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    • 1. 发明申请
    • HANDHELD DEVICE
    • 手持设备
    • US20110037662A1
    • 2011-02-17
    • US12761389
    • 2010-04-15
    • Pei-Ling TengYi-Chun ChenKuo-Cheng ChenChung-Ting Hung
    • Pei-Ling TengYi-Chun ChenKuo-Cheng ChenChung-Ting Hung
    • H01Q1/24
    • H01Q1/243H01Q1/48H01Q9/0421H01Q9/42
    • A handheld device includes an antenna area and an outer frame, wherein the outer frame includes a frame body and a carrier. The antenna area is for transmitting a radio frequency signal with a first wavelength and has a ground part and a feeding part. In addition, the ground part within the antenna area is electrically connected to a ground plane. The frame body of the outer frame has an extended area corresponding to the antenna area to form a projected feeding point. The carrier of the outer frame is disposed at the peripheral area of the opening of the frame body, wherein the peripheral area of the frame body has a first ground point electrically connected to the ground plane, and the spacing between the first ground point and the projected feeding point is correlated to the first wavelength.
    • 手持设备包括天线区域和外框架,其中外框架包括框体和托架。 天线区域用于发射具有第一波长的射频信号,并具有接地部分和馈电部分。 此外,天线区域内的接地部分电连接到接地层。 外框的框体具有对应于天线区域的扩展区域,以形成投影的馈送点。 外框架的载体设置在框架体的开口的周边区域,其中框体的周边区域具有电连接到接地平面的第一接地点和第一接地点与第二接地点之间的间隔 投射点与第一波长相关。
    • 2. 发明授权
    • Handheld device
    • 手持设备
    • US09000986B2
    • 2015-04-07
    • US12761389
    • 2010-04-15
    • Pei-Ling TengYi-Chun ChenKuo-Cheng ChenChung-Ting Hung
    • Pei-Ling TengYi-Chun ChenKuo-Cheng ChenChung-Ting Hung
    • H01Q1/24H01Q1/48H01Q9/04H01Q9/42
    • H01Q1/243H01Q1/48H01Q9/0421H01Q9/42
    • A handheld device includes an antenna area and an outer frame, wherein the outer frame includes a frame body and a carrier. The antenna area is for transmitting a radio frequency signal with a first wavelength and has a ground part and a feeding part. In addition, the ground part within the antenna area is electrically connected to a ground plane. The frame body of the outer frame has an extended area corresponding to the antenna area to form a projected feeding point. The carrier of the outer frame is disposed at the peripheral area of the opening of the frame body, wherein the peripheral area of the frame body has a first ground point electrically connected to the ground plane, and the spacing between the first ground point and the projected feeding point is correlated to the first wavelength.
    • 手持设备包括天线区域和外框架,其中外框架包括框体和托架。 天线区域用于发射具有第一波长的射频信号,并具有接地部分和馈电部分。 此外,天线区域内的接地部分电连接到接地层。 外框的框体具有对应于天线区域的扩展区域,以形成投影的馈送点。 外框架的载体设置在框架体的开口的周边区域,其中框体的周边区域具有电连接到接地平面的第一接地点和第一接地点与第二接地点之间的间隔 投射点与第一波长相关。
    • 6. 发明申请
    • ANTENNA WITH DOUBLE GROUNDINGS
    • 天线与双重接地
    • US20100214191A1
    • 2010-08-26
    • US12484252
    • 2009-06-15
    • Pei-Ling TengYi-Chun Chen
    • Pei-Ling TengYi-Chun Chen
    • H01Q1/48H01Q9/00
    • H01Q9/0421H01Q1/48H01Q9/0428
    • An antenna with double groundings, including a body part, a feeding part, a first grounding part, and a second grounding part, is provided. The body part is electrically connected to the feeding part, the first grounding part, and the second grounding part respectively. The body part is corresponding to a resonance length to transmit and receive a radiation wave with a wavelength at an operating frequency. Wherein, a current path from the first grounding part to the feeding part along the body part is ½ times of the wavelength at the operating frequency, and a relative distance between the second grounding part and the first grounding part is ¼ times of the wavelength at the operating frequency.
