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1. 发明授权

US4697728A Paper web spreading shoe 失效
标题翻译：纸幅散布鞋
公开(公告)号：US4697728A
公开(公告)日：1987-10-06
申请号：US819343
申请日：1986-01-16
申请人： William D. Sawyer, Sr. , William D. Sawyer, Jr.
发明人： William D. Sawyer, Sr. , William D. Sawyer, Jr.
IPC分类号： B65H23/022 , B65H23/34 , B65H23/10 , D06C3/00
CPC分类号： B65H23/34 , B65H23/022
摘要： A spreader bar shoe mounted on the spreader bar of a paper making machine to smooth the sheet or web of paper prior to it being wound onto the takeup reel at the end of the paper machine. The spreader shoe is in the form of an elongated base of plastic material mounted on the spreader bar with segmental inserts forming a wear resistant strip in the outer surface of the base for engagement by the paper sheet with the segmental inserts being secured in a recess by a resilient interface material in the form of silicone to permit limited relative movement between the brittle insert segments and the plastic base due to differences in thermal expansion of the dissimilar materials of the brittle ceramic inserts and the plastic base.
摘要翻译：安装在造纸机的扩张器条上的扩张器条鞋在纸张或纸幅卷绕到造纸机端部的收紧卷轴上之前使其平滑。吊具鞋是安装在吊具杆上的细长的塑料材料底座的形式，其中节段插入件在基座的外表面中形成耐磨条，用于由纸片接合，而节段插入件通过由硅橡胶形式的弹性界面材料，由于脆性陶瓷嵌件和塑料基座的不同材料的热膨胀差异，允许脆性插入段和塑料基底之间的有限的相对移动。

2. 发明授权

US4714523A Suction roll seal strips with teflon insert 失效
标题翻译：抽吸辊密封条带聚四氟乙烯嵌件
公开(公告)号：US4714523A
公开(公告)日：1987-12-22
申请号：US943043
申请日：1986-12-18
申请人： William D. Sawyer, Jr. , William D. Sawyer, Sr.
发明人： William D. Sawyer, Jr. , William D. Sawyer, Sr.
IPC分类号： D21F3/10
CPC分类号： D21F3/10
摘要： Sealing strips mounted on an internal vacuum box and engaged with the internal surface of a perforated rotatable shell forming a suction roll in a conventional paper making machine are contructed from a body portion of organic material having an outer surface forming an interface with an inner surface of the shell, and a PTFE inlay strip exposed at the outer surface of the sealing strip for rubbing against the interior surface of the shell and smearing across the outer surface of the sealing strip to reduce friction and improve lubrication at the interface.
摘要翻译：安装在内部真空箱上并与传统造纸机中形成抽吸辊的穿孔可旋转壳体的内表面接合的密封条与有机材料的主体部分形成，该有机材料的外表面与内表面形成界面外壳和暴露在密封条的外表面处的PTFE镶嵌条，用于摩擦外壳的内表面并且涂抹在密封条的外表面上以减少摩擦并改善界面处的润滑。

3. 发明授权

US08631700B2 Resonating sensor with mechanical constraints 有权
标题翻译：谐振传感器具有机械约束
公开(公告)号：US08631700B2
公开(公告)日：2014-01-21
申请号：US12940354
申请日：2010-11-05
申请人： Firas N. Sammoura , William D. Sawyer
发明人： Firas N. Sammoura , William D. Sawyer
IPC分类号： G01C19/56
CPC分类号： G01C19/5698
摘要： A method and apparatus for sensing movement resonates a primary member in a flexure mode at a given frequency, thus causing the primary member to have top and bottom portions that resonate at substantially about zero Hertz. The method also secures the bottom portion to a first substrate, and mechanically constrains the top portion while resonating in the flexure mode to substantially eliminate vibrations in the top portion. Finally, the method generates a changing capacitance signal in response to movement of the primary member. When generating this changing capacitance signal, the primary member resonates in a bulk mode at a given frequency.
摘要翻译：用于感测运动的方法和装置以给定的频率以弯曲模式谐振主要构件，从而使主构件具有基本上约为零赫兹共振的顶部和底部。该方法还将底部部分固定到第一基板，并且机械约束顶部部分，同时以弯曲模式共振，以基本上消除顶部部分中的振动。最后，该方法响应于主构件的移动而产生变化的电容信号。当产生这种改变的电容信号时，主要部件以给定的频率以体模式谐振。

