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1. 发明申请

US20170213754A1 ELECTROSTATIC CHUCK WITH EXTERNAL FLOW ADJUSTMENTS FOR IMPROVED TEMPERATURE DISTRIBUTION 审中-公开
公开(公告)号：US20170213754A1
公开(公告)日：2017-07-27
申请号：US15481183
申请日：2017-04-06
申请人： Matthew J. Busche , Vijay D. Parkhe , Wendell Boyd, JR. , Senh Thach , Konstantin Makhratchev , Masanori Ono
发明人： Matthew J. Busche , Vijay D. Parkhe , Wendell Boyd, JR. , Senh Thach , Konstantin Makhratchev , Masanori Ono
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/6833 , H01L21/67103 , H01L21/67109 , H01L21/6831 , H05K7/20218
摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat.

2. 发明申请

US20100108641A1 LAVACOAT PRE-CLEAN AND PRE-HEAT 审中-公开
标题翻译： LAVACOAT预清洁和预热
公开(公告)号：US20100108641A1
公开(公告)日：2010-05-06
申请号：US12570219
申请日：2009-09-30
申请人： Brian T. West , Wendell Boyd, JR. , Samantha Tan
发明人： Brian T. West , Wendell Boyd, JR. , Samantha Tan
IPC分类号： B44C1/22
CPC分类号： H01L21/268 , H01J37/32458 , H01J37/32477 , H01J37/32871 , H01L21/02521 , H01L21/02689
摘要： Embodiments described herein provide methods of surface preparation using an electromagnetic beam prior to modification of the surface of a component which advantageously improve the quality of the final texture in those places and correspondingly reduces particle contamination. In one embodiment a method of providing a texture to a surface of a component for use in a semiconductor processing chamber is provided. The method comprises defining a plurality of regions on the surface of a component, moving an electromagnetic beam to a first region of the plurality of regions, scanning the electromagnetic beam across a surface of the first region to heat the surface of the first region, and scanning the electromagnetic beam across the heated surface of the first region to form a feature.
摘要翻译：本文描述的实施例提供了在部件表面改性之前使用电磁束进行表面处理的方法，其有利地提高了在那些位置的最终织构的质量并相应地减少了颗粒污染。在一个实施例中，提供了一种向半导体处理室中使用的部件的表面提供纹理的方法。该方法包括在部件的表面上限定多个区域，将电磁波束移动到多个区域的第一区域，扫描电磁束穿过第一区域的表面以加热第一区域的表面，以及扫描电磁束穿过第一区域的加热表面以形成特征。

3. 发明申请

US20150187626A1 ELECTROSTATIC CHUCK WITH INTERNAL FLOW ADJUSTMENTS FOR IMPROVED TEMPERATURE DISTRIBUTION 有权
标题翻译：具有改善温度分布的内部流量调节的静电卡盘
公开(公告)号：US20150187626A1
公开(公告)日：2015-07-02
申请号：US14145702
申请日：2013-12-31
申请人： Vijay D. Parkhe , Matthew J. Busche , Wendell Boyd, JR. , Senh Thach , Konstantin Makhratchev , Masanori Ono
发明人： Vijay D. Parkhe , Matthew J. Busche , Wendell Boyd, JR. , Senh Thach , Konstantin Makhratchev , Masanori Ono
IPC分类号： H01L21/683
CPC分类号： H01L21/6831 , H01L21/67109 , Y10T137/0318
摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.
摘要翻译：使用外部流量调节描述静电卡盘，以改善温度分布。在一个示例中，设备具有用于静电地夹持硅晶片的电介质盘。冷却板被固定并且热耦合到陶瓷盘。供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。回流室连接到冷却区以从冷却区排出冷却剂。多个可调节的孔口位于供气室和相应的一个冷却区之间，以控制从供气室到冷却区的冷却剂的流量。

4. 发明申请

US20150187625A1 ELECTROSTATIC CHUCK WITH EXTERNAL FLOW ADJUSTMENTS FOR IMPROVED TEMPERATURE DISTRIBUTION 有权
标题翻译：具有改善温度分布的外部流量调节的静电卡盘
公开(公告)号：US20150187625A1
公开(公告)日：2015-07-02
申请号：US14145680
申请日：2013-12-31
申请人： Matthew J. Busche , Vijay De. Parkhe , Wendell Boyd, JR. , Senh Thach , Konstantin Makhratchev , Masanori Ono
发明人： Matthew J. Busche , Vijay De. Parkhe , Wendell Boyd, JR. , Senh Thach , Konstantin Makhratchev , Masanori Ono
IPC分类号： H01L21/683 , H05K7/20
CPC分类号： H01L21/6833 , H01L21/67103 , H01L21/67109 , H01L21/6831 , H05K7/20218
摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.
摘要翻译：使用外部流量调节来描述静电卡盘，以改善温度分布。在一个示例中，设备具有用于静电地夹持硅晶片的电介质盘。冷却板被固定并且热耦合到陶瓷盘。供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。回流通风室联接到冷却区域以从冷却区域排出冷却剂，并且多个流量控制阀定位在供应压力室和相应的一个冷却区域之间，以控制从供气室到冷却区的冷却剂的流量冷却区。

5. 发明申请

US20150070814A1 ELECTROSTATIC CHUCK WITH VARIABLE PIXILATED HEATING 有权
标题翻译：具有可变式加热加热的静电卡盘
公开(公告)号：US20150070814A1
公开(公告)日：2015-03-12
申请号：US14085026
申请日：2013-11-20
申请人： Vijay D. Parkhe , Wendell Boyd, JR.
发明人： Vijay D. Parkhe , Wendell Boyd, JR.
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/67109 , H01L21/67115 , H01L21/67248 , H01L21/6831
摘要： Electrostatic chucks with variable pixelated heating are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A light carrying medium is disposed in the base, the light carrying medium configured to provide pixelated light-based heating capability for the ESC.
摘要翻译：描述了具有可变像素化加热的静电卡盘。例如，静电卡盘（ESC）包括具有前表面和后表面的陶瓷板，前表面用于支撑晶片或基板。基座耦合到陶瓷板的背面。光传送介质设置在基座中，轻载运介质构造成为ESC提供像素化的基于光的加热能力。

