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1. 发明授权

US07126083B2 Chip scale marker and method of calibrating marking position 有权
标题翻译：芯片刻度标记和校准标记位置的方法
公开(公告)号：US07126083B2
公开(公告)日：2006-10-24
申请号：US10887914
申请日：2004-07-12
申请人： You Hie Han , Chang Su Jun
发明人： You Hie Han , Chang Su Jun
IPC分类号： H01L21/263 , H01L21/302 , H01L21/461
CPC分类号： H01L21/67282 , H01L21/681
摘要： A chip scale marker including a laser system, a wafer holder supporting a wafer to be processed, and a camera moving above the wafer holder by being connected to an X-Y stage and monitoring the wafer supported on a center hole of the wafer holder, the chip scale marker includes a unit detachably arranged on a laser beam path from the laser system and reducing power density of a laser beam, and a screen arranged on a center hole of the wafer holder and indicating a position where a laser beam from the laser system is irradiated.
摘要翻译：一种芯片尺度标记，包括激光系统，支撑待处理晶片的晶片架，以及通过连接到XY平台并且支撑在晶片保持器的中心孔上的晶片来移动到晶片保持器上方的相机，芯片标尺包括从激光系统可拆卸地布置在激光束路径上的单元，并且降低激光束的功率密度，以及布置在晶片保持器的中心孔上并且指示来自激光系统的激光束的位置的屏幕照射。

2. 发明授权

US06590180B1 Laser welding system 有权
标题翻译：激光焊接系统
公开(公告)号：US06590180B1
公开(公告)日：2003-07-08
申请号：US09937957
申请日：2001-09-28
申请人： Jeong Suh , Je Hoon Lee , Jeong Oh Kim , You Hie Han
发明人： Jeong Suh , Je Hoon Lee , Jeong Oh Kim , You Hie Han
IPC分类号： B23K2626
CPC分类号： B23K26/26 , B23K2101/185 , B23K2103/04
摘要： The laser welding system including a welding frame for receiving a first steel plate to be welded thereupon, at least one first clamping member to be installed above the welding frame, for fixing the first steel plate received on the welding frame, at least one second clamping member for fixing a second steel plate to be welded in close vicinity to a position at which the first steel plate is to be engaged with and welded with the second steel plate, an anvil on which the second steel plate is received, for moving the second steel plate to the position at which the first steel plate is to be engaged with and welded with the second steel plate, and a laser welding head for welding the first and second steel plates at the position at which the first steel plate is to be welded with the second steel plate. The first and second clamping members and anvil are operated by air bags.
摘要翻译：该激光焊接系统包括用于接收待焊接的第一钢板的焊接框架，将要安装在焊接框架上方的至少一个第一夹紧构件，用于固定容纳在焊接框架上的第一钢板，至少一次第二夹紧用于将第二钢板固定在靠近第一钢板与第二钢板接合并与第二钢板焊接的位置的第二钢板的构件;接收第二钢板的砧座，用于移动第二钢板钢板到第一钢板与第二钢板接合并焊接的位置;以及激光焊接头，用于在第一钢板要被焊接的位置处焊接第一和第二钢板与第二块钢板。第一和第二夹紧构件和砧座由气囊操作。

3. 发明授权

US06870127B2 Chip scale marker and marking method 有权
标题翻译：芯片刻度标记和标记方法
公开(公告)号：US06870127B2
公开(公告)日：2005-03-22
申请号：US10610911
申请日：2003-07-02
申请人： You Hie Han , Chang Su Jun , Yang Ghi Min
发明人： You Hie Han , Chang Su Jun , Yang Ghi Min
IPC分类号： H01L21/02 , B23K26/08 , H01L21/00 , H01L23/544 , B23K26/00 , B23K26/14 , B23K26/16 , B23K26/18
CPC分类号： H01L21/67282 , B23K26/0823 , B23K2101/007 , B23K2101/40
摘要： A chip scale marker includes a laser system performing laser marking, a wafer holder on which a wafer subject to the laser marking is mounted, the wafer holder comprising a vacuum plate disposed at a center of the wafer holder for sucking the wafer and a wafer rotating unit provided at a circumference of the vacuum plate and having an open area facing the laser system, a camera disposed above the wafer holder to photograph the wafer, and a warpage removing unit provided above the wafer holder for removing warpage from the wafer.
摘要翻译：芯片尺度标记包括执行激光标记的激光系统，其上安装有激光标记的晶片的晶片保持器，晶片保持器包括设置在晶片保持器的中心处的真空板，用于吸取晶片和晶片旋转设置在真空板的圆周上并且具有面向激光系统的开口区域，设置在晶片保持器上方拍摄晶片的照相机，以及设置在晶片保持器上方以消除晶片翘曲的翘曲去除单元。

