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1. 发明授权

US07944043B1 Semiconductor device having improved contact interface reliability and method therefor 有权
标题翻译：具有改善的接触界面可靠性的半导体器件及其方法
公开(公告)号：US07944043B1
公开(公告)日：2011-05-17
申请号：US12169151
申请日：2008-07-08
申请人： Young Suk Chung , Jae Yoon Kim , Tae Yong Lee
发明人： Young Suk Chung , Jae Yoon Kim , Tae Yong Lee
IPC分类号： H01L23/04
CPC分类号： H01L23/3128 , H01L21/4832 , H01L21/486 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/13 , H01L23/3107 , H01L23/3114 , H01L23/49582 , H01L23/498 , H01L23/49816 , H01L23/49827 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2221/68345 , H01L2224/32225 , H01L2224/4809 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2224/83192 , H01L2224/85001 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/92247 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package has an insulative layer having at least one channel formed on a first surface thereof. A conductive pattern conforming to the at least one channel and exposed to a bottom surface of the semiconductor package is formed. A semiconductor die is electrically connected to the conductive patterns. An encapsulant is used to at least partially filling the at least one channel.
摘要翻译：半导体封装具有在其第一表面上形成有至少一个沟道的绝缘层。形成符合至少一个通道并暴露于半导体封装的底表面的导电图案。半导体管芯电连接到导电图案。密封剂用于至少部分填充至少一个通道。

2. 发明申请

US20080302141A1 Drum type washer and door 有权
标题翻译：鼓式洗衣机和门
公开(公告)号：US20080302141A1
公开(公告)日：2008-12-11
申请号：US12071407
申请日：2008-02-20
申请人： Young Suk Chung
发明人： Young Suk Chung
IPC分类号： D06F39/14
CPC分类号： D06F37/10 , D06F39/14
摘要： A drum type washer and a door thereof are provided to eliminate moisture inside a door glass using natural convection. The door of the drum type washer includes a door glass, an inner door having a holder integral to the inner door to support an outer surface of the door glass, an outer door having a support rib integral to the outer door to support an inner surface of the door glass, the support rib including a hole set formed in the support rib such that an inside of the door glass communicates with an exterior of the drum type washer. With this configuration, the moisture created inside the door glass can be rapidly eliminated.
摘要翻译：提供滚筒式洗衣机及其门，以使用自然对流来消除门玻璃内的水分。滚筒式洗衣机的门包括门玻璃，内门具有与内门一体地支撑门玻璃的外表面的保持架，外门具有与外门一体的支撑肋，以支撑内门面所述支撑肋包括形成在所述支撑肋中的孔组件，使得所述门玻璃的内部与所述滚筒式洗衣机的外部连通。利用这种结构，可以快速消除在门玻璃内产生的水分。

3. 发明授权

US07102208B1 Leadframe and semiconductor package with improved solder joint strength 有权
标题翻译：引线框和半导体封装，焊接强度提高
公开(公告)号：US07102208B1
公开(公告)日：2006-09-05
申请号：US09687048
申请日：2000-10-13
申请人： Tae Heon Lee , Young Suk Chung , Mu Hwan Seo
发明人： Tae Heon Lee , Young Suk Chung , Mu Hwan Seo
IPC分类号： H01L23/495
CPC分类号： H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor leadframe and a semiconductor package using same. More particularly, a semiconductor leadframe offering improved solder joint strength between a semiconductor package and a motherboard is disclosed. The leadframe comprises a plate-type frame body; a chip paddle on which a semiconductor chip may be mounted; a plurality of internal leads located radially and spaced at regular intervals about the perimeter of the chip paddle; external leads extending outward from the internal leads and with their terminals connecting to the frame body; and dam bars at the juncture of each external and internal lead for additional support and to ensure that the external leads remain exposed during subsequent encapsulation processes. The leadframe of the present invention providing additional solder joint strength through the use of internal leads having different lengths or surface areas.
摘要翻译：半导体引线框和使用其的半导体封装。更具体地，公开了一种提供半导体封装和母板之间的焊接强度提高的半导体引线框架。引线框架包括板型框体; 可安装半导体芯片的芯片桨; 多个内部引线，围绕芯片桨的周边以规则的间隔径向地间隔开; 外部引线从内部引线向外延伸并且其端子连接到框架体; 并在每个外部和内部引线的接合处设有防水条，用于额外的支持，并确保外部引线在后续封装过程中保持暴露。本发明的引线框架通过使用具有不同长度或表面积的内部引线提供额外的焊接接合强度。

