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    • 2. 发明授权
    • Handheld device
    • 手持设备
    • US09000986B2
    • 2015-04-07
    • US12761389
    • 2010-04-15
    • Pei-Ling TengYi-Chun ChenKuo-Cheng ChenChung-Ting Hung
    • Pei-Ling TengYi-Chun ChenKuo-Cheng ChenChung-Ting Hung
    • H01Q1/24H01Q1/48H01Q9/04H01Q9/42
    • H01Q1/243H01Q1/48H01Q9/0421H01Q9/42
    • A handheld device includes an antenna area and an outer frame, wherein the outer frame includes a frame body and a carrier. The antenna area is for transmitting a radio frequency signal with a first wavelength and has a ground part and a feeding part. In addition, the ground part within the antenna area is electrically connected to a ground plane. The frame body of the outer frame has an extended area corresponding to the antenna area to form a projected feeding point. The carrier of the outer frame is disposed at the peripheral area of the opening of the frame body, wherein the peripheral area of the frame body has a first ground point electrically connected to the ground plane, and the spacing between the first ground point and the projected feeding point is correlated to the first wavelength.
    • 手持设备包括天线区域和外框架,其中外框架包括框体和托架。 天线区域用于发射具有第一波长的射频信号,并具有接地部分和馈电部分。 此外,天线区域内的接地部分电连接到接地层。 外框的框体具有对应于天线区域的扩展区域,以形成投影的馈送点。 外框架的载体设置在框架体的开口的周边区域,其中框体的周边区域具有电连接到接地平面的第一接地点和第一接地点与第二接地点之间的间隔 投射点与第一波长相关。
    • 4. 发明申请
    • MANUFACTURING METHOD OF A TEST STRIP
    • 测试条的制造方法
    • US20130228266A1
    • 2013-09-05
    • US13988475
    • 2010-12-10
    • Wen-Pin HsiehCheng-Hsien WangYing-Te WuYi-Chun Chen
    • Wen-Pin HsiehCheng-Hsien WangYing-Te WuYi-Chun Chen
    • B29D99/00
    • B29D99/00B01L3/502707G01N27/3272Y10T156/1052
    • The present invention discloses a manufacturing method of a test strip, which comprises making a first semi-finished product and a second semi-finished product. The manufacturing process of the first semi-finished product comprises: providing a substrate, forming a plurality of electrodes on the substrate, forming a supporting layer with a plurality of channels on the substrate, and providing a reaction material to fill in the channels. The manufacturing process of the second semi-finished product comprises: providing a lid, forming a hydrophilic layer on a first surface of the lid, forming an adhesive layer on the first surface without the hydrophilic layer. Thereafter, a test strip assembly is formed by adhering the channels of the first semi-finished product to the hydrophilic layer of the second semi-finished product. Finally, a plurality of test strips are produced by cutting the test strip assembly along a first axis of the substrate.
    • 本发明公开了一种测试条的制造方法,其包括制造第一半成品和第二半成品。 第一半成品的制造方法包括:提供基板,在基板上形成多个电极,在基板上形成具有多个通道的支撑层,并提供填充通道的反应材料。 第二半成品的制造方法包括:提供盖,在盖的第一表面上形成亲水层,在第一表面上形成粘合层,而不具有亲水层。 此后,通过将第一半成品的通道粘附到第二半成品的亲水层来形成测试条组件。 最后,通过沿着基板的第一轴线切割测试条组件来生产多个测试条。
    • 5. 发明授权
    • Light emitting diode package, lighting device and light emitting diode package substrate
    • 发光二极管封装,照明器件和发光二极管封装衬底
    • US08492777B2
    • 2013-07-23
    • US13078933
    • 2011-04-02
    • Chung-Chuan HsiehYi-Chun ChenYi-Ting Chiu
    • Chung-Chuan HsiehYi-Chun ChenYi-Ting Chiu
    • H01L33/00
    • H01L25/0753H01L33/486H01L33/62H01L2224/48091H01L2924/00014H01L2924/00
    • A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.
    • 发光二极管(LED)封装包括LED封装基板,第一LED芯片和第二LED芯片。 LED封装衬底包括衬底,第一焊盘,第二接合焊盘和第三接合焊盘。 第一,第二和第三接合焊盘设置在基板上。 第二接合焊盘被布置成阵列。 第一和第三接合焊盘分别位于阵列的第一列和最后一列。 第一LED芯片在第一焊盘上被芯片焊接并分别引线接合到布置在阵列的第一列中的第二焊盘。 第二LED芯片分别在第二焊盘上进行裸片焊接。 在除了最后一列之外的每行中,每个第二LED芯片被引线键合到布置在下一列中的第二焊盘。 位于最后一列的第二LED芯片被引线接合到第三焊盘。
    • 10. 发明申请
    • Long-haft bath brush
    • 长澡浴刷
    • US20080155773A1
    • 2008-07-03
    • US11648803
    • 2007-01-03
    • Yi-Chun Chen
    • Yi-Chun Chen
    • A46B5/02A47K7/02
    • A47K7/028A46B2200/1006
    • The present invention discloses a long-haft bath brush, which comprises a long haft and an elastic mesh hose. The elastic mesh hose is used to clean the body. The long haft further comprises a handle portion and an assemblage portion which has a clamp portion and a clamp plate. The clamp portion has an accommodation hole in the central region thereof. Two ends of the clamp plate are to be respectively press-fitted to two ends of the accommodation hole of the clamp portion. In assemblage, one end of the clamp plate is firstly connected to the clamp portion; next, the elastic mesh hose is placed between the clamp plate and the clamp portion; after the position and wrinkles of the elastic mesh hose are arranged well, the free end of the clamp plate is press-fitted into the clamp portion, and the elastic mesh hose is thus secured to the long haft.
    • 本发明公开了一种长方形浴刷,其包括长方形和弹性网状软管。 弹性网状软管用于清洁身体。 长方形还包括手柄部分和具有夹紧部分和夹持板的组合部分。 夹紧部分在其中心区域具有一个容纳孔。 夹板的两端分别压配合到夹紧部分的容纳孔的两端。 在组装时,夹板的一端首先连接到夹紧部分; 接下来,将弹性网状软管放置在夹板与夹紧部之间; 在弹性网状软管的位置和褶皱布置良好之后,将夹板的自由端压配合到夹紧部分中,并且弹性网状软管因此被固定在长边。