专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07989941B2 Integrated circuit package system with support structure for die overhang 有权
标题翻译：集成电路封装系统，支撑结构用于模具突出
公开(公告)号：US07989941B2
公开(公告)日：2011-08-02
申请号：US12051267
申请日：2008-03-19
申请人： Chee Keong Chin , Guo Qiang Shen , Ya Ping Wang
发明人： Chee Keong Chin , Guo Qiang Shen , Ya Ping Wang
IPC分类号： H01L23/49 , H01L21/56
CPC分类号： H01L25/16 , H01L23/3121 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48463 , H01L2224/4911 , H01L2224/73257 , H01L2224/73265 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.
摘要翻译：一种集成电路封装系统，包括：提供具有安装在其上的支撑的基板; 在基板上方安装集成电路管芯; 在集成电路模具上方安装引线键合模具，从而形成由支撑件支撑的突出部分; 使用接合线将引线接合的管芯连接到基板上; 并用封装体封装集成电路管芯，引线接合管芯和接合线。

2. 发明授权

US08037918B2 Pick-up heads and systems for die bonding and related applications 有权
标题翻译：拾取头和芯片接合系统及相关应用
公开(公告)号：US08037918B2
公开(公告)日：2011-10-18
申请号：US11633701
申请日：2006-12-04
申请人： Ya Ping Wang , Jian Ming Yang , Guo Qiang Shen , Chee Keong Chin
发明人： Ya Ping Wang , Jian Ming Yang , Guo Qiang Shen , Chee Keong Chin
IPC分类号： B29C65/00 , B32B37/00 , B31F5/00 , B65C9/08 , B65H29/00 , B65G47/91 , B65G1/133 , B66C1/00 , B66C3/00 , A47J45/00
CPC分类号： H01L21/6838 , B32B2038/1891 , Y10T156/10 , Y10T156/17 , Y10T156/1744
摘要： Pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.
摘要翻译：拾取头和系统对于拾取，运输和将半导体管芯放置在封装衬底上的结合位置特别有用。或者，头部和系统对于用各种其他平面物体中的任何一个来执行这些任务是有用的。示例性的头包括柄和身体。主体包括可由柄接触的顺应性端部，并且端部包括面。柄部相对于端部部分是可移动的，使得每当柄部缩回时，面部具有基本上平面的轮廓，并且每当柄部延伸时，柄部接触并推动端部部分，以向脸部提供凸形轮廓。端部部分期望地限定连接到排气装置（例如，真空泵）的至少一个真空孔，其将真空孔充分抽出以使平面物体粘附到面上。

3. 发明申请

US20100117589A1 Charger Slipcover and Handheld Device 有权
标题翻译：充电器滑盖和手持设备
公开(公告)号：US20100117589A1
公开(公告)日：2010-05-13
申请号：US12346029
申请日：2008-12-30
申请人： Ya-Ping Wang , Yi-Feng Sun , Shih-Kuang Tsai
发明人： Ya-Ping Wang , Yi-Feng Sun , Shih-Kuang Tsai
IPC分类号： H02J7/00
CPC分类号： H02J7/35 , H02J7/0044
摘要： A charger slipcover and a handheld device comprising the charger slipcover are disclosed. The charger slipcover is suitable for charging a handheld device. The charger slipcover comprises a cover including a first portion and a second portion, wherein a handheld device body of the handheld device is suitable to being disposed on an inner surface of the second portion; a solar cell panel disposed on an inner surface of the first portion of the cover; and two conductive wires electrically connected to the solar cell panel and the handheld device body.
摘要翻译：公开了一种充电器覆盖件和包括充电器覆盖罩的手持设备。充电器套装适用于对手持设备充电。所述充电器覆盖件包括包括第一部分和第二部分的盖，其中所述手持装置的手持装置主体适于布置在所述第二部分的内表面上; 设置在所述盖的所述第一部分的内表面上的太阳能电池板; 以及电连接到太阳能电池板和手持装置主体的两根导线。

4. 发明申请

US20110248391A1 INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND METHOD OF MANUFACTURE THEREOF 审中-公开
标题翻译：具有引线叠加的集成电路封装系统及其制造方法
公开(公告)号：US20110248391A1
公开(公告)日：2011-10-13
申请号：US12782164
申请日：2010-05-18
申请人： Wei Qiang Jin , Jae Hak Yee , Ya Ping Wang
发明人： Wei Qiang Jin , Jae Hak Yee , Ya Ping Wang
IPC分类号： H01L23/52 , H01L25/065 , H01L21/50
CPC分类号： H01L23/49555 , H01L25/105 , H01L2225/1029 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacture of an integrated circuit package stacking system includes: providing a bottom package including: providing a first lead frame, forming a bottom package body having the first lead frame in an off-centered parting line position, and forming bottom connection leads of the first lead frame for providing coplanar contacts at an end of the bottom connection leads; mounting a top package on the bottom package including: providing a second lead frame, forming a top package body on the second lead frame, and reforming top connection leads of the second lead frame for over-lapping contact areas on the bottom connection leads of the bottom package; and applying a conductive adhesive on the contact areas for electrically connecting the top connection leads and the bottom connection leads.
摘要翻译：一种制造集成电路封装堆叠系统的方法，包括：提供底部封装，包括：提供第一引线框架，形成底部封装主体，其具有处于偏心分离线位置的第一引线框架，并形成底部连接引线用于在底部连接引线的端部提供共面触点的第一引线框架; 将顶部封装安装在所述底部封装上，包括：提供第二引线框架，在所述第二引线框架上形成顶部封装主体，以及重新形成所述第二引线框架的顶部连接引线，以覆盖所述第二引线框架的底部连接引线上的接触区域底部包装以及在用于电连接顶部连接引线和底部连接引线的接触区域上施加导电粘合剂。