    • 提供具有双重接地的天线,包括主体部分,馈电部分,第一接地部分和第二接地部分。 主体部分分别电连接到馈电部分,第一接地部分和第二接地部分。 身体部分对应于用于发送和接收具有工作频率的波长的辐射波的共振长度。 其中,沿着主体部分的从第一接地部分到馈送部分的电流路径是工作频率下的波长的1/2倍,并且第二接地部分和第一接地部分之间的相对距离是波长的1/4倍 工作频率。
    • 8. 发明授权
    • Antenna with double groundings
    • 双天线天线
    • US08228237B2
    • 2012-07-24
    • US12484252
    • 2009-06-15
    • Pei-Ling TengYi-Chun Chen
    • Pei-Ling TengYi-Chun Chen
    • H01Q1/38
    • H01Q9/0421H01Q1/48H01Q9/0428
    • An antenna with double groundings, including a body part, a feeding part, a first grounding part, and a second grounding part, is provided. The body part is electrically connected to the feeding part, the first grounding part, and the second grounding part respectively. The body part is corresponding to a resonance length to transmit and receive a radiation wave with a wavelength at an operating frequency. Wherein, a current path from the first grounding part to the feeding part along the body part is ½ times of the wavelength at the operating frequency, and a relative distance between the second grounding part and the first grounding part is ¼ times of the wavelength at the operating frequency.
    • 提供具有双重接地的天线,包括主体部分,馈电部分,第一接地部分和第二接地部分。 主体部分分别电连接到馈电部分,第一接地部分和第二接地部分。 身体部分对应于用于发送和接收具有工作频率的波长的辐射波的共振长度。 其中,沿着主体部分的从第一接地部分到馈送部分的电流路径是工作频率下的波长的1/2倍,并且第二接地部分和第一接地部分之间的相对距离是波长的1/4倍 工作频率。
    • 9. 发明申请
    • LIGHT EMITTING DIODE PACKAGE, LIGHTING DEVICE AND LIGHT EMITTING DIODE PACKAGE SUBSTRATE
    • 发光二极管封装,照明装置和发光二极管封装基板
    • US20110248289A1
    • 2011-10-13
    • US13078933
    • 2011-04-02
    • Chung-Chuan HsiehYi-Chun ChenYi-Ting Chiu
    • Chung-Chuan HsiehYi-Chun ChenYi-Ting Chiu
    • H01L33/08H01L33/62
    • H01L25/0753H01L33/486H01L33/62H01L2224/48091H01L2924/00014H01L2924/00
    • A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.
    • 发光二极管(LED)封装包括LED封装基板,第一LED芯片和第二LED芯片。 LED封装衬底包括衬底,第一焊盘,第二接合焊盘和第三接合焊盘。 第一,第二和第三接合焊盘设置在基板上。 第二接合焊盘被布置成阵列。 第一和第三接合焊盘分别位于阵列的第一列和最后一列。 第一LED芯片在第一焊盘上被芯片焊接并分别引线接合到布置在阵列的第一列中的第二焊盘。 第二LED芯片分别在第二焊盘上进行裸片焊接。 在除了最后一列之外的每行中,每个第二LED芯片被引线键合到布置在下一列中的第二焊盘。 位于最后一列的第二LED芯片被引线接合到第三焊盘。
    • 10. 发明申请
    • LED street lamp
    • LED路灯
    • US20100172131A1
    • 2010-07-08
    • US12318616
    • 2009-01-02
    • Yun-Chiang MoChia-Hua LiaoYi-Chun ChenYen-Yu HuangChia-Hsiang Chuang
    • Yun-Chiang MoChia-Hua LiaoYi-Chun ChenYen-Yu HuangChia-Hsiang Chuang
    • F21V29/00
    • F21V11/04F21V11/16F21V11/18F21V29/717F21V29/763F21W2131/103F21W2131/105F21Y2115/10Y02B20/72
    • A light-emitting diode (LED) street lamp is applicable for street lighting. The LED street lamp includes a casing, an LED module, and a heat dissipation module. The LED module and the heat dissipation module are arranged inside the casing. The LED module includes a frame, a circuit board carrying a plurality of LEDs, and a light regulation mechanism. The frame and the circuit board are set opposing each other with the light regulation mechanism arranged therebetween to interfere with emission light from the LEDs. The emission light, after being interfered with, is projected outside the casing to realize lighting. The heat dissipation module is in physical engagement with the LED module to remove heat generated by the LEDs. As such, the LED street lamp is provided with a broader range of illumination angle and more uniform brightness, so that the same LED street lamp is applicable to various sites and the heat generated by the LEDs can be efficiently dissipated.
    • 发光二极管(LED)路灯适用于街道照明。 LED路灯包括壳体,LED模块和散热模块。 LED模块和散热模块布置在外壳内。 LED模块包括框架,承载多个LED的电路板和光调节机构。 框架和电路板彼此相对设置,其间布置有光调节机构以干扰来自LED的发射光。 发射光被干扰后,突出到外壳外面实现照明。 散热模块与LED模块物理接合,以消除LED产生的热量。 因此,LED路灯具有更宽的照明角度和更均匀的亮度,使得相同的LED路灯可应用于各种场所,并且可以有效地消散由LED产生的热量。