4. 发明授权

US06946314B2 Method for microfabricating structures using silicon-on-insulator material 有权
标题翻译：使用绝缘体上硅材料微结构的方法
公开(公告)号：US06946314B2
公开(公告)日：2005-09-20
申请号：US10642315
申请日：2003-08-15
申请人： William D. Sawyer , Jeffrey T. Borenstein
发明人： William D. Sawyer , Jeffrey T. Borenstein
IPC分类号： B81C1/00 , B81C3/00 , H01L20060101 , H01L21/00 , H01L29/06 , H01L21/76
CPC分类号： B81C1/00182 , B81C1/00579 , B81C3/001 , B81C2201/0191
摘要： The invention provides a general fabrication method for producing MicroElectroMechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer. The method includes providing an SOI wafer that has (i) a handle layer, (ii) a dielectric layer, and (iii) a device layer, wherein a mesa etch has been made on the device layer of the SOI wafer, providing a substrate, wherein a pattern has been etched onto the substrate, bonding the SOI wafer and the substrate together, removing the handle layer of the SOI wafer, removing the dielectric layer of the SOI wafer, then performing a structural etch on the device layer of the SOI wafer to define the device.
摘要翻译：本发明提供了使用绝缘体上硅（SOI）晶片生产微电子机械系统（MEMS）和相关器件的一般制造方法。该方法包括提供SOI晶片，其具有（i）手柄层，（ii）电介质层和（iii）器件层，其中在SOI晶片的器件层上进行台面蚀刻，提供衬底其中图案已被蚀刻到衬底上，将SOI晶片和衬底接合在一起，去除SOI晶片的手柄层，去除SOI晶片的电介质层，然后对SOI的器件层进行结构蚀刻晶圆来定义设备。

5. 发明授权

US1588012A Plate-glass holder 失效
标题翻译：平板玻璃支架
公开(公告)号：US1588012A
公开(公告)日：1926-06-08
申请号：US73744024
申请日：1924-09-12
申请人： CHARLES GRICE , WILLIAM D SAWYER
发明人： JAMES CARRIE
IPC分类号： B25B11/00
CPC分类号： B25B11/005 , Y10S409/903

6. 发明申请

US20120195797A1 MEMS Sensors with Closed Nodal Anchors for Operation in an In-Plane Contour Mode 有权
标题翻译：具有闭合节点锚的MEMS传感器，用于在平面轮廓模式下操作
公开(公告)号：US20120195797A1
公开(公告)日：2012-08-02
申请号：US13017247
申请日：2011-01-31
申请人： Andrew Sparks , William D. Sawyer
发明人： Andrew Sparks , William D. Sawyer
IPC分类号： G01N33/00 , G01R3/00 , G01N29/02
CPC分类号： G01N29/022 , G01N29/036 , G01N2291/02818 , G01N2291/0427 , H03H9/1057 , H03H2009/02503 , Y10T29/49007
摘要： A MEMS sensor includes at least one closed nodal anchor along a predetermined closed nodal path on at least one surface of a resonant mass. The resonant mass may be configured to resonate substantially in an in-plane contour mode. Drive and/or sense electrodes may be disposed within a cavity formed at least in part by the resonant mass, the closed nodal anchor, and a substrate.
摘要翻译： MEMS传感器包括沿共振体的至少一个表面上的预定闭合节点路径的至少一个闭合节点锚。共振质量可以被配置为基本上在平面内轮廓模式下谐振。驱动和/或感测电极可以设置在至少部分地由谐振块，闭合节点锚和衬底形成的空腔内。

7. 发明授权

US07655538B2 MEMS device and interposer and method for integrating MEMS device and interposer 有权
标题翻译：用于集成MEMS器件和插入器的MEMS器件和插入器和方法
公开(公告)号：US07655538B2
公开(公告)日：2010-02-02
申请号：US11857720
申请日：2007-09-19
申请人： William D. Sawyer
发明人： William D. Sawyer
IPC分类号： H01L21/58
CPC分类号： B81B7/0048 , B81B2203/0307
摘要： A method for producing Microelectromechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer includes providing an SOI wafer, performing a mesa etch to at least partially define the MEMS device, bonding the SOI wafer to an interposer by direct boding, removing the handle layer of the SOI wafer, removing the oxide layer of the SOI wafer, and further etching the device layer of the SOI wafer to define the MEMS device. A structure manufactured according to the above described processes includes an interposer comprising an SOI wafer and a MEMS device mounted on the interposer. The MEMS device comprises posts extending from a silicon plate. The MEMS device is directly mounted to the interposer by bonding the posts of the MEMS device to the device layer of the interposer.
摘要翻译：使用绝缘体上硅（SOI）晶片制造微机电系统（MEMS）和相关器件的方法包括提供SOI晶片，执行台面蚀刻以至少部分限定MEMS器件，通过直接将SOI晶片连接到插入器去除SOI晶片的手柄层，去除SOI晶片的氧化物层，并进一步蚀刻SOI晶片的器件层以限定MEMS器件。根据上述工艺制造的结构包括内插器，其包括安装在插入件上的SOI晶片和MEMS器件。 MEMS器件包括从硅板延伸的柱。 MEMS器件通过将MEMS器件的柱结合到插入器的器件层而直接安装到插入器。

