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1. 发明申请

US20050015037A1 Pressure-sensitive adhesive component for ankle and use thereof 失效
公开(公告)号：US20050015037A1
公开(公告)日：2005-01-20
申请号：US10865751
申请日：2004-06-14
申请人： Osamu Oohira , Yoshitada Morikawa , Kotaro Shimobayashi
发明人： Osamu Oohira , Yoshitada Morikawa , Kotaro Shimobayashi
IPC分类号： A61F13/06 , A61F13/00
CPC分类号： A61F13/066
摘要： To provide a pressure-sensitive adhesive component that can be quickly and easily used to fix an ankle joint by persons having no expert knowledge on taping without causing problems such as difficulty in wearing shoes due to thickening upon application of the tape, a pressure-sensitive adhesive component includes a bottom portion; a first tape-shaped body; and a second tape-shaped body, wherein a cut is provided between the first and second tape-shaped bodies running in a longitudinal direction, the first tape-shaped body including a first front tape body and a first rear tape body, and the second tape-shaped body including a second front tape body and a second rear tape body, and wherein a ratio of a width of the front tape body to a width of the rear tape body is within the range of 5:5 to 5:3.

2. 发明授权

US4560713A Reinforced plastic molding 失效
标题翻译：加强塑料成型
公开(公告)号：US4560713A
公开(公告)日：1985-12-24
申请号：US690809
申请日：1985-01-14
申请人： Mitsuo Yoshihara , Yoshitada Morikawa , Yasuo Yamamoto , Mitsuharu Komada , Masaaki Hattori
发明人： Mitsuo Yoshihara , Yoshitada Morikawa , Yasuo Yamamoto , Mitsuharu Komada , Masaaki Hattori
IPC分类号： B32B27/04 , C08F299/02 , C08G8/32 , C08J5/04 , C08J5/24 , C08L63/10
CPC分类号： C08J5/24 , C08F299/028 , C08G8/32 , Y10S525/922
摘要： A reinforced plastic molding having excellent heat resistance, toughness and adhesion property to a fibrous substrate is disclosed, comprising a fibrous substrate having impregnated and cured therein a curable composition comprising tri(meth)acrylate of trishydroxyalkyl isocyanurate, a modified phenol novolak-based epoxy resin and a polymerization initiator.
摘要翻译：公开了一种具有优异的耐热性，韧性和对纤维质基材的粘合性能的增强塑料成型体，其包括在其中浸渍和固化的可固化组合物的纤维基材，其包含三羟甲基异氰脲酸酯的三（甲基）丙烯酸酯，改性酚醛清漆型环氧树脂和聚合引发剂。

3. 发明授权

US07419476B2 Pressure-sensitive adhesive component for ankle and use thereof 失效
标题翻译：用于脚踝的压敏粘合剂组分及其用途
公开(公告)号：US07419476B2
公开(公告)日：2008-09-02
申请号：US10865751
申请日：2004-06-14
申请人： Osamu Oohira , Yoshitada Morikawa , Kotaro Shimobayashi
发明人： Osamu Oohira , Yoshitada Morikawa , Kotaro Shimobayashi
IPC分类号： A61F13/06
CPC分类号： A61F13/066
摘要： To provide a pressure-sensitive adhesive component that can be quickly and easily used to fix an ankle joint by persons having no expert knowledge on taping without causing problems such as difficulty in wearing shoes due to thickening upon application of the tape, a pressure-sensitive adhesive component includes a bottom portion; a first tape-shaped body; and a second tape-shaped body, wherein a cut is provided between the first and second tape-shaped bodies running in a longitudinal direction, the first tape-shaped body including a first front tape body and a first rear tape body, and the second tape-shaped body including a second front tape body and a second rear tape body, and wherein a ratio of a width of the front tape body to a width of the rear tape body is within the range of 5:5 to 5:3.
摘要翻译：为了提供可以快速且容易地用于固定踝关节的压敏粘合剂组分，这些人不需要有关胶带的专业知识，而不会引起诸如在施加胶带时由于增稠而难以佩戴鞋子等问题，压敏胶粘合剂组分包括底部; 第一个带状体; 以及第二带状体，其中，在沿着纵向方向延伸的所述第一和第二带状体之间设置有切口，所述第一带状体包括第一前带体和第一后带体，带状体，包括第二前带体和第二后带体，并且其中前带体的宽度与后带体的宽度的比率在5:5至5:3的范围内。

