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1. 发明申请

US20200163209A1 CIRCUIT BOARD WITH SUBSTRATE MADE OF SILICONE 审中-公开
公开(公告)号：US20200163209A1
公开(公告)日：2020-05-21
申请号：US16574074
申请日：2019-09-17
申请人： WEN YAO CHANG
发明人： WEN YAO CHANG
IPC分类号： H05K1/03 , H05K1/09
摘要： A circuit board with a substrate made of silicone comprises a silicone substrate made of silicone; an adhering layer adhered on the silicone substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is etched to form with metal circuits. Furthermore, electronic elements are adhered on the metal layer to form as circuits. A packaging silicone layer encapsulates the metal layer and the electronic elements for packaging. The circuit board is a flat plate board or a curled board. The silicone are known as polysiloxanes, and are polymer that includes any synthetic compound made up of repeating unit of siloxane, which is a chain of alternating silicon atoms and oxygen atoms, combined with carbon, hydrogen, and sometimes other elements. The silicone is not silicon atoms as those used in wafer.

2. 发明授权

US10278283B1 Method for forming a circuit board with a substrate made of silicon 有权
公开(公告)号：US10278283B1
公开(公告)日：2019-04-30
申请号：US15841313
申请日：2017-12-14
申请人： Wen Yao Chang
发明人： Wen Yao Chang
IPC分类号： H05K3/02 , H05K3/10 , H05K1/03 , H05K1/09 , H05K3/12 , H05K3/22 , H05K3/30 , H05K1/18 , H05K3/06
摘要： A circuit board with a substrate made of silicon includes a a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer. Furthermore, the method for forming the circuit board with silicon substrate is proposed, in that a method for forming a circuit board suitable for etching and a method for forming a circuit board for screen printing are proposed.

3. 发明申请

US20190191555A1 CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON 审中-公开
公开(公告)号：US20190191555A1
公开(公告)日：2019-06-20
申请号：US16186609
申请日：2018-11-12
申请人： WEN YAO CHANG
发明人： WEN YAO CHANG
IPC分类号： H05K1/03 , H05K1/18 , H05K3/32 , H05K3/12 , H05K1/09
CPC分类号： H05K1/036 , H05K1/09 , H05K1/186 , H05K3/1216 , H05K3/32 , H05K2203/0502
摘要： A circuit board with a substrate made of silicon includes a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is formed with metal circuits by screen printing. Electronic elements are adhered on the metal layer to form as circuits with specific functions. Materials of the adhering layer contains Organic silicon polyester copolymer resin, Ethyl acetate and Organic silicon resin. Material of the metal layer is selected from copper, aluminum, sliver, and gold. A packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. Material of the metal layer is selected from copper, aluminum, sliver, and gold.

4. 发明申请

US20120175403A1 Solder Joint Reflow Process for Reducing Packaging Failure Rate 有权
标题翻译：焊接回流工艺，降低包装失败率
公开(公告)号：US20120175403A1
公开(公告)日：2012-07-12
申请号：US12987702
申请日：2011-01-10
申请人： Chen-Hua Yu , Wen-Yao Chang , Chien Rhone Wang , Kewei Zuo , Chung-Shi Liu
发明人： Chen-Hua Yu , Wen-Yao Chang , Chien Rhone Wang , Kewei Zuo , Chung-Shi Liu
IPC分类号： B23K31/02 , B23K1/00
CPC分类号： H01L24/81 , H01L24/13 , H01L24/75 , H01L2224/13111 , H01L2224/16145 , H01L2224/16225 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/75283 , H01L2224/75501 , H01L2224/75502 , H01L2224/81055 , H01L2224/81097 , H01L2224/81098 , H01L2224/8121 , H01L2224/8123 , H01L2224/81805 , H01L2224/8181 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2224/13139
摘要： In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.
摘要翻译：在回流工艺中，第一工件和第二工件之间的多个焊料凸块熔化。在多个焊料凸块的凝固阶段期间，以第一冷却速度冷却多个焊料凸块。凝固阶段结束后，以比第一冷却速度低的第二冷却速度冷却多个焊锡凸块。