4. 发明授权

US06808117B2 Method and apparatus for calibrating marking position in chip scale marker 有权
标题翻译：用于校准芯片刻度标记中的标记位置的方法和装置
公开(公告)号：US06808117B2
公开(公告)日：2004-10-26
申请号：US10138257
申请日：2002-05-06
申请人： You-hie Han , Choong-shin Lee , Yang-ghi Min , Byoung-min Ahn , Hyeyg-jeon Chang
发明人： You-hie Han , Choong-shin Lee , Yang-ghi Min , Byoung-min Ahn , Hyeyg-jeon Chang
IPC分类号： G06K1906
CPC分类号： H01L21/67282 , H01L21/681
摘要： A method and apparatus for calibrating a marking position in a chip scale marker are provided. The method includes: (a) placing a screen which is equivalent in shape to the wafer on a wafer holder for holding the wafer; (b) irradiating a laser beam at a predetermined target point on the screen, and measuring the position of the laser beam by a camera being moved above the target point; (c) transmitting the measured position information to a controller; (d) repeating steps (b) and (c) at a plurality of predetermined points; (e) comparing the transmitted position information with the target point; and (f) calibrating the position of the laser beam irradiated on the wafer by adjusting mirrors of the galvano scanner in the event that a deviation between the position information and the target point falls beyond a predetermined value.
摘要翻译：提供了一种用于校准芯片尺度标记中的标记位置的方法和装置。该方法包括：（a）在用于保持晶片的晶片保持器上放置等同于晶片的晶片的屏幕; （b）在屏幕上的预定目标点处照射激光束，并且通过移动到目标点上方的相机测量激光束的位置; （c）将测量的位置信息发送到控制器; （d）在多个预定点处重复步骤（b）和（c）; （e）将发送的位置信息与目标点进行比较; 以及（f）在位置信息和目标点之间的偏差超过预定值的情况下，通过调整电流计扫描器的反射镜来校准照射在晶片上的激光束的位置。

5. 发明申请

US20060039057A1 Laser processing apparatus and method using polygon mirror 有权
标题翻译：激光加工设备和使用多面镜的方法
公开(公告)号：US20060039057A1
公开(公告)日：2006-02-23
申请号：US10982091
申请日：2004-11-04
申请人： You-Hie Han , Eun-Jeong Hong
发明人： You-Hie Han , Eun-Jeong Hong
IPC分类号： G02B26/08
CPC分类号： B23K26/0736 , B23K26/082 , B23K26/0821 , B23K26/40 , B23K2101/40 , B23K2103/42 , B23K2103/50
摘要： Disclosed is a laser processing apparatus and method for enhancing processing efficiency of an object by means of a polygon mirror. The laser processing apparatus includes a laser generator outputting a laser beam with a predetermined diameter, a polygon mirror rotating on an axis with plural reflection planes to reflect the laser beam incident on the reflection planes from the laser generator, in which the number of the reflection planes is set in order that the laser beam can cover at least two reflection planes of the polygon mirror, and a lens condensing and irradiating the laser beam reflected from the polygon mirror. According to the present invention, it is able to improve the processing efficiency and product yield of an object by dividing the laser beam into the plurality to be incident on the reflection planes of the polygon mirror and repeatedly processing the object in low energy by means of the divided laser beam.
摘要翻译：公开了一种通过多面镜提高物体的处理效率的激光加工装置和方法。激光加工装置包括：输出具有预定直径的激光束的激光发生器，具有多个反射面的轴上旋转的多面镜，以反射入射到来自激光发生器的反射面上的激光束，其中反射次数设置平面以便激光束可以覆盖多面镜的至少两个反射面，以及聚焦并照射从多面镜反射的激光束的透镜。根据本发明，能够通过将激光束分割为多个入射到多面体反射镜的反射面上并以低能量重复地处理物体，从而提高物体的处理效率和产品产量，借助于分割的激光束。