4. 发明授权

US06849057B2 Pressure-sensitive adhesive tape for fixing a joint portion and method of using the same 失效
标题翻译：用于固定接合部分的压敏粘合带及其使用方法
公开(公告)号：US06849057B2
公开(公告)日：2005-02-01
申请号：US10140253
申请日：2002-05-08
申请人： Hideo Satou , Masayuki Konno , Kodo Kishida , Yoshitada Morikawa , Osamu Oohira , Seishi Suzuki , Yuichi Inoue
发明人： Hideo Satou , Masayuki Konno , Kodo Kishida , Yoshitada Morikawa , Osamu Oohira , Seishi Suzuki , Yuichi Inoue
IPC分类号： A61F13/02 , A61F13/06 , A61F13/10 , C09J7/02 , A61F5/00
CPC分类号： A61F13/062 , A61F13/0273 , A61F13/102 , C09J7/20
摘要： A pressure-sensitive adhesive tape for fixing a joint portion includes a support of a generally rectangular shape having a longer side and a shorter side and a pressure sensitive adhesive layer on one side of the support in at least a portion thereof. The support is provided with a non-adherent portion or a weakly adherent portion. The tape has a cut line extending from an end of the shorter side to near the non-adherent or weakly adherent portion.
摘要翻译：用于固定接合部分的压敏粘合带包括在支撑体的至少一部分中具有长边和短边的大致矩形的支撑体和在支撑体的一侧上的压敏粘合剂层。该支撑件设置有非粘附部分或弱附着部分。带具有从短边的端部延伸到非粘附或弱附着部分附近的切割线。

5. 发明授权

US5624989A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5624989A
公开(公告)日：1997-04-29
申请号：US424195
申请日：1995-04-19
申请人： Miho Yamaguchi , Mitsuyoshi Shirai , Yoshitada Morikawa , Yoshiaki Mitsuoka , Michio Komoto
发明人： Miho Yamaguchi , Mitsuyoshi Shirai , Yoshitada Morikawa , Yoshiaki Mitsuoka , Michio Komoto
IPC分类号： H01L23/29 , C08K3/22 , C08L63/00
CPC分类号： H01L23/295 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor device obtained by encapsulating a semiconductor element with a thermosetting resin composition comprising a thermosetting resin (Component I) and a hardener (Component II) having the following components III and IV incorporated therein. The semiconductor device is thus provided with a high heat resistance at infrared reflow step and a high flame retardance, showing a drastically enhanced reliability.(III) A metal hydroxide represented by the following general formula (1):n(M.sub.a O.sub.b).cH.sub.2 O (1)wherein M represents a metallic element; a, b and c each represents a positive number; and n represents a positive number of 1 or more, with the proviso that when M.sub.a O.sub.b is repeated, the plurality of M's may be the same or different and that a and b may be the same or different; and(IV) a metal oxide represented by the following general formula (2):n'(Q.sub.d O.sub.e) (2)wherein Q represents a metallic element belonging to the group selected from the group consisting of Groups IVa, Va, VIa, VIIa, VIII, Ib and IIb in the Periodic Table; d and e each represents a positive number; and n' represents a positive number of 1 or more, with the proviso that when Q.sub.d O.sub.e is repeated, the plurality of Q's may be the same or different and that d and e may be the same or different.
摘要翻译：一种半导体器件，其通过包含热固性树脂（组分I）和硬化剂（组分II）的热固性树脂组合物包封半导体元件而得到，该组合物具有下述组分III和IV。因此，半导体器件在红外回流步骤和高阻燃性下具有高耐热性，显示出可靠性的显着提高。（III）由以下通式（1）表示的金属氢氧化物：n（MaOb）.cH 2 O（1）其中M表示金属元素; a，b和c各自表示正数; n表示1以上的正数，条件是当重复MaOb时，多个M可以相同或不同，并且a和b可以相同或不同; 和（IV）由以下通式（2）表示的金属氧化物：n'（QdOe）（2）其中Q表示属于选自组IVa，Va，VIa，VIIa， VIII，Ib和IIb; d和e各自表示正数; n'表示1以上的正数，条件是当QdOe重复时，多个Q可以相同或不同，d和e可以相同或不同。

