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    • 3. 发明申请
    • PLASMA GENERATING APPARATUS AND PLASMA GENERATING METHOD
    • 等离子体发生装置和等离子体发生方法
    • US20100236917A1
    • 2010-09-23
    • US12294531
    • 2007-03-29
    • Yasunari Mori
    • Yasunari Mori
    • H05H1/24
    • H05H1/46H01J37/32082H01J37/32183
    • An impedance matching device is provided with a basic element having variable characteristic parameters for impedance matching, and an auxiliary element having variable characteristic parameters. At the time of generating plasma by using the impedance matching device, the characteristic parameters of the basic element of each antenna element are fixed, respectively, and the characteristic parameters of the auxiliary element are adjusted for each antenna element. Thus, in an adjusted status where impedance matching for each antenna element is adjusted, each antenna element of an antenna array is fed with a high frequency signal, an electromagnetic wave is radiated from the antenna element, the characteristic parameters of the basic element of each antenna element are synchronized and adjusted, and the impedances of the whole antenna array are matched.
    • 阻抗匹配装置设置有具有用于阻抗匹配的可变特征参数的基本元件和具有可变特征参数的辅助元件。 在通过使用阻抗匹配装置产生等离子体时,各天线元件的基本元件的特征参数分别固定,并且为每个天线元件调整辅助元件的特性参数。 因此,在调整每个天线元件的阻抗匹配的调整状态下,天线阵列的每个天线元件馈送高频信号,电磁波从天线元件辐射,每个天线元件的基本元件的特征参数 天线元件被同步和调整,并且整个天线阵列的阻抗匹配。
    • 4. 发明申请
    • ATOMIC LAYER DEPOSITION APPARATUS AND THIN FILM FORMING METHOD
    • 原子层沉积装置和薄膜形成方法
    • US20110305836A1
    • 2011-12-15
    • US13203400
    • 2010-03-03
    • Kazutoshi MurataYasunari Mori
    • Kazutoshi MurataYasunari Mori
    • C23C16/458
    • C23C16/45544C23C14/56C23C14/562C23C14/568C23C16/4401C23C16/4409C23C16/45525C23C16/45553C23C16/46C23C16/50C23C16/54H01J37/32752
    • An atomic layer deposition apparatus, which forms a thin film on a substrate, includes a first container that defines a first inner space and includes a substrate carrying-in and carrying-out port and a gas introduction port in different positions, the substrate being carried in and out through the substrate carrying-in and carrying-out port, gas being introduced through the gas introduction port to form the thin film on the substrate, a second container that is provided in the first container to define a second inner space separated from the first inner space, the second container including a first opening, a first moving mechanism that moves the second container in a predetermined direction, and a controller that controls the first moving mechanism such that the second container is moved to a first position where the substrate carrying-in and carrying-out port and the first opening are located opposite each other when the substrate is carried in and out, the controller controlling the first moving mechanism such that the second container is moved to a second position where the gas introduction port and the first opening are located opposite each other when the thin film is formed on the substrate.
    • 在基板上形成薄膜的原子层沉积装置包括:第一容器,其限定第一内部空间,并且包括基板搬入口和排出口;以及气体导入口,位于不同的位置,所述基板被承载 通过所述基板输入和输出端口进出的气体,所述气体通过所述气体引入口引入以在所述基板上形成所述薄膜;第二容器,设置在所述第一容器中,以限定与所述第二内部空间分离的第二内部空间; 所述第一内部空间,所述第二容器包括第一开口,沿预定方向移动所述第二容器的第一移动机构;以及控制器,其控制所述第一移动机构,使得所述第二容器移动到所述第一位置, 当输入和输出基板时,输入和输出端口和第一开口彼此相对定位,控制器控制 e第一移动机构,使得当在基板上形成薄膜时,第二容器移动到第二位置,在第二位置,气体导入口和第一开口彼此相对定位。
    • 6. 发明授权
    • Atomic layer deposition apparatus and thin film forming method
    • 原子层沉积装置和薄膜形成方法
    • US09068261B2
    • 2015-06-30
    • US13203400
    • 2010-03-03
    • Kazutoshi MurataYasunari Mori
    • Kazutoshi MurataYasunari Mori
    • C23C16/455C23C14/56C23C16/458C23C16/52H01J37/32C23C16/50C23C16/44C23C16/46C23C16/54C23C16/06C23C16/22
    • C23C16/45544C23C14/56C23C14/562C23C14/568C23C16/4401C23C16/4409C23C16/45525C23C16/45553C23C16/46C23C16/50C23C16/54H01J37/32752
    • An atomic layer deposition apparatus, which forms a thin film on a substrate, includes a first container that defines a first inner space and includes a substrate carrying-in and carrying-out port and a gas introduction port in different positions, the substrate being carried in and out through the substrate carrying-in and carrying-out port, gas being introduced through the gas introduction port to form the thin film on the substrate, a second container that is provided in the first container to define a second inner space separated from the first inner space, the second container including a first opening, a first moving mechanism that moves the second container in a predetermined direction, and a controller that controls the first moving mechanism such that the second container is moved to a first position where the substrate carrying-in and carrying-out port and the first opening are located opposite each other when the substrate is carried in and out, the controller controlling the first moving mechanism such that the second container is moved to a second position where the gas introduction port and the first opening are located opposite each other when the thin film is formed on the substrate.
