其制造方法
公开(公告)号：US08500331B2
公开(公告)日：2013-08-06
申请号：US12694262
申请日：2010-01-26
申请人： Daejong Kim , An Sung Lee , Young-Cheol Kim
发明人： Daejong Kim , An Sung Lee , Young-Cheol Kim
IPC分类号： F16C32/06 , F16C27/02
CPC分类号： F16C17/024 , F16C43/02 , Y10T29/49639
摘要： An air foil bearing includes a top foil, one or more orifice tubes and two or more bump foil strips disposed within a housing. The top foil is forms a substantially circular shape having one or more sets of top foil orifice holes. Each set of top foil orifice holes has at least three top foil orifice holes along a circumference of the top foil. An orifice tube is provided for each set of top foil orifice holes. The orifice tube includes a flat side having a set of tube orifice holes connected to an outer surface of the top foil. The bump foil strip is attached to the outer surface of the top foil adjacent to each side of each orifice tube. Another embodiment uses a housing with an inner surface having a curved polygonal cross-sectional shape with an odd number of curved sides.
摘要翻译：一种空气箔轴承包括顶部箔片，一个或多个孔口管和设置在壳体内的两个或更多个凸起箔条。顶部箔片形成具有一组或多组顶部箔孔孔的基本圆形形状。每组顶部的箔片孔口沿着顶部箔片的圆周具有至少三个顶部箔片孔口孔。为每组顶部的箔孔孔提供孔管。孔口管包括具有连接到顶部箔的外表面的一组管孔的平坦侧。凸块箔条附着在与每个孔管的每一侧相邻的顶部箔片的外表面上。另一实施例使用具有弯曲多边形横截面形状的具有奇数个弯曲侧面的内表面的壳体。

2. 发明申请

US20120247403A1 INSTANTANEOUS HOT-WATER SYSTEM 审中-公开
标题翻译：瞬时热水系统
公开(公告)号：US20120247403A1
公开(公告)日：2012-10-04
申请号：US13432428
申请日：2012-03-28
申请人： Won-Ki IM , Young-Cheol KIM
发明人： Won-Ki IM , Young-Cheol KIM
IPC分类号： F24H9/00 , F24H9/20
CPC分类号： F24H9/2014 , F24D3/02 , F24D2200/08 , F24H1/101 , F24H3/004
摘要： Disclosed is a hot-water system including a water tank with a water inlet and a water outlet for storing air-conditioning water; a pump motor, connected to the water outlet of the water tank through a connection pipe at one end thereof, circulating the air-conditioning water in the water tank by a pumping operation; an instantaneous water heater, connected to the other end of the pump motor by a connection pipe, instantaneously heating the air-conditioning water being circulated by the pumping operation of the pump motor; and an air-conditioning member, connected to both of the instantaneous water heater and the water tank to form an air-conditioning fluid path of a closed loop and guide the flow of the air-conditioning water; wherein the surface temperature of the air-conditioning member is increased by the heat of the air-conditioning water heated by the instantaneous water heater.
摘要翻译：公开了一种热水系统，包括具有进水口的水箱和用于储存空调水的出水口; 一个泵电机，通过其一端的连接管连接到水箱的出水口，通过泵送操作使空调水在水箱中循环; 通过连接管连接到泵电动机的另一端的瞬时热水器，通过泵电动机的泵送操作瞬时加热正在循环的空调水; 以及连接到瞬时热水器和水箱两者的空调构件，以形成闭环的空调流体路径并引导空调水的流动; 其中通过由瞬时热水器加热的空调水的热量来增加空调部件的表面温度。

3. 发明申请

US20110033142A1 HYBRID AIR FOIL BEARING AND METHOD OF MANUFACTURE 有权
标题翻译：混合空气轴承及其制造方法
公开(公告)号：US20110033142A1
公开(公告)日：2011-02-10
申请号：US12694262
申请日：2010-01-26
申请人： Daejong Kim , An Sung Lee , Young-Cheol Kim
发明人： Daejong Kim , An Sung Lee , Young-Cheol Kim
IPC分类号： F16C32/06 , B21D53/10
CPC分类号： F16C17/024 , F16C43/02 , Y10T29/49639
摘要： An air foil bearing includes a top foil, one or more orifice tubes and two or more bump foil strips disposed within a housing. The top foil is forms a substantially circular shape having one or more sets of top foil orifice holes. Each set of top foil orifice holes has at least three top foil orifice holes along a circumference of the top foil. An orifice tube is provided for each set of top foil orifice holes. The orifice tube includes a flat side having a set of tube orifice holes connected to an outer surface of the top foil. The bump foil strip is attached to the outer surface of the top foil adjacent to each side of each orifice tube. Another embodiment uses a housing with an inner surface having a curved polygonal cross-sectional shape with an odd number of curved sides.
摘要翻译：一种空气箔轴承包括顶部箔片，一个或多个孔口管和设置在壳体内的两个或更多个凸起箔条。顶部箔片形成具有一组或多组顶部箔孔孔的基本圆形形状。每组顶部的箔片孔口沿着顶部箔片的圆周具有至少三个顶部箔片孔口孔。为每组顶部的箔孔孔提供孔管。孔口管包括具有连接到顶部箔的外表面的一组管孔的平坦侧。凸块箔条附着在与每个孔管的每一侧相邻的顶部箔片的外表面上。另一实施例使用具有弯曲多边形横截面形状的具有奇数个弯曲侧面的内表面的壳体。