4. 发明授权

US07042068B2 Leadframe and semiconductor package made using the leadframe 有权
公开(公告)号：US07042068B2
公开(公告)日：2006-05-09
申请号：US09845601
申请日：2001-04-27
申请人： Byung Hoon Ahn , Jae Hun Ku , Young Suk Chung , Suk Gu Ko , Sung Sik Jang , Young Nam Choi , Won Chul Do
发明人： Byung Hoon Ahn , Jae Hun Ku , Young Suk Chung , Suk Gu Ko , Sung Sik Jang , Young Nam Choi , Won Chul Do
IPC分类号： H01L23/495
CPC分类号： H01L23/495 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/484 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/01002 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

5. 发明授权

US06759737B2 Semiconductor package including stacked chips with aligned input/output pads 有权
标题翻译：半导体封装包括具有对准输入/输出焊盘的堆叠芯片
公开(公告)号：US06759737B2
公开(公告)日：2004-07-06
申请号：US09816599
申请日：2001-03-23
申请人： Seong Min Seo , Young Suk Chung , Jong Sik Paek , Jae Hun Ku , Jae Hak Yee
发明人： Seong Min Seo , Young Suk Chung , Jong Sik Paek , Jae Hun Ku , Jae Hak Yee
IPC分类号： H01L2302
CPC分类号： H01L23/3107 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16245 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： Semiconductor packages are disclosed. An exemplary package includes horizontal leads each having a first side and an opposite second side. The second side includes a recessed horizontal surface. Two stacked semiconductor chips are within the package and are electrically interconnected in a flip chip style. One chip extends over the first side of the leads and is electrically connected thereto. The chips are encapsulated in a package body formed of an encapsulating material. The recessed horizontal surface of the leads is covered by the encapsulating material, and a portion of the second side of each lead is exposed at an exterior surface of the package body as an input/output terminal. A surface of one or both chips may be exposed. The stack of chips may be supported on the first side of the leads or on a chip mounting plate.
摘要翻译：公开了半导体封装。示例性包装包括每个具有第一侧和相对的第二侧的水平引线。第二侧包括凹入的水平表面。两个堆叠的半导体芯片在封装内并且以倒装芯片的形式电互连。一个芯片在引线的第一面上延伸并与其电连接。芯片被封装在由封装材料形成的封装体中。引线的凹入的水平表面被封装材料覆盖，并且每个引线的第二侧的一部分在封装主体的外表面处作为输入/输出端子露出。可以暴露一个或两个芯片的表面。芯片堆叠可以在引线的第一侧或芯片安装板上被支撑。

6. 发明授权

US08347523B2 Clothing dryer 有权
标题翻译：衣物烘干机
公开(公告)号：US08347523B2
公开(公告)日：2013-01-08
申请号：US12585046
申请日：2009-09-01
申请人： Young Suk Chung
发明人： Young Suk Chung
IPC分类号： F26B11/02
CPC分类号： D06F58/04
摘要： A clothing dryer including a rotating drum, a shelf installed inside the rotating drum, and a support member, which is rotatably installed at a rear end of the shelf such that the shelf is supported by a rear surface of the rotating drum. The rear end of the shelf is installed on a rear surface of the rotating drum through the support member, so that the shelf is more stably installed inside the rotating drum.
摘要翻译：一种衣物烘干机，包括旋转鼓，安装在旋转滚筒内的搁架和支撑构件，其可旋转地安装在搁架的后端，使得搁架由旋转鼓的后表面支撑。搁架的后端通过支撑构件安装在旋转鼓的后表面上，使得搁板更稳定地安装在旋转滚筒内。

