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1. 发明授权

US07602052B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07602052B2
公开(公告)日：2009-10-13
申请号：US11224982
申请日：2005-09-14
申请人： Satoshi Utsunomiya , Yoshihiro Takano
发明人： Satoshi Utsunomiya , Yoshihiro Takano
IPC分类号： H01L23/495
CPC分类号： H01L23/49558 , H01L23/49503 , H01L23/49551 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.
摘要翻译：为了防止即使使用大尺寸芯片也能够制造的半导体器件小，并且可以形成具有低导通电阻的MOSFET，根据本发明的半导体器件包括树脂封装; 至少两个主引线，其集成在树脂封装内，以构成芯片安装部分; 安装在芯片安装部上的半导体芯片; 以及与形成在半导体芯片的表面上的电极电连接的第一和第二表面引线。主引线和第一和第二表面引线分别沿树脂封装的底表面向外突出。

2. 发明授权

US4913587A Form assembly for making covering wall of tunnel made by shield type excavator 失效
标题翻译：用盾构式挖掘机制作隧道覆盖墙的组装
公开(公告)号：US4913587A
公开(公告)日：1990-04-03
申请号：US226206
申请日：1988-07-29
申请人： Fumitaka Kumai , Yoshihiro Takano
发明人： Fumitaka Kumai , Yoshihiro Takano
IPC分类号： E21D9/06 , E21D11/10
CPC分类号： E21D11/10
摘要： A form structure for making a primary concrete covering wall on the surface of the wall of a tunnel which extends behind a shield type tunnel excavator advanced, wherein a form structure for casting concrete to make the covering wall is assembled with a plurality of arcuate form assemblies respectively including form segments and timbering members for reinforcing the cast and set concrete. The form segments of each assembly are detachably coupled to the timbering members. The form structure is disassembled after the cast concrete is set by detaching the form segments of the respective assemblies from the timbering members to leave the members on the primary covering wall of the set concrete, whereby the primary covering wall can be held in stable state simultaneously with completion of the primary covering wall on the tunnel wall surface.

3. 发明申请

US20060267166A1 Semiconductor device 有权
公开(公告)号：US20060267166A1
公开(公告)日：2006-11-30
申请号：US11224982
申请日：2005-09-14
申请人： Satoshi Utsunomiya , Yoshihiro Takano
发明人： Satoshi Utsunomiya , Yoshihiro Takano
IPC分类号： H01L23/02
CPC分类号： H01L23/49558 , H01L23/49503 , H01L23/49551 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according to the invention includes a resin package; at least two main leads that are integrated within the resin package so as to constitute a chip mounting portion; a semiconductor chip mounted on the chip mounting portion; and first and second surface leads each electrically connected to an electrode formed on a surface of the semiconductor chip. The main leads and the first and second surface leads protrude outward along a bottom surface of the resin package, respectively.

4. 发明授权

US4799824A Method of making covering wall of tunnel made by shield type excavator 失效
标题翻译：盾构式挖掘机隧道覆盖墙方法
公开(公告)号：US4799824A
公开(公告)日：1989-01-24
申请号：US927361
申请日：1986-11-06
申请人： Fumitaka Kumai , Yoshihiro Takano
发明人： Fumitaka Kumai , Yoshihiro Takano
IPC分类号： E21D9/06 , E21D11/10 , E04B1/16
CPC分类号： E21D11/10
摘要： A method of making a primary concrete covering wall on the surface of the wall of a tunnel which extends behind a shield type tunnel excavator. A form structure for casting concrete to make the covering wall is assembled with a plurality of arcuate form assemblies respectively including form segments and timbering members for reinforcing the cast and set concrete. The form segments of each assembly are detachably coupled to the timbering member. The form structure is disassembled after the cast concrete is set by detaching the form segments of the respective assemblies from the timbering members to leave the members on the primary covering wall of the set concrete, whereby the primary covering wall can be held in stable state simultaneously with completion of the primary covering wall on the tunnel wall surface.
摘要翻译：一种在盾构式隧道挖掘机后面延伸的隧道墙壁表面上制作主混凝土覆盖墙的方法。用于铸造混凝土以形成覆盖壁的形式结构组装有多个弓形模板组件，分别包括用于加强铸造和混凝土的模板段和木构件。每个组件的形状段可拆卸地联接到木材构件。通过将各个组件的形状段从木构件上拆下来将构件放置在集合混凝土的主覆盖壁上之后，通过将浇注混凝土固定在浇筑混凝土之后拆卸模板结构，从而使初级覆盖壁可以同时保持在稳定状态完成隧道墙壁上的主覆盖墙。

5. 发明授权

US5278808A Operating unit attaching and removing apparatus for a vehicle-mounted acoustic device 失效
标题翻译：用于车载声学装置的操作单元安装和拆卸装置
公开(公告)号：US5278808A
公开(公告)日：1994-01-11
申请号：US958509
申请日：1992-10-08
申请人： Yoshihiro Takano
发明人： Yoshihiro Takano
IPC分类号： B60R11/02 , G11B25/00 , G11B33/02 , H04B1/20
CPC分类号： B60R11/02 , G11B25/00 , G11B33/02 , H04B1/20
摘要： An operating unit (12) with an insertion opening (11) through which a CD (29) is insertable. A device body (10) with a conveying roller 19 which conveys the CD (29); a lock and release mechanism (22) which locks/releases the operating unit (12) to/from the device body (10); a CD detector (20) which detects the CD (29) present in the insertion opening (11) before the lock and release mechanism (22) releases the operating unit (12); and a microcomputer (21) which causes the conveying roller 19 to load the CD (29) when the CD detector (20) detects the CD (29) present in the insertion opening (11).
摘要翻译：具有可插入CD（29）的插入开口（11）的操作单元（12）。具有传送CD（29）的输送辊19的装置本体（10）; 锁定和释放机构（22），其将所述操作单元（12）锁定/释放到所述装置主体（10）; CD检测器（20），其在锁定和释放机构（22）释放操作单元（12）之前检测存在于插入开口（11）中的CD（29）; 以及当CD检测器（20）检测到存在于插入开口（11）中的CD（29）时使输送辊19装载CD（29）的微型计算机（21）。

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