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1. 发明授权

US5761801A Method for making a conductive film composite 失效
标题翻译：制备导电膜复合材料的方法
公开(公告)号：US5761801A
公开(公告)日：1998-06-09
申请号：US474439
申请日：1995-06-07
申请人： William F. Gebhardt , Rocco Papalia
发明人： William F. Gebhardt , Rocco Papalia
IPC分类号： H05K3/04 , H05K3/10 , H05K3/38 , H05K3/02
CPC分类号： H05K3/045 , H05K3/107 , H05K3/386 , Y10T29/49153 , Y10T29/49155
摘要： A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it. The method comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness. The laminate may be debossed through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon. This step involves impressing the tool onto the foil layer surface thereby causing the foil layer to impress into the unimpeded thickness of the thermosetting resin layer and retaining one or more of a debossed and embossed pattern in the metal foil and the attached resin film that is complementary to the raised electrical circuit pattern on the tool. The debossed laminate is subjected to conditions that effect one of near-gelation, gelation and cure of the attached resin film and fixes the retained pattern in the metal foil layer and the resin layer of the laminate.
摘要翻译：一种制备薄膜印刷电路板前体的方法，该薄膜印刷电路板前体包含受控流动的电介质热固性树脂薄膜层和导热金属箔层的层压体，其与树脂薄膜的一侧直接粘合，任选地包含支撑层，与树脂层的另一侧接触的纤维，织物和热塑性聚合物中的一种或多种，其中所述介电热固性树脂层具有至少等于与其粘合的箔层的厚度的无阻碍的厚度。该方法包括将导电金属箔层粘合到具有所述无阻碍厚度的介电热固性树脂膜层上。层压体可以通过金属箔层凹陷并且在其上包含凸起的电路图案的工具进入介电热固性树脂膜层。该步骤包括将工具压印在箔层表面上，从而使箔层压入热固性树脂层的无阻碍厚度，并将一个或多个凹陷和压花图案保留在金属箔和附着的树脂膜中，其互补到工具上升高的电路图案。压制的层叠体经受影响附着树脂膜的近凝胶化，凝胶化和固化的条件，并将保留的图案固定在金属箔层和层压体的树脂层中。

2. 发明授权

US5928767A Conductive film composite 失效
标题翻译：导电膜复合材料
公开(公告)号：US5928767A
公开(公告)日：1999-07-27
申请号：US474929
申请日：1995-06-07
申请人： William F. Gebhardt , Rocco Papalia
发明人： William F. Gebhardt , Rocco Papalia
IPC分类号： H05K1/03 , B32B15/08 , H05K3/04 , H05K3/10 , H05K3/38 , B32B3/00
CPC分类号： H05K3/045 , B32B15/08 , H05K3/386 , H05K2201/0133 , H05K2201/0355 , H05K2201/0382 , H05K2203/0108 , H05K2203/1545 , H05K3/107 , Y10S428/901 , Y10T428/24917
摘要： A thin film printed board precursor containing a laminate of a dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it.
摘要翻译：一种薄膜印刷电路板前体，其包含介电热固性树脂膜层和导热金属箔层的层叠体，其与树脂膜的一侧直接粘接，任选地包含一个或多个纤维，织物和与树脂层的另一侧接触的热塑性聚合物，其中介电热固性树脂层具有至少等于与其结合的箔层的厚度的无阻碍的厚度。

