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1. 发明授权

US08327711B2 Electrostatic capacitive vibrating sensor 有权
标题翻译：静电电容式振动传感器
公开(公告)号：US08327711B2
公开(公告)日：2012-12-11
申请号：US12674696
申请日：2009-02-18
申请人： Takashi Kasai , Kazuyuki Ono , Yoshitaka Tsurukame
发明人： Takashi Kasai , Kazuyuki Ono , Yoshitaka Tsurukame
IPC分类号： G01M3/32
CPC分类号： H04R19/005 , H04R2201/003
摘要： An electrostatic capacitive vibration sensor has a substrate, a through-hole, a vibrating electrode plate, and a fixed electrode plate opposite the vibrating electrode plate. The fixed electrode plate is subjected to vibration to perform membrane oscillation. Pluralities of acoustic holes are made in the fixed electrode plate. The vibrating and fixed electrode plate are disposed on a surface side of the substrate such that an opening on the surface side of the through-hole is covered. A lower surface of an outer peripheral portion of the vibrating electrode plate is partially fixed to the substrate. A vent hole that communicates a surface side and a rear surface side of the vibrating electrode plate is made between the surface of the substrate and the lower surface of the vibrating electrode plate. In addition, the acoustic hole has a smaller opening area except at the outer peripheral portion.
摘要翻译：静电电容式振动传感器具有与振动电极板相对的基板，通孔，振动电极板和固定电极板。固定电极板经受振动以进行膜振荡。在固定电极板上形成多个声孔。振动固定电极板设置在基板的表面侧，使得贯通孔的表面侧的开口被覆盖。振动电极板的外周部的下表面部分地固定在基板上。在基板的表面和振动电极板的下表面之间形成有连通振动电极板的表面侧和后表面侧的通气孔。此外，除了外周部分之外，声孔具有较小的开口面积。

2. 发明申请

US20110179876A1 CAPACITANCE TYPE VIBRATION SENSOR 有权
标题翻译：电容式振动传感器
公开(公告)号：US20110179876A1
公开(公告)日：2011-07-28
申请号：US13055514
申请日：2009-02-19
申请人： Takashi Kasai , Yoshitaka Tsurukame
发明人： Takashi Kasai , Yoshitaka Tsurukame
IPC分类号： G01H11/06
CPC分类号： H04R19/04 , H04R19/005 , H04R31/006
摘要： A capacitance type vibration sensor has a substrate including a hollow portion, a vibration electrode plate, which is arranged facing the hollow portion at an upper surface side of the substrate and which performs film vibration upon receiving vibration, and a fixed electrode plate which is arranged facing the vibration electrode plate and which is opened with a plurality of acoustic perforations passing therethrough in a thickness direction. The capacitance type vibration sensor has an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion.
摘要翻译：电容式振动传感器具有基板，该基板包括中空部分，振动电极板，该基板在基板的上表面侧面对中空部分并且在受到振动时进行薄膜振动;以及固定电极板，其被布置面对振动电极板，并且在厚度方向上开有多个穿过其的声孔。电容型振动传感器具有将基板的上表面与振动电极板的下表面之间的至少一部分的振动电极板和固定电极板之间的空间连通到空心部的空气路径的中空部分的周边。

3. 发明申请

US20110266640A1 ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：声学传感器及其制造方法
公开(公告)号：US20110266640A1
公开(公告)日：2011-11-03
申请号：US13096621
申请日：2011-04-28
申请人： Takashi Kasai , Yoshitaka Tsurukame , Seung Kae Moon , Shinichi Terasaka
发明人： Takashi Kasai , Yoshitaka Tsurukame , Seung Kae Moon , Shinichi Terasaka
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： H04R19/005 , H04R19/04
摘要： An acoustic sensor lengthens the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On an upper surface of a silicon substrate, a beam portion made of polysilicon is formed through a second sacrifice layer made of silicon dioxide film on an extended portion of a first sacrifice layer made of polysilicon. The extended portion is formed under a region excluding a distal end of the beam portion. The extended portion is removed by etching from a back chamber arranged in the silicon substrate to form a hollow portion in a region excluding the distal end of the lower surface of the beam portion, and then the second sacrifice layer is removed by etching. The second sacrifice layer remaining on the lower surface of the distal end of the beam portion forms an anchor.
摘要翻译：声传感器延长未固定在锚杆上的梁部分，而不会降低梁部分的强度和隔膜的支撑强度。在硅衬底的上表面上，通过在由多晶硅制成的第一牺牲层的延伸部分上的由二氧化硅膜制成的第二牺牲层形成由多晶硅制成的束部分。延伸部形成在除了梁部的前端以外的区域。延伸部分通过从布置在硅衬底中的后室蚀刻除去，以在除了光束部分的下表面的远端之外的区域中形成中空部分，然后通过蚀刻去除第二牺牲层。残留在梁部分的远端的下表面上的第二牺牲层形成锚。