6. 发明申请

US20120216833A1 REAL TIME LIQUID PARTICLE COUNTER (LPC) END POINT DETECTION SYSTEM 审中-公开
标题翻译：实时液体计数器（LPC）端点检测系统
公开(公告)号：US20120216833A1
公开(公告)日：2012-08-30
申请号：US13034386
申请日：2011-02-24
申请人： Jiansheng Wang , Barbara Stanczyk , Wendell Boyd, JR. , Kevin A. Papke , Joseph F. Sommers , David Do
发明人： Jiansheng Wang , Barbara Stanczyk , Wendell Boyd, JR. , Kevin A. Papke , Joseph F. Sommers , David Do
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , B08B3/102 , B08B3/14 , H01L21/67288 , H01L21/67724
摘要： Embodiments of the present invention generally relate to a method and apparatus for ex-situ cleaning of a chamber component. More particularly, embodiments of the present invention generally relate to a method and apparatus for endpoint detection during ex-situ cleaning of a chamber component used in a semiconductor processing chamber. In one embodiment, a system for cleaning parts disposed in a liner with a cleaning fluid is provided. The system comprises a portable cart, a liquid particle counter (LPC) carried by the portable cart, the LPC configured for detachable coupling to a fluid outlet port formed through the liner, the LPC operable to sample rinsate solution exiting the line, and a pump carried by the portable cart and configured for fluid coupling to the liner in a detachable manner, the pump operable to recirculate rinsate solution through the liner.
摘要翻译：本发明的实施例一般涉及用于非原位清洁腔室部件的方法和装置。更具体地说，本发明的实施例一般涉及用于在半导体处理室中使用的腔室部件的非原位清洁期间的端点检测的方法和装置。在一个实施例中，提供了一种用于清洁设置在具有清洁流体的衬套中的部件的系统。该系统包括便携式推车，由便携式手推车携带的液体颗粒计数器（LPC），LPC被配置为可拆卸地联接到通过衬套形成的流体出口端口，LPC可操作以对离开管线的冲洗液进行采样;以及泵由便携式手推车携带并且被配置为以可拆卸的方式流体地连接到衬套，所述泵可操作以使冲洗液再循环通过衬套。

7. 发明授权

US09622375B2 Electrostatic chuck with external flow adjustments for improved temperature distribution 有权
公开(公告)号：US09622375B2
公开(公告)日：2017-04-11
申请号：US14145680
申请日：2013-12-31
申请人： Matthew J. Busche , Vijay D. Parkhe , Wendell Boyd, Jr. , Senh Thach , Konstantin Makhratchev , Masanori Ono
发明人： Matthew J. Busche , Vijay D. Parkhe , Wendell Boyd, Jr. , Senh Thach , Konstantin Makhratchev , Masanori Ono
IPC分类号： H01L21/683 , H05K7/20 , H01L21/67
CPC分类号： H01L21/6833 , H01L21/67103 , H01L21/67109 , H01L21/6831 , H05K7/20218
摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

8. 发明授权

US09520315B2 Electrostatic chuck with internal flow adjustments for improved temperature distribution 有权
标题翻译：具有内部流量调节以提高温度分布的静电吸盘
公开(公告)号：US09520315B2
公开(公告)日：2016-12-13
申请号：US14145702
申请日：2013-12-31
申请人： Vijay D. Parkhe , Matthew J. Busche , Wendell Boyd, Jr. , Senh Thach , Konstantin Makhratchev , Masanori Ono
发明人： Vijay D. Parkhe , Matthew J. Busche , Wendell Boyd, Jr. , Senh Thach , Konstantin Makhratchev , Masanori Ono
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/6831 , H01L21/67109 , Y10T137/0318
摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.
摘要翻译：使用外部流量调节来描述静电卡盘，以改善温度分布。在一个示例中，设备具有用于静电地夹持硅晶片的电介质盘。冷却板被固定并且热耦合到陶瓷盘。供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。回流室连接到冷却区以从冷却区排出冷却剂。多个可调节的孔口位于供气室和相应的一个冷却区之间，以控制从供气室到冷却区域的冷却剂流量。

9. 发明授权

US09196514B2 Electrostatic chuck with variable pixilated heating 有权
标题翻译：具有可变像限加热的静电吸盘
公开(公告)号：US09196514B2
公开(公告)日：2015-11-24
申请号：US14085026
申请日：2013-11-20
申请人： Vijay D. Parkhe , Wendell Boyd, Jr.
发明人： Vijay D. Parkhe , Wendell Boyd, Jr.
IPC分类号： H01L21/683 , H01L23/00 , H01L21/67
CPC分类号： H01L21/67109 , H01L21/67115 , H01L21/67248 , H01L21/6831
摘要： Electrostatic chucks with variable pixelated heating are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A light carrying medium is disposed in the base, the light carrying medium configured to provide pixelated light-based heating capability for the ESC.
摘要翻译：描述了具有可变像素化加热的静电卡盘。例如，静电卡盘（ESC）包括具有前表面和后表面的陶瓷板，前表面用于支撑晶片或基板。基座耦合到陶瓷板的背面。光传送介质设置在基座中，轻载运介质构造成为ESC提供像素化的基于光的加热能力。

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