会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Method for manufacturing chip resistor
    • 芯片电阻制造方法
    • US07237324B2
    • 2007-07-03
    • US10474419
    • 2003-01-14
    • Toshiki MatsukawaYasuharu KinoshitaShoji HoshitokuMasaharu TakahashiYoshinori Ando
    • Toshiki MatsukawaYasuharu KinoshitaShoji HoshitokuMasaharu TakahashiYoshinori Ando
    • H01C17/06
    • H01C7/003H01C1/142H01C17/006Y10T29/49082Y10T29/49099Y10T29/49101Y10T29/49789
    • A multiple chip resistor is manufactured in the following method. First electrode layers are formed on a first surface of a substrate. Resistor elements electrically connected to the first electrode layers, respectively, are formed on the first surface of the substrate. Slits are formed in the substrate for separating the first electrode layers. Edge electrodes connected to the first electrode layers at the edges of the slits, respectively, are formed on respective edges at the slits of the substrate. The substrate is divided at the slits into strip substrates. Portions of the edge electrodes are removed for electrically isolating the resistor elements from each other. The method provides the edge electrodes on each strip substrate with an improved dimensional accuracy, hence allowing the edge electrodes to be isolated electrically from each other. Consequently, the multiple chip resistor is prevented from being mounted defectively when the resistor is surface-mounted.
    • 以下方法制造多片式电阻器。 第一电极层形成在基板的第一表面上。 电连接到第一电极层的电阻元件分别形成在基板的第一表面上。 在用于分离第一电极层的基板中形成狭缝。 分别在狭缝的边缘处连接到第一电极层的边缘电极在基板的狭缝处的相应边缘上形成。 基板在狭缝处分成带状基板。 去除边缘电极的一部分,以将电阻元件彼此电隔离。 该方法提供了每个带状基板上的边缘电极具有改进的尺寸精度,因此允许边缘电极彼此电隔离。 因此,当电阻器被表面安装时,防止多芯片电阻器被不正确地安装。
    • 9. 发明申请
    • Electronic appliance and fall detection method
    • 电子电器和跌落检测方法
    • US20070121239A1
    • 2007-05-31
    • US10561265
    • 2005-04-22
    • Yoshinori Ando
    • Yoshinori Ando
    • G11B21/02
    • G01P15/18
    • In an electronic appliance, accelerations in X-direction, in Y-direction that is orthogonal relative to the X-direction and in Z-direction that is orthogonal relative to both the X-direction and the Y-direction are synthesized and the size of the synthetic acceleration vector formed by synthesizing the accelerations is detected, associated with the clock time of the detection and stored in a synthetic acceleration memory (4). A fall candidate is detected when the size of the synthetic acceleration vector is stabilized at a value close to a for a predetermined time period and clock time T1 that is associated with the synthetic acceleration vector that has a size equal to predetermined value b and closest to the clock time T1 when the fall candidate is detected is determined by retrieving the sizes of the synthetic acceleration vectors stored in the synthetic acceleration memory (4). Then, the stability of the sizes of the synthetic acceleration vectors from clock time T2 to clock time T1 that corresponds to the size of the synthetic acceleration vector that was stored earliest in the synthetic acceleration memory (4) is detected. Then, the electronic appliance is determined to be falling when a fall candidate is detected and the stability is found within a predetermined range.
    • 在电子设备中,合成X方向的X方向的相对于X方向和Z方向正交的相对于X方向和Y方向正交的Y方向的加速度, 检测通过合成加速度形成的合成加速度矢量,与检测的时钟时间相关联并存储在合成加速度存储器(4)中。 当合成加速矢量的大小稳定在接近预定时间段的值和与具有等于预定值b且最接近的合成加速度矢量的合成加速度矢量相关联的时钟时间T1时,检测到候选坠落 通过检索存储在合成加速度存储器(4)中的合成加速度矢量的大小来确定检测到候选坠落候选的时钟时间T 1。 然后,检测从合成加速度存储器(4)中最早存储的合成加速度矢量的大小对应于从时钟时间T 2到时钟时间T1的合成加速矢量的大小的稳定性。 然后,当检测到坠落候选者并且在预定范围内发现稳定性时,电子设备被确定为下降。