7. 发明授权

US07765839B2 Drum type washer and door 有权
标题翻译：鼓式洗衣机和门
公开(公告)号：US07765839B2
公开(公告)日：2010-08-03
申请号：US12071407
申请日：2008-02-20
申请人： Young Suk Chung
发明人： Young Suk Chung
IPC分类号： D06F39/14
CPC分类号： D06F37/10 , D06F39/14
摘要： A drum type washer and a door thereof are provided to eliminate moisture inside a door glass using natural convection. The door of the drum type washer includes a door glass, an inner door having a holder integral to the inner door to support an outer surface of the door glass, an outer door having a support rib integral to the outer door to support an inner surface of the door glass, the support rib including a hole set formed in the support rib such that an inside of the door glass communicates with an exterior of the drum type washer. With this configuration, the moisture created inside the door glass can be rapidly eliminated.
摘要翻译：提供滚筒式洗衣机及其门，以使用自然对流来消除门玻璃内的水分。滚筒式洗衣机的门包括门玻璃，内门具有与内门一体地支撑门玻璃的外表面的保持架，外门具有与外门一体的支撑肋，以支撑内门面所述支撑肋包括形成在所述支撑肋中的孔组件，使得所述门玻璃的内部与所述滚筒式洗衣机的外部连通。利用这种结构，可以快速消除在门玻璃内产生的水分。

8. 发明授权

US07564122B2 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 有权
标题翻译：半导体封装和使用具有引线锁的引线框的方法，以将引线固定到密封剂
公开(公告)号：US07564122B2
公开(公告)日：2009-07-21
申请号：US11365246
申请日：2006-03-01
申请人： Jae Hak Yee , Young Suk Chung , Jae Jin Lee , Terry Davis , Chung Suk Han , Jae Hun Ku , Jae Sung Kwak , Sang Hyun Ryu
发明人： Jae Hak Yee , Young Suk Chung , Jae Jin Lee , Terry Davis , Chung Suk Han , Jae Hun Ku , Jae Sung Kwak , Sang Hyun Ryu
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/4951 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.
摘要翻译：公开了一种用于制造半导体封装的引线框架。引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生制造半导体封装。还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装，和用于支撑引线和连接条的阻挡条。另外的封装实施例包括从引线向下延伸的暴露突起。在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

9. 外观设计

USD593051S1 Mobile phone 有权
公开(公告)号：USD593051S1
公开(公告)日：2009-05-26
申请号：US29290832
申请日：2008-01-18
申请人： Young Suk Chung
设计人： Young Suk Chung

10. 发明授权

US07325332B2 Clothing dryer 失效
标题翻译：衣物烘干机
公开(公告)号：US07325332B2
公开(公告)日：2008-02-05
申请号：US11209671
申请日：2005-08-24
申请人： Young Suk Chung , Jung Ho Lee
发明人： Young Suk Chung , Jung Ho Lee
IPC分类号： F26B11/02
CPC分类号： D06F58/22
摘要： A clothing dryer capable of removing impurities, such as dust, accumulated in a hot air outlet duct thereof. The clothing dryer includes a drying tub to dry laundry contained therein using hot air supplied thereto, a hot air outlet duct to discharge the hot air, coming from the drying tub, to the outside, and a connecting unit to connect an external suction device to the hot air outlet duct. Accordingly, impurities, such as dust, accumulated in the hot air outlet duct can be removed by a suction force of the suction device, thereby enabling the cleaning of the hot air outlet duct.
摘要翻译：能够除去积存在其热风出口管内的灰尘等杂质的衣物烘干机。衣物烘干机包括：干燥桶，用于供应热风的干燥衣物，将来自干燥桶的热空气排出到外部的热空气出口管道;以及连接单元，将外部抽吸装置连接到热风出口管道。因此，积存在热风出口管道中的灰尘等杂质可以通过抽吸装置的吸力除去，从而能够清洁热风出口管道。

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