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1. 发明授权

US12052831B2 Wiring board 有权
公开(公告)号：US12052831B2
公开(公告)日：2024-07-30
申请号：US18140769
申请日：2023-04-28
申请人： JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
发明人： Akitoshi Sakaue
IPC分类号： H05K3/46 , H05K1/02 , H05K3/10
CPC分类号： H05K3/46 , H05K1/0298 , H05K3/10 , H05K2203/0502 , Y10T29/49147
摘要： A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 μm.

2. 发明授权

US11688553B2 Multilayer coil and method for manufacturing the same 有权
公开(公告)号：US11688553B2
公开(公告)日：2023-06-27
申请号：US16257156
申请日：2019-01-25
申请人： Murata Manufacturing Co., Ltd.
发明人： Kanto Iida , Naoki Gouchi , Shingo Ito
IPC分类号： H05K1/00 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/16 , H05K1/18 , H05K3/00 , H05K3/30 , H05K3/36 , H05K3/46 , H01F5/00 , H01F17/00 , H01F17/06 , H01F41/04 , H04R9/02 , H04R9/06 , H01F17/02 , C09K19/38 , H05K1/02
CPC分类号： H01F41/042 , C09K19/38 , H01F5/003 , H01F17/02 , H05K1/024 , H05K3/4652 , H01F2005/006 , H05K2201/0141 , H05K2201/0195 , H05K2203/0502
摘要： A method for manufacturing a multilayer coil includes preparing a first substrate by forming a first conductor pattern on a first insulating base material layer, preparing a second substrate by forming a second conductor pattern on a second insulating base material layer, and joining a surface of the first substrate on which the first conductor pattern is formed and a surface of the second substrate on which the second conductor pattern is formed together with only a joining layer made of a thermoplastic resin interposed therebetween. Amounts of deformation of the first and second insulating base material layers are less than that of the joining layer at a fusion temperature. The first and second conductor patterns are each a coil pattern having a coil axis that extends in a lamination direction in which the first substrate and the second substrate are laminated together.

3. 发明公开

US20230147650A1 METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME FINE VIA AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY THE SAME 审中-公开
公开(公告)号：US20230147650A1
公开(公告)日：2023-05-11
申请号：US17984032
申请日：2022-11-09
申请人： TSE CO., LTD
发明人： Byeong Yong LEE , Eun Ha PARK , Weon Bin JANG , Gun Won SEO , Kum Sun PARK , Chung Hyeon KIM
IPC分类号： H05K3/42 , H05K3/26
CPC分类号： H05K3/424 , H05K3/429 , H05K3/26 , H05K2203/0502 , H05K2203/0415 , H05K2203/0723 , H05K2203/0588
摘要： A method for manufacturing a multi-layer circuit board including an extreme fine via according to an embodiment of the disclosure may include: providing a board having one surface on at least a part of which an upper conductive layer is formed and the other surface on at least a part of which a lower conductive layer is formed; forming a lower metal layer on the other surface of the board; forming a first resist layer on the one surface of the board through a photolithography process, and forming a first opening on the first resist layer; forming a metal pillar by plating the first opening by using an electrolytic plating method; removing the first resist layer; forming an insulating layer on a location from which the first resist layer is removed; and evenly polishing the metal pillar and the insulating layer.

4. 发明申请

US20190191555A1 CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON 审中-公开
公开(公告)号：US20190191555A1
公开(公告)日：2019-06-20
申请号：US16186609
申请日：2018-11-12
申请人： WEN YAO CHANG
发明人： WEN YAO CHANG
IPC分类号： H05K1/03 , H05K1/18 , H05K3/32 , H05K3/12 , H05K1/09
CPC分类号： H05K1/036 , H05K1/09 , H05K1/186 , H05K3/1216 , H05K3/32 , H05K2203/0502
摘要： A circuit board with a substrate made of silicon includes a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is formed with metal circuits by screen printing. Electronic elements are adhered on the metal layer to form as circuits with specific functions. Materials of the adhering layer contains Organic silicon polyester copolymer resin, Ethyl acetate and Organic silicon resin. Material of the metal layer is selected from copper, aluminum, sliver, and gold. A packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. Material of the metal layer is selected from copper, aluminum, sliver, and gold.