5. 发明授权

US07080574B2 Crank structure for bicycle pedal 失效
标题翻译：自行车踏板的曲柄结构
公开(公告)号：US07080574B2
公开(公告)日：2006-07-25
申请号：US10445834
申请日：2003-05-28
申请人： Wen-Yao Chang
发明人： Wen-Yao Chang
IPC分类号： G05G1/14
CPC分类号： B62M3/08 , B62M3/00 , Y10T74/2164 , Y10T74/2168 , Y10T403/125
摘要： A crank structure for a bicycle pedal. A front outer thread of a cylindrical sleeve has a same rotary direction as an inner thread hole of the crank, and the rear outer thread has the opposite rotary direction to that of the front outer thread. The inner thread rotary direction of the cylindrical sleeve is the same as that of an outer thread of a bolt protruding from a pedal, and opposite edges of the two each has a hole, so that after the front outer thread of the cylindrical sleeve is secured to the thread of a threaded hole in the crank. A nut is used to lock the rear outer thread in order to limit the rotation. The bolt is locked into the inner thread of the hole of the cylindrical sleeve for the assembly in order to attain the effects of securely mounting and easily detaching the crank structure.
摘要翻译：用于自行车踏板的曲柄结构。圆筒形套筒的前外螺纹具有与曲柄的内螺纹孔相同的旋转方向，后外螺纹具有与前外螺纹相反的旋转方向。圆筒形套筒的内螺纹旋转方向与从踏板突出的螺栓的外螺纹方向相同，两者的相对边缘具有孔，使得在圆柱形套筒的前外螺纹固定之后到曲柄中的螺纹孔的螺纹。螺母用于锁定后外螺纹以限制旋转。螺栓被锁定在用于组装的圆柱形套筒的孔的内螺纹中，以便获得牢固地安装并容易地分离曲柄结构的效果。

6. 外观设计

USD399222S Sprocket wheel (2) 失效
公开(公告)号：USD399222S
公开(公告)日：1998-10-06
申请号：US76778
申请日：1997-09-19
申请人： Wen-Yao Chang
设计人： Wen-Yao Chang

7. 发明申请

US20190270294A1 SILICON CONTAINED INTEGRATED STRUCTURE AND THE METHOD FOR FORMING THE SAME 审中-公开
公开(公告)号：US20190270294A1
公开(公告)日：2019-09-05
申请号：US15908839
申请日：2018-03-01
申请人： WEN YAO CHANG
发明人： WEN YAO CHANG
IPC分类号： B32B37/12 , B32B7/12 , B32B25/10 , B32B25/20
摘要： A silicon contained integrated structure and the method for forming the same is proposed, wherein a hot melt glue layer is adhered under a silicon layer. The hot melt glue layer contains a high temperature hot melt glue layer and a low temperature hot melt glue layer. By the high temperature hot melt glue layer, the hot melt glue layer may be combined to the silicon layer, while the low temperature hot melt glue layer cause the whole structure can be combined to an object, such as cloth. Furthermore, the present invention uses silicon as material. It can be formed as various specific shapes by molding manufacturing and then the silicon integrated sheet can be transferred to cloth. The whole process is quick and cost is low. Moreover, silicon is not deformed due to heat and thus it has lower effect to the environment than other conventional used material.

8. 发明申请

US20190191556A1 CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON 审中-公开
公开(公告)号：US20190191556A1
公开(公告)日：2019-06-20
申请号：US16197338
申请日：2018-11-20
申请人： WEN YAO CHANG
发明人： WEN YAO CHANG
IPC分类号： H05K1/03 , H05K1/09 , H05K3/12 , H05K3/22 , H05K3/30 , H05K1/18 , H05K3/06
CPC分类号： H05K1/0306 , H05K1/09 , H05K1/185 , H05K3/067 , H05K3/1216 , H05K3/22 , H05K3/30 , H05K2201/0175 , H05K2203/0502 , H05K2203/0756 , Y10T29/49155
摘要： A circuit board with a substrate made of silicon comprises a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is etched to form with metal circuits. Furthermore, electronic elements are adhered on the metal layer to form as circuits with specific functions. A packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. The circuit board is a flat plate board or a curled board.