5. 发明授权

US08035336B2 Charger slipcover and handheld device 有权
标题翻译：充电器套装和手持设备
公开(公告)号：US08035336B2
公开(公告)日：2011-10-11
申请号：US12346029
申请日：2008-12-30
申请人： Ya-Ping Wang , Yi-Feng Sun , Shih-Kuang Tsai
发明人： Ya-Ping Wang , Yi-Feng Sun , Shih-Kuang Tsai
IPC分类号： H01M10/44 , H02J7/00
CPC分类号： H02J7/35 , H02J7/0044
摘要： A charger slipcover and a handheld device comprising the charger slipcover are disclosed. The charger slipcover is suitable for charging a handheld device. The charger slipcover comprises a cover including a first portion and a second portion, wherein a handheld device body of the handheld device is suitable to being disposed on an inner surface of the second portion; a solar cell panel disposed on an inner surface of the first portion of the cover; and two conductive wires electrically connected to the solar cell panel and the handheld device body.
摘要翻译：公开了一种充电器覆盖件和包括充电器覆盖罩的手持设备。充电器套装适用于对手持设备充电。所述充电器覆盖件包括包括第一部分和第二部分的盖，其中所述手持装置的手持装置主体适于布置在所述第二部分的内表面上; 设置在所述盖的所述第一部分的内表面上的太阳能电池板; 以及电连接到太阳能电池板和手持装置主体的两根导线。

6. 发明申请

US20100036506A1 Position Deviation Adjustment Apparatus For Prosthesis 审中-公开
标题翻译：假体位置偏差调整装置
公开(公告)号：US20100036506A1
公开(公告)日：2010-02-11
申请号：US12188212
申请日：2008-08-08
申请人： Ya-Ping Wang
发明人： Ya-Ping Wang
IPC分类号： A61F2/62
CPC分类号： A61F2/60 , A61F2/76 , A61F2/7812 , A61F2/80 , A61F2002/30341 , A61F2002/30359 , A61F2002/30433 , A61F2002/30434 , A61F2002/30507 , A61F2002/30509 , A61F2002/5023 , A61F2220/0025 , A61F2220/0033 , A61F2220/0041
摘要： A position deviation adjustment apparatus for a prosthesis is provided. The position deviation adjustment apparatus includes a connecting member, a plate lid, an adjustment base, and a receptacle base. The connecting member is concentrically assembled with the plate lid. Then the assembled connecting member and plate lid together are assembled to the adjustment base. The adjustment base is then concentrically fixed to the receptacle base. When the connecting member and the plate lid are not yet fixed, they can be radially moved relative to the adjusting base, for aligning a center line of the connecting member and a center line of the receptacle base. Thereafter, the connecting member and the plate lid are fixed to the adjusting base.
摘要翻译：提供了一种用于假体的位置偏差调节装置。位置偏差调节装置包括连接构件，板盖，调节基座和插座底座。连接构件与板盖同心组装。然后将组装好的连接部件和板盖组装到调整基座上。然后将调节基座同心地固定到容器基座。当连接构件和板盖尚未固定时，它们可以相对于调节底座径向移动，用于使连接构件的中心线与容器底座的中心线对准。此后，连接部件和板盖固定在调整基座上。

7. 发明申请

US20090236751A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OVERHANG 有权
标题翻译：用于DIE OVERHANG的支持结构的集成电路封装系统
公开(公告)号：US20090236751A1
公开(公告)日：2009-09-24
申请号：US12051267
申请日：2008-03-19
申请人： Chee Keong Chin , Guo Qiang Shen , Ya Ping Wang
发明人： Chee Keong Chin , Guo Qiang Shen , Ya Ping Wang
IPC分类号： H01L23/49 , H01L21/56
CPC分类号： H01L25/16 , H01L23/3121 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48463 , H01L2224/4911 , H01L2224/73257 , H01L2224/73265 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.
摘要翻译：一种集成电路封装系统，包括：提供具有安装在其上的支撑的基板; 在基板上方安装集成电路管芯; 在集成电路模具上方安装引线键合模具，从而形成由支撑件支撑的突出部分; 使用接合线将引线接合的管芯连接到基板上; 并用封装体封装集成电路管芯，引线接合管芯和接合线。

8. 发明申请

US20080128081A1 Pick-up heads and systems for die bonding and related applications 有权
标题翻译：拾取头和芯片接合系统及相关应用
公开(公告)号：US20080128081A1
公开(公告)日：2008-06-05
申请号：US11633701
申请日：2006-12-04
申请人： Ya Ping Wang , Jian Ming Yang , Guo Qiang Shen , Chee Keong Chin
发明人： Ya Ping Wang , Jian Ming Yang , Guo Qiang Shen , Chee Keong Chin
IPC分类号： B32B38/18 , B32B38/00 , B32B37/12
CPC分类号： H01L21/6838 , B32B2038/1891 , Y10T156/10 , Y10T156/17 , Y10T156/1744
摘要： Pick-up heads and systems including such heads are disclosed. The pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.
摘要翻译：公开了包括这种头的拾取头和系统。拾取头和系统特别适用于拾取，运输和将半导体管芯放置在封装基板上的结合位置。或者，头部和系统对于用各种其他平面物体中的任何一个来执行这些任务是有用的。示例性的头包括柄和身体。主体包括可由柄接触的顺应性端部，并且端部包括面。柄部相对于端部部分是可移动的，使得每当柄部缩回时，面部具有基本上平面的轮廓，并且每当柄部延伸时，柄部接触并推动端部部分，以向脸部提供凸形轮廓。端部部分期望地限定连接到排气装置（例如，真空泵）的至少一个真空孔，其将真空孔充分抽出以使平面物体粘附到面上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式