    • 在基板上形成薄膜的原子层沉积装置包括:第一容器,其限定第一内部空间,并且包括基板搬入口和排出口;以及气体导入口,位于不同的位置,所述基板被承载 通过所述基板输入和输出端口进出的气体,所述气体通过所述气体引入口引入以在所述基板上形成所述薄膜;第二容器,设置在所述第一容器中,以限定与所述第一内部空间分离的第二内部空间; 所述第一内部空间,所述第二容器包括第一开口,沿预定方向移动所述第二容器的第一移动机构;以及控制器,其控制所述第一移动机构,使得所述第二容器移动到所述第一位置, 当输入和输出基板时,输入和输出端口和第一开口彼此相对定位,控制器控制 e第一移动机构,使得当在基板上形成薄膜时,第二容器移动到第二位置,在第二位置,气体导入口和第一开口彼此相对定位。
    • 7. 发明授权
    • Plasma generating apparatus and plasma generating method
    • 等离子体发生装置和等离子体产生方法
    • US08098016B2
    • 2012-01-17
    • US12294531
    • 2007-03-29
    • Yasunari Mori
    • Yasunari Mori
    • H01J7/24
    • H05H1/46H01J37/32082H01J37/32183
    • An impedance matching device is provided with a basic element having variable characteristic parameters for impedance matching, and an auxiliary element having variable characteristic parameters. At the time of generating plasma by using the impedance matching device, the characteristic parameters of the basic element of each antenna element are fixed, respectively, and the characteristic parameters of the auxiliary element are adjusted for each antenna element. Thus, in an adjusted status where impedance matching for each antenna element is adjusted, each antenna element of an antenna array is fed with a high frequency signal, an electromagnetic wave is radiated from the antenna element, the characteristic parameters of the basic element of each antenna element are synchronized and adjusted, and the impedances of the whole antenna array are matched.
    • 阻抗匹配装置设置有具有用于阻抗匹配的可变特征参数的基本元件和具有可变特征参数的辅助元件。 在通过使用阻抗匹配装置产生等离子体时,各天线元件的基本元件的特征参数分别固定,并且为每个天线元件调整辅助元件的特性参数。 因此,在调整每个天线元件的阻抗匹配的调整状态下,天线阵列的每个天线元件馈送高频信号,电磁波从天线元件辐射,每个天线元件的基本元件的特征参数 天线元件被同步和调整,并且整个天线阵列的阻抗匹配。
    • 9. 发明申请
    • PLASMA GENERATING APPARATUS AND PLASMA FILM FORMING APPARATUS
    • 等离子体生成装置和等离子体膜形成装置
    • US20100095888A1
    • 2010-04-22
    • US12531264
    • 2008-03-28
    • Yasunari MoriKazuki Takizawa
    • Yasunari MoriKazuki Takizawa
    • C23C16/52H05H1/46
    • H01Q21/0006C23C16/509H01J37/32082H01J37/32183H01P5/12H01Q1/26H05H1/46
    • A plasma generating apparatus is provided with an impedance matching member, which is connected to a feeding line that supplies an antenna element with a high frequency signal, and has variable characteristic parameters for impedance matching; a distribution wire, which is arranged corresponding to the impedance matching member and connects the impedance matching member with at least two antenna elements; and a control section which changes at the same time impedance matching statuses of at least the two antenna elements connected to the impedance matching member through the distribution wire by changing the characteristic parameters of the impedance member. Thus, the number of impedance matching devices is smaller than that of the antenna elements, and a mechanism relating to impedance matching is made relatively small.
    • 等离子体发生装置具有阻抗匹配部件,该阻抗匹配部件连接到向天线元件供给高频信号的馈电线路,并且具有用于阻抗匹配的可变特性参数; 配线,其布置成对应于所述阻抗匹配构件并将所述阻抗匹配构件与至少两个天线元件连接; 以及控制部,其通过改变阻抗部件的特性参数,通过分配线同时改变连接到阻抗匹配部件的至少两个天线元件的阻抗匹配状态。 因此,阻抗匹配装置的数量小于天线元件的数量,并且与阻抗匹配有关的机构相对较小。