会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Segmented memory architecture and systems and methods using the same
    • 分段内存架构和使用相同的系统和方法
    • US06396764B1
    • 2002-05-28
    • US09715669
    • 2000-11-16
    • Wayland Bart Holland
    • Wayland Bart Holland
    • G11C800
    • G11C7/1042G11C7/1006G11C8/16
    • A memory 200 includes a first memory segment 302 comprising an array of rows and columns of memory cells, a selected column of cells in the first segment 302 accessed through a dedicated sense amplifier 304 associated with the first segment. A second memory segment 302 comprises an array of rows and columns of memory cells, a selected column of cells in the second memory segment 302 accessed through a dedicated sense amplifier 304 associated with the second segment. A Read Input/Output line 306a is coupled to the sense amplifier accessing the selected column of the first segment 302 for reading data from the first segment during a selected access cycle. A Write Input/Output line 306b is coupled to the sense amplifier 304 accessing the selected column of the second segment 302 for simultaneously writing data to the second memory segment 302 during the selected access cycle.
    • 存储器200包括包括存储器单元的行和列的阵列的第一存储器段302,通过与第一段相关联的专用读出放大器304访问第一段302中的选定列的单元。 第二存储器段302包括存储器单元的行和列的阵列,通过与第二段相关联的专用读出放大器304访问第二存储器段302中的选定列的单元。 读入输入/输出线306a耦合到访问第一段302的选定列的读出放大器,以在选定的访问周期期间从第一段读取数据。 写入输入/输出线306b耦合到读出放大器304,访问第二段302的选定列,以在所选择的访问周期期间同时将数据写入第二存储器段302。
    • 4. 发明授权
    • Memory architecture and systems and methods using the same
    • 内存架构和使用相同的系统和方法
    • US06418063B1
    • 2002-07-09
    • US09543241
    • 1999-05-14
    • Stephen Earl SeitsingerWayland Bart Holland
    • Stephen Earl SeitsingerWayland Bart Holland
    • G11C1604
    • G11C7/1006G11C7/10
    • A memory architecture 400 includes an array of memory cells partitioned into a plurality of subarrays 401. Each subarray 401 includes a plurality of memory cells organized in rows and columns, each row associated with a conductive wordline 407 and each column associated with a pair of conductive half-bitlines 403. The first sense amplifier 402 is selectively coupled to selected pair of half-bitlines 403. A second sense amplifier 402 is selectively coupled to the selected pair of half-bitlines 403. A first local I/O line 404 is coupled to first sense amplifier 402 and a second local I/O line 404 is coupled to the second sense amplifier 402. First and second sets of global I/O lines 405 are selectively coupled to the first and second I/O lines 404.
    • 存储器架构400包括分成多个子阵列401的存储器单元的阵列。每个子阵列401包括以行和列组织的多个存储器单元,每行与导电字线407相关联,每列与一对导电 第一读出放大器402选择性地耦合到所选择的一对半位线403.第二读出放大器402选择性地耦合到所选择的一对半位线403。第一本地I / O线404被耦合 第一感测放大器402和第二本地I / O线404耦合到第二读出放大器402.第一和第二组全局I / O线405选择性地耦合到第一和第二I / O线404。
    • 9. 发明授权
    • Non-volatile and memory fabricated using a dynamic memory process and method therefor
    • 使用动态存储器处理及其方法制造的非易失性和存储器
    • US06222216B1
    • 2001-04-24
    • US08955045
    • 1997-10-21
    • G. R. Mohan RaoWayland Bart Holland
    • G. R. Mohan RaoWayland Bart Holland
    • H01L2976
    • G06F12/06G11C7/065H01L27/105H01L27/1052Y02D10/13
    • A data processing system having a DRAM and a non-volatile memory, such as a ROM or a programmable ROM (PROM), is implemented on a single integrated circuit using DRAM data processing techniques. The DRAM is manufactured in accordance with known processing techniques. The non-volatile memory is manufactured using the same DRAM manufacturing techniques, with the addition of a processing step in which a first terminal of a stacked capacitor manufactured in accordance with the DRAM process, is coupled to a known-reference voltage. This stacked capacitor structure may be coupled to a known conductor through the formation of a via and the subsequent coupling of a conductor to the stacked capacitor structure through the via. Alternatively, the stacked capacitor structure may be coupled to the known reference voltage through an internal connection to that reference voltage. By using such methodologies, a data processing system is implemented having a DRAM and a non-volatile memory on a single integrated circuit using a same process methodology.
    • 具有DRAM和诸如ROM或可编程ROM(PROM)的非易失性存储器的数据处理系统使用DRAM数据处理技术在单个集成电路上实现。 DRAM根据已知的处理技术制造。 使用相同的DRAM制造技术制造非易失性存储器,通过添加根据DRAM工艺制造的堆叠电容器的第一端子耦合到已知参考电压的处理步骤。 该叠层电容器结构可以通过形成通孔和随后通过通孔将导体耦合到叠层电容器结构而与已知导体耦合。 或者,堆叠的电容器结构可以通过与该参考电压的内部连接而耦合到已知的参考电压。 通过使用这样的方法,使用相同的处理方法在单个集成电路上实现具有DRAM和非易失性存储器的数据处理系统。