4. 发明授权

US08374364B2 Acoustic sensor and method of manufacturing the same 有权
标题翻译：声传感器及其制造方法
公开(公告)号：US08374364B2
公开(公告)日：2013-02-12
申请号：US13096621
申请日：2011-04-28
申请人： Takashi Kasai , Yoshitaka Tsurukame , Seung Kae Moon , Shinichi Terasaka
发明人： Takashi Kasai , Yoshitaka Tsurukame , Seung Kae Moon , Shinichi Terasaka
IPC分类号： H04R19/04 , H01L21/00 , H01L29/84
CPC分类号： H04R19/005 , H04R19/04
摘要： An acoustic sensor lengthens the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On an upper surface of a silicon substrate, a beam portion made of polysilicon is formed through a second sacrifice layer made of silicon dioxide film on an extended portion of a first sacrifice layer made of polysilicon. The extended portion is formed under a region excluding a distal end of the beam portion. The extended portion is removed by etching from a back chamber arranged in the silicon substrate to form a hollow portion in a region excluding the distal end of the lower surface of the beam portion, and then the second sacrifice layer is removed by etching. The second sacrifice layer remaining on the lower surface of the distal end of the beam portion forms an anchor.
摘要翻译：声传感器延长未固定在锚杆上的梁部分，而不会降低梁部分的强度和隔膜的支撑强度。在硅衬底的上表面上，通过在由多晶硅制成的第一牺牲层的延伸部分上的由二氧化硅膜制成的第二牺牲层形成由多晶硅制成的束部分。延伸部形成在除了梁部的前端以外的区域。延伸部分通过从布置在硅衬底中的后室蚀刻除去，以在除了光束部分的下表面的远端之外的区域中形成中空部分，然后通过蚀刻去除第二牺牲层。残留在梁部分的远端的下表面上的第二牺牲层形成锚。

5. 发明申请

US20100212432A1 ELECTROSTATIC CAPACITIVE VIBRATING SENSOR 有权
标题翻译：静电电容式振动传感器
公开(公告)号：US20100212432A1
公开(公告)日：2010-08-26
申请号：US12674696
申请日：2009-02-18
申请人： Takashi Kasai , Kazuyuki Ono , Yoshitaka Tsurukame
发明人： Takashi Kasai , Kazuyuki Ono , Yoshitaka Tsurukame
IPC分类号： G01H11/06
CPC分类号： H04R19/005 , H04R2201/003
摘要： An electrostatic capacitive vibration sensor has a substrate, a through-hole, a vibrating electrode plate, and a fixed electrode plate opposite the vibrating electrode plate. The fixed electrode plate is subjected to vibration to perform membrane oscillation. Pluralities of acoustic holes are made in the fixed electrode plate. The vibrating and fixed electrode plate are disposed on a surface side of the substrate such that an opening on the surface side of the through-hole is covered. A lower surface of an outer peripheral portion of the vibrating electrode plate is partially fixed to the substrate. A vent hole that communicates a surface side and a rear surface side of the vibrating electrode plate is made between the surface of the substrate and the lower surface of the vibrating electrode plate. In addition, the acoustic hole has a smaller opening area except at the outer peripheral portion.
摘要翻译：静电电容式振动传感器具有与振动电极板相对的基板，通孔，振动电极板和固定电极板。固定电极板经受振动以进行膜振荡。在固定电极板上形成多个声孔。振动固定电极板设置在基板的表面侧，使得贯通孔的表面侧的开口被覆盖。振动电极板的外周部的下表面部分地固定在基板上。在基板的表面和振动电极板的下表面之间形成有连通振动电极板的表面侧和后表面侧的通气孔。此外，除了外周部分之外，声孔具有较小的开口面积。