8. 发明授权

US07172919B2 Method for fabricating a tuning fork gyroscope 有权
标题翻译：音叉陀螺仪的制造方法
公开(公告)号：US07172919B2
公开(公告)日：2007-02-06
申请号：US10970067
申请日：2004-10-20
申请人： Marc S. Weinberg , Anthony S. Kourepenis , William D. Sawyer , Jeffrey T. Borenstein , James H. Connelly , Amy E. Duwel , Christopher M. Lento , James R. Cousens
发明人： Marc S. Weinberg , Anthony S. Kourepenis , William D. Sawyer , Jeffrey T. Borenstein , James H. Connelly , Amy E. Duwel , Christopher M. Lento , James R. Cousens
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , G01C19/5719 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025
摘要： A method for reducing errors in a tuning fork gyroscope includes determining a first distance, gt, between an upper sense plate and a proof mass and a second distance, gb, between a lower sense plate and the proof mass. The method further includes applying a first voltage, Vt, to the upper sense plate and a second voltage, Vb, to the lower sense plate, wherein the ratio of the first voltage and the second voltage is a function of the first distance and the second distance.
摘要翻译：一种用于减少音叉陀螺仪中的误差的方法包括确定上感测板和检测质量之间的第一距离g i，以及第二距离g b，在下感测板和检测质量之间。所述方法还包括向所述下感测板施加第一电压V sub至所述上感测板，并将第二电压V SUB施加到所述下感测板，其中，第一电压和第二电压是第一距离和第二距离的函数。

9. 发明申请

US20120111112A1 Resonating Sensor with Mechanical Constraints 有权
标题翻译：谐振传感器与机械约束
公开(公告)号：US20120111112A1
公开(公告)日：2012-05-10
申请号：US12940354
申请日：2010-11-05
申请人： Firas N. Sammoura , William D. Sawyer
发明人： Firas N. Sammoura , William D. Sawyer
IPC分类号： G01P15/00
CPC分类号： G01C19/5698
摘要： A method and apparatus for sensing movement resonates a primary member in a flexure mode at a given frequency, thus causing the primary member to have top and bottom portions that resonate at substantially about zero Hertz. The method also secures the bottom portion to a first substrate, and mechanically constrains the top portion while resonating in the flexure mode to substantially eliminate vibrations in the top portion. Finally, the method generates a changing capacitance signal in response to movement of the primary member. When generating this changing capacitance signal, the primary member resonates in a bulk mode at a given frequency.
摘要翻译：用于感测运动的方法和装置以给定的频率以弯曲模式谐振主要构件，从而使主构件具有基本上约为零赫兹共振的顶部和底部。该方法还将底部部分固定到第一基板，并且机械约束顶部部分，同时以弯曲模式共振，以基本上消除顶部部分中的振动。最后，该方法响应于主构件的移动而产生变化的电容信号。当产生这种改变的电容信号时，主要部件以给定的频率以体模式谐振。

10. 发明申请

US20110001198A1 MEMS DEVICE AND INTERPOSER AND METHOD FOR INTEGRATING MEMS DEVICE AND INTERPOSER 有权
标题翻译： MEMS器件和插入器以及用于集成MEMS器件和插入器的方法
公开(公告)号：US20110001198A1
公开(公告)日：2011-01-06
申请号：US12697713
申请日：2010-02-01
申请人： William D. Sawyer
发明人： William D. Sawyer
IPC分类号： H01L29/84 , H01L21/02 , H01L21/306
CPC分类号： B81B7/0048 , B81B2203/0307
摘要： A method for producing Microelectromechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer includes providing an SOI wafer, performing a mesa etch to at least partially define the MEMS device, bonding the SOI wafer to an interposer by direct boding, removing the handle layer of the SOI wafer, removing the oxide layer of the SOI wafer, and further etching the device layer of the SOI wafer to define the MEMS device. A structure manufactured according to the above described processes includes an interposer comprising an SOI wafer and a MEMS device mounted on the interposer. The MEMS device comprises posts extending from a silicon plate. The MEMS device is directly mounted to the interposer by bonding the posts of the MEMS device to the device layer of the interposer.
摘要翻译：使用绝缘体上硅（SOI）晶片制造微机电系统（MEMS）和相关器件的方法包括提供SOI晶片，执行台面蚀刻以至少部分限定MEMS器件，通过直接将SOI晶片连接到插入器去除SOI晶片的手柄层，去除SOI晶片的氧化物层，并进一步蚀刻SOI晶片的器件层以限定MEMS器件。根据上述工艺制造的结构包括内插器，其包括安装在插入件上的SOI晶片和MEMS器件。 MEMS器件包括从硅板延伸的柱。 MEMS器件通过将MEMS器件的柱结合到插入器的器件层而直接安装到插入器。

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