6. 发明授权

US5728763A Thermosetting resin composition for semiconductor devices 失效
标题翻译：半导体器件用热固性树脂组合物
公开(公告)号：US5728763A
公开(公告)日：1998-03-17
申请号：US748911
申请日：1996-11-15
申请人： Miho Yamaguchi , Mitsuyoshi Shirai , Yoshitada Morikawa , Yoshiaki Mitsuoka , Michio Komoto
发明人： Miho Yamaguchi , Mitsuyoshi Shirai , Yoshitada Morikawa , Yoshiaki Mitsuoka , Michio Komoto
IPC分类号： H01L23/29 , C08K3/22
CPC分类号： H01L23/295 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor device obtained by encapsulating a semiconductor element with a thermosetting resin composition comprising a thermosetting resin (Component I) and a hardener (Component II) having the following components III and IV incorporated therein. The semiconductor device is thus provided with a high heat resistance at infrared reflow step and a high flame retardance, showing a drastically enhanced reliability. (III) A metal hydroxide represented by the following general formula (1): n(M.sub.a O.sub.b).cH.sub.2 O (1) wherein M represents a metallic element; a, b and c each represents a positive number; and n represents a positive number of 1 or more, with the proviso that when M.sub.a O.sub.b is repeated, the plurality of M's may be the same or different and that a and b may be the same or different; and (IV) a metal oxide represented by the following general formula (2): n'(Q.sub.d O.sub.e) (2) wherein Q represents a metallic element belonging to the group selected from the group consisting of Groups IVa, Va, VIa, VIIa, VIII, Ib and IIb in the Periodic Table; d and e each represents a positive number; and n' represents a positive number of 1 or more, with the proviso that when Q.sub.d O.sub.e is repeated, the plurality of Q's may be the same or different and that d and e may be the same or different.
摘要翻译：一种半导体器件，其通过包含热固性树脂（组分I）和硬化剂（组分II）的热固性树脂组合物包封半导体元件而得到，该组合物具有下述组分III和IV。因此，半导体器件在红外回流步骤和高阻燃性下具有高耐热性，显示出可靠性的显着提高。（III）由以下通式（1）表示的金属氢氧化物：n（MaOb）.cH 2 O（1）其中M表示金属元素; a，b和c各自表示正数; n表示1以上的正数，条件是当重复MaOb时，多个M可以相同或不同，并且a和b可以相同或不同; 和（IV）由以下通式（2）表示的金属氧化物：n'（QdOe）（2）其中Q表示属于选自组IVa，Va，VIa，VIIa， VIII，Ib和IIb; d和e各自表示正数; 并且n'表示1以上的正数，条件是当QdOe重复时，多个Q可以相同或不同，d和e可以相同或不同。

7. 发明申请

US20050027224A1 Pressure-sensitive adhesive component for ankle and use thereof 审中-公开
标题翻译：用于脚踝的压敏粘合剂组分及其用途
公开(公告)号：US20050027224A1
公开(公告)日：2005-02-03
申请号：US10864444
申请日：2004-06-10
申请人： Osamu Oohira , Yoshitada Morikawa , Kotaro Shimobayashi
发明人： Osamu Oohira , Yoshitada Morikawa , Kotaro Shimobayashi
IPC分类号： A61F13/06 , A61F5/00
CPC分类号： A61F13/066
摘要： To provide a pressure-sensitive adhesive component that can be quickly and easily used to fix an ankle joint by persons having no expert knowledge on taping without causing problems such as difficulty in wearing shoes due to thickening upon application of the tape, a pressure-sensitive adhesive component includes a bottom portion; a first tape-shaped body; and a second tape-shaped body, wherein a cut is provided between the first and second tape-shaped bodies running in a longitudinal direction, the first tape-shaped body including a first front tape body and a first rear tape body, and the second tape-shaped body including a second front tape body and a second rear tape body, and wherein a ratio of a width of the front tape body to a width of the rear tape body is within the range of 5:5 to 5:3.
摘要翻译：为了提供可以快速且容易地用于固定踝关节的压敏粘合剂组分，这些人不需要有关胶带的专业知识，而不会引起诸如在施加胶带时由于增稠而难以佩戴鞋子等问题，压敏胶粘合剂组分包括底部; 第一个带状体; 以及第二带状体，其中，在沿着纵向方向延伸的所述第一和第二带状体之间设置有切口，所述第一带状体包括第一前带体和第一后带体，带状体，包括第二前带体和第二后带体，并且其中前带体的宽度与后带体的宽度的比率在5:5至5:3的范围内。

8. 发明授权

US4645297A Fiber reinforced resin coated optical fiber and process for producing the same 失效
标题翻译：纤维增强树脂涂层光纤及其制造方法
公开(公告)号：US4645297A
公开(公告)日：1987-02-24
申请号：US690907
申请日：1985-01-14
申请人： Mitsuo Yoshihara , Yoshitada Morikawa , Yasuo Yamamoto , Mitsuharu Komada , Masaaki Hattori
发明人： Mitsuo Yoshihara , Yoshitada Morikawa , Yasuo Yamamoto , Mitsuharu Komada , Masaaki Hattori
IPC分类号： C03C25/10 , C08F299/02 , G02B6/44 , D02G3/00
CPC分类号： C08F299/026 , G02B6/4436 , Y10T428/2918 , Y10T428/2933 , Y10T428/2938 , Y10T428/294 , Y10T428/2958 , Y10T428/2964 , Y10T428/2967 , Y10T428/2969
摘要： An optical fiber coated with a reinforcing material having an excellent heat resistance and a process for producing the same are disclosed. The reinforcing material comprises continuous filaments having impregnated therein a curable composition comprising(a) tri(meth)acrylate of trishydroxylalkyl isocyanurate,(b) a modified phenol novolak-based resin having (meth)acryloyl groups in the molecule, and(c) a polymerization initiator.
摘要翻译：公开了涂覆有耐热性优异的增强材料的光纤及其制造方法。增强材料包括其中浸渍有可固化组合物的连续长丝，其包含（a）三羟甲基烷基异氰脲酸酯的三（甲基）丙烯酸酯，（b）分子中具有（甲基）丙烯酰基的改性酚醛清漆基树脂和（c）聚合引发剂。

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