5. 发明授权

US10021785B2 Printed circuit board and method of manufacturing the same 有权
公开(公告)号：US10021785B2
公开(公告)日：2018-07-10
申请号：US14966442
申请日：2015-12-11
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Myung-Sam Kang , Young-Gwan Ko , Sang-Hoon Kim , Kang-Wook Bong , Hye-Won Jung , Yong-Wan Ji
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46
CPC分类号： H05K1/113 , H05K3/0023 , H05K3/4069 , H05K3/4644 , H05K2203/0502 , H05K2203/0514
摘要： A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.

6. 发明授权

US09820386B2 Plasma etching of solder resist openings 有权
公开(公告)号：US09820386B2
公开(公告)日：2017-11-14
申请号：US15074064
申请日：2016-03-18
申请人： Intel Corporation
发明人： Kristof Darmawikarta , Rahul Jain , Robert Alan May , Sheng Li , Sri Ranga Sai Boyapati
IPC分类号： H05K3/00 , H05K1/09 , H05K1/03
CPC分类号： H05K3/0041 , H05K1/0313 , H05K1/09 , H05K3/0055 , H05K3/3452 , H05K2203/0502 , H05K2203/0548 , H05K2203/0562 , H05K2203/0588 , H05K2203/095
摘要： A method of forming an electronic assembly. The method includes covering a patterned conductive layer that is on a dielectric layer with a solder resist; depositing a metal layer on to the solder resist; depositing a photo resist onto the metal layer; patterning the photo resist; etching the metal layer that is exposed from the photo resist to form a metal mask; removing the photo resist; and plasma etching the solder resist that is exposed from the metal mask. An electronic assembly for securing for an electronic card. The electronic assembly includes a patterned conductive layer that is on a dielectric layer; and a solder resist covering the patterned conductive layer and the dielectric layer, wherein the solder resist includes openings that expose the patterned conductive layer, wherein the openings in the solder resist only have organic material on side walls of the respective openings.

7. 发明申请

US20150264795A1 SUSPENSION BOARD WITH CIRCUIT, PRODUCING METHOD THEREOF, AND POSITIONING METHOD OF SUSPENSION BOARD WITH CIRCUIT 有权
标题翻译：具有电路的悬挂板，其制造方法以及具有电路的悬架板的定位方法
公开(公告)号：US20150264795A1
公开(公告)日：2015-09-17
申请号：US14686143
申请日：2015-04-14
申请人： NITTO DENKO CORPORATION
发明人： Yasunari OOYABU , Tetsuya OHSAWA , Emiko TANI
IPC分类号： H05K1/02 , H05K3/06
CPC分类号： H05K1/02 , G11B5/4826 , G11B5/4833 , G11B5/484 , G11B5/4853 , H05K1/0266 , H05K1/056 , H05K3/0041 , H05K3/06 , H05K3/4092 , H05K2201/09063 , H05K2201/0969 , H05K2203/0502 , H05K2203/0756 , H05K2203/167
摘要： A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
摘要翻译：具有电路的悬挂板包括金属支撑板，层压在金属支撑板上的导电层和介于金属支撑板和导电层之间的通孔层。导电层包括导电图案，以及用作定位基准的参考部分，用于将悬架板放置在负载梁上。

8. 发明授权

US08945686B2 Method for reducing thin films on low temperature substrates 有权
标题翻译：降低低温基板薄膜的方法
公开(公告)号：US08945686B2
公开(公告)日：2015-02-03
申请号：US12411221
申请日：2009-03-25
申请人： Dave S. Pope , Kurt A. Schroder , Ian M. Rawson
发明人： Dave S. Pope , Kurt A. Schroder , Ian M. Rawson
IPC分类号： C23C18/31 , B41M3/00 , C23C18/14 , C23C18/16 , D21H19/02 , B41M7/00 , B41M5/00
CPC分类号： H05K3/1283 , B22F1/0022 , B22F3/10 , B22F2001/0033 , B22F2998/10 , B29C35/0805 , B29C35/10 , B41M3/001 , B41M3/006 , B41M5/0035 , B41M5/0047 , B41M5/0064 , B41M7/0072 , B41M7/0081 , B41M2205/12 , C09D1/04 , C23C18/14 , C23C18/1658 , C23C18/1667 , C23C18/1692 , C23C18/31 , C23C30/00 , D21H19/02 , H05K1/097 , H05K3/12 , H05K2203/0502 , H05K2203/10 , H05K2203/1131 , B22F2007/042 , B22F9/24 , B22F2202/11 , B22F2202/13
摘要： A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.
摘要翻译：公开了一种在基板上制造导电薄膜的方法。最初，还原性金属化合物和还原剂分散在液体中。然后将分散体作为薄膜沉积在基材上。随后将薄膜与衬底一起暴露于脉冲电磁发射以与可还原金属化合物和还原剂发生化学反应，使得薄膜变得导电。

