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    • 9. 发明申请
    • Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer
    • 保护半导体晶片和保护半导体晶片的粘合膜的方法
    • US20050164509A1
    • 2005-07-28
    • US11051625
    • 2005-01-27
    • Takanobu KoshimizuMakoto KataokaMasafumi MiyakawaHideki FukumotoYoshihisa Saimoto
    • Takanobu KoshimizuMakoto KataokaMasafumi MiyakawaHideki FukumotoYoshihisa Saimoto
    • H01L21/304C09J7/02G06K19/077H01L21/00H01L21/30H01L21/302H01L21/44H01L21/50H01L21/68
    • H01L21/6835H01L21/6836H01L2221/68327H01L2221/6834
    • The present invention is to provide a protecting method for a semiconductor wafer and an adhesive film for protection of a semiconductor wafer which makes it possible to straighten or avoid warpage in a semiconductor wafer and to prevent breakage of wafers during conveyance of wafers even if the thickness of a semiconductor wafer is thinned to approximately 150 μm or less. The present invention provides a protecting method for a semiconductor wafer in a step of processing a semiconductor wafer comprising a first step of adhering an adhesive film for protection of a semiconductor wafer in which an adhesive layer is formed on one surface of a base film to a circuit-formed surface of the semiconductor wafer, a second step of heating the semiconductor wafer to which the adhesive film for protection of the semiconductor wafer is adhered, a third step of processing a non-circuit-formed surface of the semiconductor wafer by fixing the semiconductor wafer to which the adhesive film for protection of the semiconductor wafer is adhered on a grinding machine or an abrasive machine, and a fourth step of peeling the adhesive film for protection of the semiconductor wafer from the semiconductor wafer.
    • 本发明提供一种用于半导体晶片的保护方法和用于保护半导体晶片的粘合膜,其使得能够矫正或避免半导体晶片中的翘曲并且防止在晶片传送期间晶片的破裂,即使厚度 的半导体晶片减薄到大约150μm或更小。 本发明提供了在半导体晶片的加工步骤中的半导体晶片的保护方法,该方法包括:第一步骤,将用于保护形成在基膜的一个表面上的粘合剂层的半导体晶片的粘合剂膜粘附到 半导体晶片的电路形成表面的第二步骤,加热半导体晶片的第二步骤,用于保护半导体晶片的粘合膜粘附到该半导体晶片上;第三步骤,通过固定半导体晶片的非电路形成表面 将用于保护半导体晶片的粘合膜的半导体晶片粘附在研磨机或研磨机上,以及第四步骤,从半导体晶片剥离用于保护半导体晶片的粘合剂膜。