4. 发明授权

US07861059B2 Method for testing and programming memory devices and system for same 有权
标题翻译：用于测试和编程存储器件和系统的方法
公开(公告)号：US07861059B2
公开(公告)日：2010-12-28
申请号：US11051325
申请日：2005-02-03
申请人： Paul Magliocco , Young Cheol Kim , Richard Mark Greene , John M. Holmes
发明人： Paul Magliocco , Young Cheol Kim , Richard Mark Greene , John M. Holmes
IPC分类号： G06F12/00 , G06F13/00 , G06F13/28
CPC分类号： G11C29/56004 , G11C29/56 , G11C29/56008 , G11C29/76 , G11C2029/1806 , G11C2029/2602
摘要： A method and system are provided for programming a plurality of memory devices arranged in parallel. In one embodiment of the present invention, the plurality of memory devices comprises first and second memory devices, and the method comprises providing successively the first address to the first memory device and the second address to the second memory device. The first address refers to a first group of storage locations in the first memory device and the second address refers to a second group of storage locations in the second memory device. The method then proceeds to load in parallel a string of data to the first and second memory devices so that the string of data is written simultaneously to the first group of storage locations in the first memory device and to the second group of storage locations in the second memory device.
摘要翻译：提供了一种方法和系统，用于对并行布置的多个存储器件进行编程。在本发明的一个实施例中，多个存储器件包括第一和第二存储器件，并且该方法包括连续提供第一地址到第一存储器件，第二地址提供给第二存储器件。第一地址是指第一存储设备中的第一组存储位置，第二地址是指第二存储设备中的第二组存储位置。然后，该方法继续并行地将一串数据加载到第一和第二存储器设备，使得数据串被同时写入第一存储器设备中的第一组存储位置和第二组存储位置第二存储设备。

5. 发明授权

US07645638B2 Stackable multi-chip package system with support structure 有权
标题翻译：可堆叠多芯片封装系统，支持结构
公开(公告)号：US07645638B2
公开(公告)日：2010-01-12
申请号：US11462568
申请日：2006-08-04
申请人： Young Cheol Kim , Koo Hong Lee , Jae Hak Yee
发明人： Young Cheol Kim , Koo Hong Lee , Jae Hak Yee
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3135 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L25/105 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2225/06562 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stackable multi-chip package system is provided including forming an external interconnect, having a base and a tip, and a paddle; mounting a first integrated circuit die over the paddle; stacking a second integrated circuit die over the first integrated circuit die in a active side to active side configuration; connecting the first integrated circuit die and the base; connecting the second integrated circuit die and the base; and molding the first integrated circuit die, the second integrated circuit die, the paddle, and the external interconnect with the external interconnect partially exposed.
摘要翻译：提供了一种可堆叠的多芯片封装系统，包括形成具有基座和尖端的外部互连件和桨叶; 将第一集成电路管芯安装在所述桨上; 将第二集成电路管芯在有源侧的第一集成电路管芯上堆叠到主动侧构造; 连接第一集成电路管芯和基座; 连接第二集成电路管芯和基座; 并且第一集成电路管芯，第二集成电路管芯，焊盘和外部互连件与外部互连部分地露出成型。

6. 发明申请

US20070262473A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION 有权
标题翻译：集成电路封装系统具有嵌入式封装
公开(公告)号：US20070262473A1
公开(公告)日：2007-11-15
申请号：US11735397
申请日：2007-04-13
申请人： Choong Bin Yim , Young Cheol Kim
发明人： Choong Bin Yim , Young Cheol Kim
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L21/565 , H01L24/48 , H01L25/0657 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15331 , H01L2924/19041 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including providing a carrier, mounting an integrated circuit die on the carrier, connecting the integrated circuit die with the carrier, and forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress.
摘要翻译：提供了一种集成电路封装系统，包括提供载体，将集成电路管芯安装在载体上，将集成电路管芯与载体连接，以及在集成电路管芯上形成具有多倾斜侧的封装，以减少喷射应力。