6. 发明授权

US08627725B2 Capacitance type vibration sensor 有权
标题翻译：电容式振动传感器
公开(公告)号：US08627725B2
公开(公告)日：2014-01-14
申请号：US13055514
申请日：2009-02-19
申请人： Takashi Kasai , Yoshitaka Tsurukame
发明人： Takashi Kasai , Yoshitaka Tsurukame
IPC分类号： H04R19/00
CPC分类号： H04R19/04 , H04R19/005 , H04R31/006
摘要： A capacitance type vibration sensor has a substrate including a hollow portion, a vibration electrode plate, which is arranged facing the hollow portion at an upper surface side of the substrate and which vibrates by sound pressure, and a fixed electrode plate which is arranged facing the vibration electrode plate and which is opened with a plurality of acoustic perforations passing therethrough in a thickness direction. The capacitance type vibration sensor has an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion. The capacitance type vibration sensor also has an air escape portion, which is a perforation or a groove formed in the substrate.
摘要翻译：电容式振动传感器具有包括中空部的基板，在基板的上表面侧面对中空部并且通过声压而振动的振动电极板;以及固定电极板，振动电极板，并且在厚度方向上开有多个穿过其的声孔。电容型振动传感器具有将基板的上表面与振动电极板的下表面之间的至少一部分的振动电极板和固定电极板之间的空间连通到空心部的空气路径的中空部分的周边。电容式振动传感器还具有排气部，该空气排出部是在基板上形成的穿孔或槽。

7. 发明申请

US20100133091A1 THIN FILM PRODUCING METHOD AND HEXAGONAL PIEZOELECTRIC THIN FILM PRODUCED THEREBY 审中-公开
标题翻译：薄膜生产方法和六角压电薄膜生产
公开(公告)号：US20100133091A1
公开(公告)日：2010-06-03
申请号：US12516473
申请日：2007-11-22
申请人： Hidetoshi Nishio , Yoshikazu Mori , Yoshitaka Tsurukame , Takayuki Kawamoto , Yoshiaki Watanabe , Takahiko Yanagitani
发明人： Hidetoshi Nishio , Yoshikazu Mori , Yoshitaka Tsurukame , Takayuki Kawamoto , Yoshiaki Watanabe , Takahiko Yanagitani
IPC分类号： C23C14/34 , C23C14/08
CPC分类号： C23C14/086 , C23C14/35 , C30B23/066 , C30B29/16 , H01L41/316
摘要： A magnetron circuit of a rectangular type is disposed on a lower surface of a rectangular target. A half of the target is covered with a shield plate, so that sputtering particles sputtered from an erosion region (a region with a maximized magnetic flux density) therebelow is blocked so as not to fly toward a substrate. The substrate is disposed at a level so as to be located in a plasma region of a vacuum chamber, and sputtering particles (ZnO) sputtered from a region exposed from the shield plate in the erosion region is caused to be incident on a surface of the substrate. When a gas pressure is lowered, a mean free path of each of the sputtering particles is lengthened to cause a large amount of high-energy sputtering particles to be incident. As a result, a hexagonal crystal particle having a plane that is a crystal plane hardly damaged by incidence of the high-energy sputtering particles is preferentially grown to form a c-axis in-plane oriented film.
摘要翻译：矩形型磁控管设置在矩形靶的下表面上。目标的一半被屏蔽板覆盖，使得从其侵蚀区域（具有最大磁通密度的区域）溅射的溅射颗粒被阻挡，以便不向基板飞行。基板被设置在位于真空室的等离子体区域中的水平面上，并且使从溅射区域中的屏蔽板暴露的区域溅射的溅射粒子（ZnO）入射到基质。当气体压力降低时，每个溅射颗粒的平均自由程延长，导致大量的高能量溅射颗粒入射。结果，优选生长具有难以被高能溅射颗粒的入射损坏的晶面的平面的六方晶体颗粒，以形成c轴面内取向膜。

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