6. 发明申请

US20050218128A1 Laser processing apparatus with polygon mirror 审中-公开
标题翻译：带多面镜的激光加工设备
公开(公告)号：US20050218128A1
公开(公告)日：2005-10-06
申请号：US10886122
申请日：2004-07-06
申请人： You-Hie Han
发明人： You-Hie Han
IPC分类号： G02B26/12 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/08 , B23K26/38 , B23K26/40 , G02B26/08 , G02B26/10 , H01L21/304 , H01L21/78 , H01S3/00
CPC分类号： B23K26/08 , B23K26/0736 , B23K26/082 , B23K26/0821 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/3043
摘要： The disclosure is directed to a laser processing apparatus employing a polygon mirror, capable of processing an object efficiently. The apparatus is comprised of a laser generator for emitting a laser beam, a polygon mirror rotating at the axis and having a plurality of reflection planes which reflect the laser beam incident thereon from the laser generator, and a lens irradiating the laser beam on an object, e.g., a wafer, that is settled on a stage, after condensing the laser beam reflected from the polygon mirror. In applying the laser beam to the wafer in accordance with a rotation of the polygon mirror, the stage on which the wafer is settled moves to enhance a relative scanning speed of the laser beam, which enables an efficient cutout operation for the wafer. As it uses only the laser beam to cutout the wafer, there is no need to change any additional devices, which improves a processing speed and cutout efficiency. Further, it is available to control a cutout width and to prevent a recasting effect by which vapors generated from the wafer during the cutout process are deposited on cutout section of the wafer, resulting in accomplishing a wafer cutout process in highly fine and precise dimensions.
摘要翻译：本发明涉及一种能够有效处理物体的采用多面镜的激光加工装置。该装置由用于发射激光束的激光发生器，在轴上旋转并具有反射从激光发生器入射到其上的激光束的多个反射面的多面反射镜和将激光束照射在物体上的透镜，例如，在聚焦从多面镜反射的激光束之后沉积在舞台上的晶片。在根据多面反射镜的旋转将激光束施加到晶片的同时，晶片沉降的阶段移动以增强激光束的相对扫描速度，这使得能够有效地切割晶片。由于仅使用激光束来切割晶片，所以不需要改变任何附加的装置，这提高了处理速度和切割效率。此外，可以控制切口宽度，并且防止在切割过程中从晶片产生的蒸气沉积在晶片的切口部分上的再生效果，从而以高精度和精确的尺寸完成晶片切割处理。

7. 发明申请

US20110223478A1 SECONDARY BATTERY AND SECONDARY BATTERY MODULE USING THE SAME 审中-公开
标题翻译：二次电池和二次电池模块
公开(公告)号：US20110223478A1
公开(公告)日：2011-09-15
申请号：US12882997
申请日：2010-09-15
申请人： You Hie HAN
发明人： You Hie HAN
IPC分类号： H01M10/02 , H01M10/38
CPC分类号： H01M10/38 , H01M2/20 , H01M2/30
摘要： A secondary battery includes a cell body having an electrode assembly disposed therein; and an electrode tab extending from each electrode of the electrode assembly to an outside of the cell body in a specified direction, and having at least one flexed part at an intermediate portion thereof.
摘要翻译：二次电池包括其中设置有电极组件的电池体; 以及电极接头，其从电极组件的每个电极沿指定方向延伸到电池体的外部，并且在其中间部分具有至少一个弯曲部分。

