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    • 1. 发明授权
    • Method for inspecting semiconductor devices on a wafer
    • 在晶片上检查半导体器件的方法
    • US5654632A
    • 1997-08-05
    • US689006
    • 1996-07-30
    • Yasukazu Ohno
    • Yasukazu Ohno
    • G01R31/26H01L21/66G01R31/28
    • H01L22/20
    • A method is disclosed, which sequentially inspects a plurality of semiconductor devices formed on a semiconductor wafer. This method executes a full inspection analysis on the individual devices on the wafer. The full inspection is carried out based on predetermined inspection criteria to determine whether or not the inspected devices are defective or properly functional. The number of devices determined as good ones during the full inspection analysis is sequentially counted, whereas the counted number is reset to zero whenever any device is determined to be defective during the full inspection routine. A simplified inspection analysis is executed on a predetermined number of devices when the counted number reaches a predetermined value. The simplified inspection is carried out against some of all the predetermined inspection criteria to determine whether or not the inspected devices are defects.
    • 公开了一种依次检查形成在半导体晶片上的多个半导体器件的方法。 该方法对晶片上的各个器件执行全面的检查分析。 基于预定的检查标准进行全面检查,以确定检查装置是否有缺陷或正常功能。 在完全检查分析期间被确定为好的装置的数量被顺序地计数,而当在完整的检查程序期间任何装置被确定为有缺陷时,计数的数量被重置为零。 当计数的数量达到预定值时,在预定数量的装置上执行简化的检查分析。 对所有预定检查标准中的一些进行简化检查,以确定被检查装置是否是缺陷。