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    • 2. 发明授权
    • Image sensor and method of manufacturing the same
    • 图像传感器及其制造方法
    • US07723147B2
    • 2010-05-25
    • US11950171
    • 2007-12-04
    • Young-Je YunJin-Ho ParkSang-Wook Ryu
    • Young-Je YunJin-Ho ParkSang-Wook Ryu
    • H01L21/00H01L31/0232
    • H01L27/14627H01L27/14621H01L27/14685
    • An image sensor and a method of manufacturing the same capable of improving image quality by preventing the generation of a lens bridge formed due to a mutual connection of neighboring microlenses. The image sensor can include a semiconductor substrate having a plurality of photodiodes formed thereon; an insulation layer formed over the semiconductor substrate; a color filter layer formed over the insulation layer; a planarization layer formed over the whole surface including the color filter layer and having a plularity of concave regions and a convex regions repeatedly arranged in a pixel period; and a microlens formed over each of the concave regions and the convex regions.
    • 一种图像传感器及其制造方法,其能够通过防止由于相邻微透镜的相互连接而形成的透镜桥的产生而提高图像质量。 图像传感器可以包括其上形成有多个光电二极管的半导体衬底; 形成在半导体衬底上的绝缘层; 形成在绝缘层上的滤色器层; 在包括滤色器层的整个表面上形成的平坦化层,并且具有多个凹陷区域和在像素周期中重复排列的凸起区域; 以及形成在每个凹区域和凸区域上的微透镜。
    • 4. 发明申请
    • Image sensor and method for manufacturing the same
    • 图像传感器及其制造方法
    • US20080111204A1
    • 2008-05-15
    • US11980014
    • 2007-10-29
    • Young Je Yun
    • Young Je Yun
    • H01L31/0232H01L21/02
    • H01L27/14685H01L27/14609H01L27/14621H01L27/14627H01L27/14643H01L27/14687
    • A method for manufacturing an image sensor includes forming first to third photodiodes and first to third color filters corresponding thereto; forming a photoresist film including photosensitive materials on the upper surfaces of the first to third color filters; forming a first exposed part by exposing the photoresist film with a first exposure energy using a first pattern mask with a first light transmitting part having a first width at boundaries between the individual color filters; forming a second exposed part overlapping a portion of the first exposed part by exposing the photoresist film with a second exposure energy smaller than the first exposure energy using a second pattern mask with a second light transmitting part having a second width wider than the first width; and forming microlenses by developing the photoresist film.
    • 一种用于制造图像传感器的方法包括:形成第一至第三光电二极管和对应于其的第一至第三滤色器; 在第一至第三滤色器的上表面上形成包括感光材料的光致抗蚀剂膜; 通过使用具有在各个滤色器之间的边界处具有第一宽度的第一透光部分的第一图案掩模以第一曝光能量曝光所述光致抗蚀剂膜来形成第一曝光部分; 通过使用具有第二宽度大于所述第一宽度的第二宽度的第二透光部分的第二图案掩模,以比所述第一曝光能量小的第二曝光能量曝光所述光致抗蚀剂膜,形成与所述第一曝光部分重叠的第二曝光部分; 并通过显影光致抗蚀剂膜形成微透镜。
    • 8. 发明授权
    • Image sensor and method for manufacturing the same
    • 图像传感器及其制造方法
    • US08163590B2
    • 2012-04-24
    • US12510532
    • 2009-07-28
    • Young Je Yun
    • Young Je Yun
    • H01L21/00
    • H01L27/14627H01L27/14632H01L27/14647H01L27/14685H01L27/14687
    • Disclosed are an image sensor and a method of manufacturing the same. The image sensor includes a substrate including a pixel area and a logic circuit area; an interlayer dielectric layer on the substrate and having a trench in the pixel area; and an insulating layer microlens formed in the trench of the interlayer dielectric layer. According to the method, a substrate including a pixel area and a logic circuit area is prepared; an interlayer dielectric layer is formed on the substrate; a first microlens pattern is formed on the interlayer dielectric layer on the pixel area; and a second microlens pattern is formed by etching the interlayer dielectric layer on the pixel area using the first microlens pattern as an etch mask. During the etching, a second photoresist pattern, exposing the first microlens pattern, can be used to protect the interlayer dielectric layer on the logic circuit area.
    • 公开了一种图像传感器及其制造方法。 图像传感器包括:基板,包括像素区域和逻辑电路区域; 在所述衬底上的层间绝缘层,并且在所述像素区域中具有沟槽; 以及形成在层间电介质层的沟槽中的绝缘层微透镜。 根据该方法,准备包括像素区域和逻辑电路区域的基板; 在基板上形成层间电介质层; 在像素区域上的层间介质层上形成第一微透镜图案; 并且通过使用第一微透镜图案作为蚀刻掩模蚀刻像素区域上的层间电介质层来形成第二微透镜图案。 在蚀刻期间,可以使用暴露第一微透镜图案的第二光致抗蚀剂图案来保护逻辑电路区域上的层间介电层。
    • 9. 发明授权
    • Method for manufacturing image sensor
    • 图像传感器制造方法
    • US07977148B2
    • 2011-07-12
    • US12340221
    • 2008-12-19
    • Young Je Yun
    • Young Je Yun
    • H01L31/18
    • H01L27/14632H01L27/14636H01L27/14687
    • A method for manufacturing an image sensor includes forming a photolithography key in a scribe lane of a first substrate over which circuitry is formed in an active region. A photodiode is formed on an active region of a second substrate. The second substrate is bonded to the first substrate such that the photodiode is electrically connected to the circuitry. The photolithography key in the scribe lane of the first substrate is opened. A pattern is formed on the active region of the bonded second substrate using the opened photolithography key on/over the first substrate.
    • 一种用于制造图像传感器的方法包括在第一基板的划线中形成光刻键,在其中在有源区中形成电路。 在第二基板的有源区上形成光电二极管。 第二衬底被结合到第一衬底,使得光电二极管电连接到电路。 打开第一基板的划线中的光刻键。 使用打开的光刻键在第一基板上或上方在接合的第二基板的有源区上形成图案。
    • 10. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07608545B2
    • 2009-10-27
    • US11780970
    • 2007-07-20
    • Young-Je Yun
    • Young-Je Yun
    • H01L21/311
    • H01L21/31144H01L21/0338
    • Embodiments relate to a semiconductor device and a method of manufacturing a semiconductor. In embodiments, the method may include a first exposure step of performing an exposure process for forming a first photoresist on a semiconductor substrate at one side of the outside of a trench pattern which will be formed, a first etching step of performing a predetermined dry etching method with respect to the first photoresist, a second exposure step of performing an exposure process for forming a second photoresist at the other side of the outside of the trench pattern, which is a side opposite to the first photoresist, and a second etching step of performing the predetermined dry etching method with respect to the second photoresist.
    • 实施例涉及半导体器件和制造半导体的方法。 在实施例中,该方法可以包括:第一曝光步骤,用于在将要形成的沟槽图案的外侧的一侧上的半导体衬底上形成第一光致抗蚀剂,进行曝光处理;第一蚀刻步骤,执行预定的干蚀刻 相对于第一光致抗蚀剂的方法;第二曝光步骤,其在与第一光致抗蚀剂相反的一侧的沟槽图案的外侧的另一侧进行用于形成第二光致抗蚀剂的曝光处理;以及第二蚀刻步骤, 对第二光致抗蚀剂进行预定的干蚀刻方法。