8. 发明授权

US07164519B2 Laser processing apparatus and method using polygon mirror 有权
标题翻译：激光加工设备和使用多面镜的方法
公开(公告)号：US07164519B2
公开(公告)日：2007-01-16
申请号：US10982091
申请日：2004-11-04
申请人： You-Hie Han , Eun-Jeong Hong
发明人： You-Hie Han , Eun-Jeong Hong
IPC分类号： G02B26/08
CPC分类号： B23K26/0736 , B23K26/082 , B23K26/0821 , B23K26/40 , B23K2101/40 , B23K2103/42 , B23K2103/50
摘要： Disclosed is a laser processing apparatus and method for enhancing processing efficiency of an object by means of a polygon mirror. The laser processing apparatus includes a laser generator outputting a laser beam with a predetermined diameter, a polygon mirror rotating on an axis with plural reflection planes to reflect the laser beam incident on the reflection planes from the laser generator, in which the number of the reflection planes is set in order that the laser beam can cover at least two reflection planes of the polygon mirror, and a lens condensing and irradiating the laser beam reflected from the polygon mirror. According to the present invention, it is able to improve the processing efficiency and product yield of an object by dividing the laser beam into the plurality to be incident on the reflection planes of the polygon mirror and repeatedly processing the object in low energy by means of the divided laser beam.
摘要翻译：公开了一种通过多面镜提高物体的处理效率的激光加工装置和方法。激光加工装置包括：输出具有预定直径的激光束的激光发生器，具有多个反射面的轴上旋转的多面镜，以反射入射到来自激光发生器的反射面上的激光束，其中反射次数设置平面以便激光束可以覆盖多面镜的至少两个反射面，以及聚焦并照射从多面镜反射的激光束的透镜。根据本发明，能够通过将激光束分割为多个入射到多面体反射镜的反射面上并以低能量重复地处理物体，从而提高物体的处理效率和产品产量，借助于分割的激光束。

9. 发明授权

US06794205B2 Chip scale marker and method of calibrating marking position 有权
公开(公告)号：US06794205B2
公开(公告)日：2004-09-21
申请号：US10615901
申请日：2003-07-10
申请人： You Hie Han , Chang Su Jun
发明人： You Hie Han , Chang Su Jun
IPC分类号： H01L2166
CPC分类号： H01L21/67282 , H01L21/681
摘要： A chip scale marker including a laser system, a wafer holder supporting a wafer to be processed, and a camera moving above the wafer holder by being connected to an X-Y stage and monitoring the wafer supported on a center hole of the wafer holder, the chip scale marker includes a unit detachably arranged on a laser beam path from the laser system and reducing power density of a laser beam, and a screen arranged on a center hole of the wafer holder and indicating a position where a laser beam from the laser system is irradiated.

10. 发明授权

US06710286B2 Chip scale marker and making method 有权
标题翻译：芯片刻度和制作方法
公开(公告)号：US06710286B2
公开(公告)日：2004-03-23
申请号：US10232746
申请日：2002-09-03
申请人： You-hie Han
发明人： You-hie Han
IPC分类号： B23K2620
CPC分类号： H01L21/67282 , H01L23/544 , H01L2223/54473 , H01L2924/0002 , H01L2924/00
摘要： Provided is a chip scale marker and a marking method. The method for marking, using a chip scale marker, wherein a laser beam is irradiated from a laser source on the wafer chips via a galvano scanner and an f-theta lens, the method comprising: (a) measuring position information of a plurality of points on the wafer; (b) transmitting the measured position information to a controller; (c) calculating a deviation between a marking distance between the f-theta lens and the point on the wafer surface and a focus distance of the f-theta lens from the transmitted position information; and (d) if the deviation is greater than a predetermined value in the step (c), calibrating the wafer chip to be positioned at the focus distance of the f-theta lens. According to the chip scale marker, it is possible to increase marking quality by measuring and calibrating a vertical distance from an f-theta lens of the laser system to each wafer chip so that the wafer chip is marked at a predetermined distance from the f-theta lens of the laser system.
摘要翻译：提供了芯片刻度标记和标记方法。一种使用芯片刻度标记进行标记的方法，其中通过电流扫描仪和f-theta透镜从激光源照射在晶片芯片上的激光束，该方法包括：（a）测量多个晶圆上的点; （b）将测量的位置信息发送到控制器; （c）计算所述f-theta透镜与所述晶片表面上的点之间的标记距离与所述透镜位置信息的所述f-θ透镜的焦距之间的偏差; 以及（d）如果在步骤（c）中偏差大于预定值，则将晶片芯片校准为位于f-theta透镜的焦距处。根据芯片刻度标记，可以通过测量和校准从激光系统的f-theta透镜到每个晶片芯片的垂直距离来提高标记质量，使得晶片芯片被标记在与f- θ透镜的激光系统。

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