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1. 发明授权

US06579792B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US06579792B2
公开(公告)日：2003-06-17
申请号：US09864127
申请日：2001-05-24
申请人： Walterus Theodorus Franciscus Maria De Laat , Johannes Van Wingerden , Petrus Maria Meijer
发明人： Walterus Theodorus Franciscus Maria De Laat , Johannes Van Wingerden , Petrus Maria Meijer
IPC分类号： H01L2144
CPC分类号： H01L21/31116 , H01L21/32137 , H01L21/32139
摘要： The invention relates to a method of manufacturing a semiconductor device, comprising the provision of a substrate (1) having a dielectric layer (2) on this substrate (1), a conductive layer (3) on the dielectric layer (2), an inorganic anti-reflection coating (4) on the conductive layer (3), and a resist mask (6) on the inorganic anti-reflection coating (4). The method further comprises the following steps: patterning the inorganic anti-reflection coating (4) by means of the resist mask (6), patterning the conductive layer (3) by etching down to the dielectric layer (2), removing the resist mask (6), and removing the inorganic anti-reflection coating (4). According to the invention, the inorganic anti-reflection coating (4) is removed by means of a dry etch, using a polymerizing gas. It is achieved by this that no or hardly any changes in the critical dimension will occur.
摘要翻译：本发明涉及一种制造半导体器件的方法，包括在该衬底（1）上提供具有电介质层（2）的衬底（1），介电层（2）上的导电层（3），在导电层（3）上的无机抗反射涂层（4）和无机防反射涂层（4）上的抗蚀剂掩模（6）。该方法还包括以下步骤：通过抗蚀剂掩模（6）对无机抗反射涂层（4）进行图案化，通过向下蚀刻到电介质层（2）来图案化导电层（3），除去抗蚀剂掩模（6），并除去无机防反射涂层（4）。根据本发明，通过使用聚合气体的干蚀刻除去无机抗反射涂层（4）。通过这一点可以实现，临界尺寸不会发生或几乎不发生任何变化。

2. 发明申请

US20090001493A1 ELECTRONIC IMAGING DEVICE 审中-公开
标题翻译：电子成像装置
公开(公告)号：US20090001493A1
公开(公告)日：2009-01-01
申请号：US12196813
申请日：2008-08-22
申请人： Anton Petrus Maria VAN ARENDONK , Arjen Gerben SIJDE , Leendert BRUIN , Walterus Theodorus Franciscus Maria DE LAAT
发明人： Anton Petrus Maria VAN ARENDONK , Arjen Gerben SIJDE , Leendert BRUIN , Walterus Theodorus Franciscus Maria DE LAAT
IPC分类号： H01L31/0232
CPC分类号： H01L27/14692 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： An electronic imaging device includes a base layer containing electrical functional circuitry, the base layer having a first side for interconnection of the circuitry and a second side which serves as a photo-detection side. The second side has exposed photosensitive electrical elements arranged in the base layer. Spacers of a predetermined height are provided adjacent to said second side. The spacers can advantageously be used for gaining control over the tolerance of a desired distance between a lens of a lens system and said photo-detection side. Thus, individual focusing of the lens system of each imager device after completion of production is no longer needed. Moreover, an air gap that improves the performance of the micro-lenses may be formed.
摘要翻译：一种电子成像装置包括一个包含电功能电路的基层，该基层具有用于电路互连的第一侧和用作光检测侧的第二面。第二面露出了设置在基层中的感光电元件。与所述第二侧相邻设置预定高度的间隔物。间隔物可以有利地用于获得对透镜系统的透镜和所述光检测侧之间的期望距离的公差的控制。因此，不再需要在完成生产之后每个成像器装置的透镜系统的个体聚焦。此外，可以形成改善微透镜的性能的气隙。

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