3. 发明授权

US5718789A Method for making a debossed conductive film composite 失效
标题翻译：制造压电导电膜复合材料的方法
公开(公告)号：US5718789A
公开(公告)日：1998-02-17
申请号：US483342
申请日：1995-06-07
申请人： William F. Gebhardt , Rocco Papalia
发明人： William F. Gebhardt , Rocco Papalia
IPC分类号： B32B15/08 , H05K3/00 , H05K3/04 , H05K3/10 , H05K3/38 , H05K3/20
CPC分类号： H05K3/045 , H05K3/107 , H05K3/386 , Y10T156/1039 , Y10T29/49155 , Y10T29/49158
摘要： Processing of materials and their combination to produce a thin foil-laminated adhesive dielectric thermosetting resin film and the conversion of it by a mechanical debossing procedure to impart a debossed and/or embossed printed circuit pattern directly thereon. A process for compositing a shaped metal foil containing a debossed electrical circuitry pattern and an thin isotropic uncured and ungelled thermosetting resin film and forming an adhesively joined composite conforming essentially to the shape of the predebossed metal foil. The process comprises placing a shaping tool with a surface possessing an embossed electrical circuitry pattern, as described in the prior art, and forcing the shaped surface and a surface of the metal foil into intimate contact to deform the metal foil to assume essentially the shape of the tool surface. The shaped metal foil is separated from contact with the tool surface. The separated metal foil is placed in contact with a thin isotropic uncured and ungelled thermosetting resin film. It is forced into the film without significantly altering its shape. This causes the film to deform and assume the shape of the foil. The condition associated with the film in contact with the foil are such that the film assumes a set condition and the foil is adhesively bonded to the film.
摘要翻译：处理材料及其组合以生产薄箔层压粘合剂介电热固性树脂薄膜，并通过机械压花方法将其转化，以直接在其上赋予凹陷和/或压花印刷电路图案。一种用于复合含有凹陷电路图案和薄的各向同性的未固化和未胶凝的热固性树脂薄膜的成形金属箔的方法，并形成基本上符合预浸金属箔的形状的粘合的复合材料。该方法包括将成形工具放置在具有压花电路图案的表面上，如现有技术所述，并且强制成形表面和金属箔的表面紧密接触以使金属箔变形为基本上呈工具表面。成形金属箔与工具表面接触分离。分离的金属箔与薄的各向同性的未固化和未凝胶化的热固性树脂膜接触。它被迫进入电影，而不会显着改变其形状。这使得膜变形并呈现箔的形状。与箔接触的膜相关的条件使得膜呈现设定状态，并且箔粘合到膜上。

4. 发明授权

US5731086A Debossable films 失效
标题翻译：可剥夺的电影
公开(公告)号：US5731086A
公开(公告)日：1998-03-24
申请号：US488469
申请日：1995-06-07
申请人： William F. Gebhardt , Rocco Papalia
发明人： William F. Gebhardt , Rocco Papalia
IPC分类号： H05K1/03 , B29C43/02 , B29C59/02 , B32B15/08 , H05K3/04 , H05K3/38 , B32B9/04
CPC分类号： H05K3/045 , B29C43/021 , B32B15/08 , B29C2043/025 , B29K2101/10 , H05K3/386 , Y10T428/24942 , Y10T428/2495 , Y10T428/31504 , Y10T428/31507 , Y10T428/31678 , Y10T428/31786 , Y10T428/31935
摘要： A thin thermosetting resin film that is amenable to being subjected to a debossing procedure that debosses a grooved printed circuit pattern thereon with minimal loss of debossment precision of the grooved pattern, which pattern and the grooving can be cured to produce a thermoset resin film that can be employed for eventually generating a printed board. The thermosetting resin film has the following qualities: a) it is designed for shaping by processes such as stamping, compression molding, transfer molding, injection molding, and the like without the need for constraining flow at the edges of the resin film; b) the resin is nonconductive, i.e., the resin can be used as a dielectric substrate; c) it is a thin film that is sufficiently uniform in thickness in order to provide consistent heat shaping capability across the breadth of the film, and the thickness should be sufficient to accept the shape imposed by the shaping process; d) the film possesses low flow over a broad temperature range so that it does not flow uncontrollably while undergoing cure conditions, and when placed under pressure, only the portions that are superimposed over a groove or cavity in the case of a female mold, or over a protuberance in the case of a male mold, will be caused to flow because of pressure imposed on the film; and e) the film gels or achieves properties similar to a state of gelation, over conditions leading to cure, that satisfy commercial conditions.
摘要翻译：一种薄的热固性树脂膜，其易于经受凹陷过程，在其上凹陷有凹槽的印刷电路图案，其中沟槽图案的凹陷精度降低最小，该图案和切槽可被固化以产生热固性树脂膜，被雇用最终生成印刷电路板。热固性树脂膜具有以下特性：a）通过冲压，压缩成形，传递成型，注射成型等工序进行成型，而不需要在树脂膜的边缘处约束流动; b）树脂是不导电的，即树脂可以用作电介质基片; c）它是一种厚度足够均匀的薄膜，以便在膜的宽度上提供一致的热成型能力，并且厚度应足以接受成型工艺施加的形状; d）薄膜在宽温度范围内具有低流动，使得它在经历固化条件下不会不受控制地流动，并且当放置在压力下时，只有在阴模的情况下叠加在凹槽或空腔上的部分，或在阳模的情况下，由于施加在膜上的压力而导致流动; 和e）膜满足商业条件，凝胶或达到类似于凝胶状态的性质，导致治愈的条件。

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