9. 发明申请

US20140363584A1 METHOD OF PRODUCING CURED PRODUCT AND METHOD OF FORMING PATTERN 有权
标题翻译：生产固化产品的方法和形成图案的方法
公开(公告)号：US20140363584A1
公开(公告)日：2014-12-11
申请号：US14366250
申请日：2012-12-12
申请人： CANON KABUSHIKI KAISHA
发明人： Tatsuya Suzuki , Toshiki Ito , Chieko Mihara
IPC分类号： H05K3/00
CPC分类号： H05K3/00 , H01L21/3086 , H05K2203/0502
摘要： The present invention provides a photo-curable composition that requires a small mold-releasing force in a method of producing a cured product and also provides a method of producing a cured product with a small mold-releasing force. The method of producing a cured product includes applying a photo-curable composition onto a base material; pressing a mold to the photo-curable composition to form a pattern in the photo-curable composition; irradiating the photo-curable composition provided with the pattern with first light to generate a cured product having the pattern; and releasing the mold from the cured product, wherein a gas-generating region is formed from a gas-generating agent between the cured product and the mold; the gas-generating region is irradiated with second light to generate a gas in the gas-generating region; and the mold is released from the cured product after the generation of the gas or simultaneously with the generation of the gas.
摘要翻译：本发明提供了在固化物的制造方法中需要小的脱模力的光固化性组合物，还提供了具有小的脱模力的固化物的制造方法。固化物的制造方法包括将光固化性组合物涂布在基材上; 将模具压制到光固化组合物上以在光固化组合物中形成图案; 用第一光照射设置有图案的光固化性组合物，生成具有图案的固化物; 从固化物中脱模，其中在固化物与模具之间由气体发生剂形成气体发生区域; 用第二光照射气体产生区域，以在气体产生区域中产生气体; 并且在产生气体之后或同时产生气体时，模具从固化产物中释放出来。

10. 发明授权

US08380326B2 Insulated implantable electrical circuit 有权
标题翻译：绝缘可植入电路
公开(公告)号：US08380326B2
公开(公告)日：2013-02-19
申请号：US10638989
申请日：2003-08-11
申请人： Robert Greenberg , Neil Hamilton Talbot , Jerry Ok , Jordan Matthew Neysmith
发明人： Robert Greenberg , Neil Hamilton Talbot , Jerry Ok , Jordan Matthew Neysmith
IPC分类号： A61N1/04
CPC分类号： A61B5/04001 , A61B2562/125 , A61N1/0529 , A61N1/0543 , A61N1/0551 , A61N1/0553 , C23C16/01 , C23C16/56 , H05K1/032 , H05K3/007 , H05K3/048 , H05K3/06 , H05K3/28 , H05K3/4676 , H05K2201/0179 , H05K2203/016 , H05K2203/0502 , H05K2203/176 , Y10T29/49124 , Y10T29/49155
摘要： The invention is directed to an implant able insulated electrical circuit that utilizes polyparaxylylene, preferably as Parylene, a known polymer that has excellent living tissue implant characteristics, to provide for chronic implantation of conductive electrical devices, such as stimulators and sensors. The device is thin, flexible, electrically insulated, and stable after long exposure to living tissue. Layers of Parylene may be combined with layers of a polymer, such as polyimide, to yield greater design flexibility in the circuit. Multiple electrical conduction layers may be stacked in the circuit to increase packing density.
摘要翻译：本发明涉及一种植入式绝缘电路，其利用聚对二甲苯，优选作为聚对二甲苯，已知具有优异活体组织植入特征的聚合物，以提供导电电气装置（例如刺激器和传感器）的慢性植入。该设备在长时间暴露于生物体组织之后，薄，柔性，电绝缘和稳定。聚对二甲苯层可以与诸如聚酰亚胺的聚合物层结合，以在电路中产生更大的设计灵活性。多个导电层可以堆叠在电路中以增加堆积密度。

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