9. 发明申请

US20110318140A1 HEIGHT ADJUSTMENT RING SPACER 审中-公开
标题翻译：高度调节环间隔
公开(公告)号：US20110318140A1
公开(公告)日：2011-12-29
申请号：US12822340
申请日：2010-06-24
申请人： Wen-Yao CHANG
发明人： Wen-Yao CHANG
IPC分类号： F16B43/00
CPC分类号： F16B43/009 , B62K21/16
摘要： The present invention relates to a height adjustment ring spacer, including a ring-type gasket with at least one upper ring body and one lower ring body, in which plural staircase-type ladders formed in a side of each of the upper ring bodies and a side of each of the lower ring bodies make the ladders of the upper ring body and the lower ring body individually be placed at different linking engagements to increase or decrease the height in circumferential direction; the features of the present invention are that: there are a recess formed in every ladder of the above upper ring body, and a convex body formed in every ladder of the lower ring body, thus the recess of the upper ring body and the convex body of the lower ring body relatively plug and link each other to avoid the relative movement in circumferential and radial direction therein.
摘要翻译：本发明涉及一种高度调节环间隔件，其包括具有至少一个上环体和一个下环体的环形垫圈，其中形成在每个上环体的一侧的多个阶梯型梯形件和每个下环体的侧面使得上环体和下环体的梯子分别设置在不同的连接接合处以增加或减小圆周方向的高度; 本发明的特征在于：在上述上环体的每个梯子上形成有凹部，在下环体的各梯子上形成有凸状体，因此上环体和凸体的凹部的下环体彼此相对地插塞和连接，以避免其周向和径向方向上的相对运动。

10. 发明申请

US20070261108A1 Service Method and Apparatus by Granting Authorization Before Authentication 审中-公开
标题翻译：验证前授权授权方式和设备
公开(公告)号：US20070261108A1
公开(公告)日：2007-11-08
申请号：US11570365
申请日：2005-06-13
申请人： Chih-Jen Lee , Wen-Yao Chang
发明人： Chih-Jen Lee , Wen-Yao Chang
IPC分类号： H04L29/06
CPC分类号： H04N7/162 , H04L63/08 , H04N21/25875 , H04N21/4325 , H04N21/4383 , H04N21/4384 , H04N21/4542 , H04N21/6582
摘要： In a service method by granting authorization before authentication, a service processing unit receives a service request that includes authentication information, and provides corresponding service. An authentication unit is used to authenticate the authentication information of the service request. A decision control unit is used to determine whether the service request calls for a service that allows pre-authorization. If affirmative, the decision control unit commands the service processing unit to first provide a partial service, simultaneously commands the authentication unit to authenticate the authentication information, and commands the service processing unit to further provide subsequent service upon successful authentication, and to stop the partial service and reject the service request if otherwise. Hence, under the condition that service security is not affected, authentication waiting time is shortened so as to achieve the effect of a faster response to providing service.
摘要翻译：在认证之前授权授权的服务方式中，业务处理单元接收包含认证信息的业务请求，并提供对应的业务。认证单元用于认证服务请求的认证信息。决策控制单元用于确定服务请求是否要求允许预授权的服务。如果肯定，判定控制单元命令服务处理单元首先提供部分服务，同时命令认证单元认证认证信息，并命令服务处理单元在成功认证后进一步提供后续服务，并停止部分否则会拒绝服务请求。因此，在服务安全性不受影响的情况下，认证等待时间缩短，从而实现对提供业务的响应更快的效果。

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