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    • 2. 发明授权
    • Methods of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US07592227B2
    • 2009-09-22
    • US11481928
    • 2006-07-07
    • Yong-Sun LeeJai-Dong LeeBong-Hyun KimMan-Sug KangJung-Hwan KimHyun-Jin ShinWon-Seok YooSeung-Mok Shin
    • Yong-Sun LeeJai-Dong LeeBong-Hyun KimMan-Sug KangJung-Hwan KimHyun-Jin ShinWon-Seok YooSeung-Mok Shin
    • H01L21/336
    • H01L21/32105H01L21/28273H01L29/42324
    • Example embodiments of the present invention relate to methods of manufacturing a semiconductor device. Other example embodiments of the present invention relate to methods of manufacturing a semiconductor device having a gate electrode. In the method of manufacturing the semiconductor device, a gate electrode may be formed on a semiconductor substrate. Damage in the semiconductor substrate and a sidewall of the gate electrode may be cured, or repaired, by a radical re-oxidation process to form an oxide layer on the semiconductor substrate and the gate electrode. The radical re-oxidation process may be performed by providing a nitrogen gas onto the semiconductor substrate while increasing a temperature of the semiconductor substrate to a first temperature to passivate a surface of the gate electrode under a nitrogen gas atmosphere, providing an oxygen gas onto the semiconductor substrate while increasing the temperature from a first temperature to a second temperature to perform a first oxidation process and/or performing a second oxidation process at the second temperature.
    • 本发明的示例性实施例涉及制造半导体器件的方法。 本发明的其它示例实施例涉及制造具有栅电极的半导体器件的方法。 在制造半导体器件的方法中,可以在半导体衬底上形成栅电极。 可以通过自由基再氧化工艺固化或修复半导体衬底和栅电极的侧壁的损伤,以在半导体衬底和栅电极上形成氧化物层。 可以通过在半导体衬底上提供氮气同时将半导体衬底的温度提高到第一温度以在氮气气氛下钝化栅电极的表面来进行自由基再氧化工艺,从而将氧气提供到 半导体衬底,同时将温度从第一温度升至第二温度,以进行第一氧化工艺和/或在第二温度下进行第二氧化工艺。
    • 8. 发明申请
    • Methods of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US20070010068A1
    • 2007-01-11
    • US11481928
    • 2006-07-07
    • Yong-Sun LeeJai-Dong LeeBong-Hyun KimMan-Sug KangJung-Hwan KimHyun-Jin ShinWon-Seok YooSeung-Mok Shin
    • Yong-Sun LeeJai-Dong LeeBong-Hyun KimMan-Sug KangJung-Hwan KimHyun-Jin ShinWon-Seok YooSeung-Mok Shin
    • H01L21/30H01L21/46
    • H01L21/32105H01L21/28273H01L29/42324
    • Example embodiments of the present invention relate to methods of manufacturing a semiconductor device. Other example embodiments of the present invention relate to methods of manufacturing a semiconductor device having a gate electrode. In the method of manufacturing the semiconductor device, a gate electrode may be formed on a semiconductor substrate. Damage in the semiconductor substrate and a sidewall of the gate electrode may be cured, or repaired, by a radical re-oxidation process to form an oxide layer on the semiconductor substrate and the gate electrode. The radical re-oxidation process may be performed by providing a nitrogen gas onto the semiconductor substrate while increasing a temperature of the semiconductor substrate to a first temperature to passivate a surface of the gate electrode under a nitrogen gas atmosphere, providing an oxygen gas onto the semiconductor substrate while increasing the temperature from a first temperature to a second temperature to perform a first oxidation process and/or performing a second oxidation process at the second temperature.
    • 本发明的示例性实施例涉及制造半导体器件的方法。 本发明的其它示例实施例涉及制造具有栅电极的半导体器件的方法。 在制造半导体器件的方法中,可以在半导体衬底上形成栅电极。 可以通过自由基再氧化工艺固化或修复半导体衬底和栅电极的侧壁的损伤,以在半导体衬底和栅电极上形成氧化物层。 可以通过在半导体衬底上提供氮气同时将半导体衬底的温度提高到第一温度以在氮气气氛下钝化栅电极的表面来进行自由基再氧化工艺,从而将氧气提供到 半导体衬底,同时将温度从第一温度升至第二温度,以进行第一氧化工艺和/或在第二温度下进行第二氧化工艺。