7. 发明申请

US20070194463A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH L-SHAPED LEADFINGERS 有权
标题翻译：集成电路封装系统与L形引线
公开(公告)号：US20070194463A1
公开(公告)日：2007-08-23
申请号：US11677487
申请日：2007-02-21
申请人： Young Cheol Kim , Koo Hong Lee , Jae Hak Yee
发明人： Young Cheol Kim , Koo Hong Lee , Jae Hak Yee
IPC分类号： H01L23/28
CPC分类号： H01L23/3107 , H01L21/6835 , H01L23/49548 , H01L23/49575 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/05554 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/48472 , H01L2224/73215 , H01L2224/73265 , H01L2224/85001 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2225/06562 , H01L2225/06582 , H01L2225/1029 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first L-shaped leadfingers adjacent the single edge, connecting the die pads and the first L-shaped leadfingers, and encapsulating the die pads and portions of the first L-shaped leadfingers to form a first package.
摘要翻译：集成电路封装系统包括具有与第一集成电路管芯的单个边缘相邻的管芯焊盘的第一集成电路管芯，与单个边缘相邻形成第一L形引线管，连接管芯焊盘和第一L形引线管，以及封装所述管芯焊盘和所述第一L形引线管的部分以形成第一封装。

8. 发明申请

US20070194462A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING LANDS 有权
标题翻译：集成电路封装系统
公开(公告)号：US20070194462A1
公开(公告)日：2007-08-23
申请号：US11677477
申请日：2007-02-21
申请人： Young Cheol Kim , Koo Hong Lee
发明人： Young Cheol Kim , Koo Hong Lee
IPC分类号： H01L23/28
CPC分类号： H01L23/3107 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05554 , H01L2224/32145 , H01L2224/48091 , H01L2224/48247 , H01L2224/4917 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/06582 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first bonding lands adjacent the single edge, connecting the die pads and the first bonding lands, and encapsulating the die pads and a portion of the first bonding lands to form a first package.
摘要翻译：集成电路封装系统包括第一集成电路管芯，其具有仅与第一集成电路管芯的单个边缘相邻的管芯焊盘，形成与单个边缘相邻的第一焊接区域，连接管芯焊盘和第一焊接区域，以及封装管芯焊盘并且所述第一结合区域的一部分形成第一包装。

9. 发明授权

US08471374B2 Integrated circuit package system with L-shaped leadfingers 有权
标题翻译：具有L形引线管的集成电路封装系统
公开(公告)号：US08471374B2
公开(公告)日：2013-06-25
申请号：US11677487
申请日：2007-02-21
申请人： Young Cheol Kim , Koo Hong Lee , Jae Hak Yee
发明人： Young Cheol Kim , Koo Hong Lee , Jae Hak Yee
IPC分类号： H01L23/3121 , H01L24/49 , H01L25/0657
CPC分类号： H01L23/3107 , H01L21/6835 , H01L23/49548 , H01L23/49575 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/05554 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/48472 , H01L2224/73215 , H01L2224/73265 , H01L2224/85001 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2225/06562 , H01L2225/06582 , H01L2225/1029 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first L-shaped leadfingers adjacent the single edge, connecting the die pads and the first L-shaped leadfingers, and encapsulating the die pads and portions of the first L-shaped leadfingers to form a first package.
摘要翻译：集成电路封装系统包括具有与第一集成电路管芯的单个边缘相邻的管芯焊盘的第一集成电路管芯，与单个边缘相邻形成第一L形引线管，连接管芯焊盘和第一L形引线管，以及封装所述管芯焊盘和所述第一L形引线管的部分以形成第一封装。

10. 发明申请

US20130137107A1 RAPID NUCLEIC ACID PURIFICATION 有权
标题翻译：快速核酸净化
公开(公告)号：US20130137107A1
公开(公告)日：2013-05-30
申请号：US13698112
申请日：2011-12-27
申请人： Minsu Ko , Young Cheol Kim , Siseok Lee
发明人： Minsu Ko , Young Cheol Kim , Siseok Lee
IPC分类号： C07H21/00 , C12Q1/68
CPC分类号： C12N15/101 , C07H21/00 , C12N15/1003 , C12Q1/6806 , C12Q2523/308 , C12Q2527/125 , C12Q2531/113 , C12Q2565/137 , G01N30/90 , G01N2030/8827 , Y10T436/255
摘要： Provided is a method for rapid nucleic acid purification, and the method for rapid nucleic acid isolation according to the present invention is very useful in diagnosing causes of disease or detecting a target gene; can be used in molecular diagnosis of causes of disease more rapidly and conveniently, as compared with the existing nucleic acid isolation method requiring complicated and special equipment; does not require skills therefor, thereby allowing an ordinary person to personally conduct isolation of nucleic acid for analyzing causes of disease and further solving the existing inconvenience caused by directly going to the hospitals or health clinical centers; and can analyze causes of disease more promptly.
摘要翻译：提供了快速核酸纯化的方法，根据本发明的快速核酸分离方法在诊断疾病的原因或检测靶基因中非常有用; 与现有的需要复杂和特殊设备的核酸分离方法相比，可以更迅速方便地用于疾病原因的分子诊断; 不需要技能，从而允许普通人亲自进行核酸分离，分析疾病原因，进一步解决直接前往医院或健康临床中心造成的不便之处; 并能及时分析疾病原因。

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