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1. 发明授权

US08388790B2 Multilayered body comprising an electroconductive polymer layer and method for the production thereof 有权
标题翻译：包含导电聚合物层的多层体及其制备方法
公开(公告)号：US08388790B2
公开(公告)日：2013-03-05
申请号：US12309517
申请日：2007-07-19
申请人： Ulrich Schindler , Walter Lehnberger
发明人： Ulrich Schindler , Walter Lehnberger
IPC分类号： B44C1/17
CPC分类号： B32B37/02 , B32B37/025 , B32B37/203 , B32B2307/202 , B32B2307/204 , B32B2457/12 , B32B2519/02 , Y10T156/1041 , Y10T428/24413 , Y10T428/24802 , Y10T428/24909 , Y10T428/31678 , Y10T428/31855
摘要： There is described a process for the production of a multilayer body (4) having an electrically conductive layer (421) arranged on a carrier layer (41), in which there is provided a transfer film (5) having a transfer layer (52) of an electrically conductive polymer. The electrically conductive layer is transferred from the transfer film (5) on to the multilayer body (4). There are also provided a transfer film and a multilayer body produced in accordance with the process.
摘要翻译：描述了一种生产具有布置在载体层（41）上的导电层（421）的多层体（4）的方法，其中提供了具有转移层（52）的转移膜（5）的导电聚合物。导电层从转印膜（5）转移到多层体（4）上。还提供了根据该方法生产的转移膜和多层体。

2. 发明申请

US20100078065A1 MULTILAYERED BODY COMPRISING AN ELECTROCONDUCTIVE POLYMER LAYER AND METHOD FOR THE PRODUCTION THEREOF 有权
标题翻译：包含电极聚合物层的多层结构体及其生产方法
公开(公告)号：US20100078065A1
公开(公告)日：2010-04-01
申请号：US12309517
申请日：2007-07-19
申请人： Ulrich Schindler , Walter Lehnberger
发明人： Ulrich Schindler , Walter Lehnberger
IPC分类号： B32B3/10 , B32B15/04 , B32B27/00 , B32B37/00 , C23C14/34 , B32B15/08 , H01L31/02
CPC分类号： B32B37/02 , B32B37/025 , B32B37/203 , B32B2307/202 , B32B2307/204 , B32B2457/12 , B32B2519/02 , Y10T156/1041 , Y10T428/24413 , Y10T428/24802 , Y10T428/24909 , Y10T428/31678 , Y10T428/31855
摘要： There is described a process for the production of a multilayer body (4) having an electrically conductive layer (421) arranged on a carrier layer (41), in which there is provided a transfer film (5) having a transfer layer (52) of an electrically conductive polymer. The electrically conductive layer is transferred from the transfer film (5) on to the multilayer body (4). There are also provided a transfer film and a multilayer body produced in accordance with the process.
摘要翻译：描述了一种生产具有布置在载体层（41）上的导电层（421）的多层体（4）的方法，其中提供了具有转移层（52）的转移膜（5）的导电聚合物。导电层从转印膜（5）转移到多层体（4）上。还提供了根据该方法生产的转移膜和多层体。

3. 发明申请

US20090231203A1 Antenna Configuration and Use Thereof 失效
标题翻译：天线配置和使用
公开(公告)号：US20090231203A1
公开(公告)日：2009-09-17
申请号：US12302555
申请日：2007-05-26
申请人： Jurgen Ficker , Heinrich Wild , Wolfgang Clemens , Walter Lehnberger , Markus Lorenz
发明人： Jurgen Ficker , Heinrich Wild , Wolfgang Clemens , Walter Lehnberger , Markus Lorenz
IPC分类号： H01Q1/38 , H01P11/00 , H01Q9/16
CPC分类号： H01Q1/2225 , G06K19/07749 , G06K19/07779 , G06K19/07783 , H01Q7/00 , Y10T29/49018
摘要： The invention relates to an antenna configuration, comprising at least one electrically insulating carrier substrate and at least one electrically conductive layer applied on at least one side of the carrier substrate, the electrically conductive layer having a first area region and a second area region, and the first area region of the electrically conductive layer having the form of at least one antenna structure. The at least one antenna structure is present in a manner electrically insulated from the second area region of the electrically conductive layer, and the second area region of the electrically conductive layer is subdivided, at least in regions directly adjacent to the at least one antenna structure, into island regions that are at least electrically insulated from one another. The at least one antenna configuration is suitable for use for contactlessly coupled transponders, in particular for RFID Tags or Smart Tags.
摘要翻译：本发明涉及一种天线配置，其包括至少一个电绝缘载体衬底和施加在载体衬底的至少一侧上的至少一个导电层，该导电层具有第一区域区域和第二区域区域，以及所述导电层的第一区域区域具有至少一个天线结构的形式。至少一个天线结构以与导电层的第二区域区域电绝缘的方式存在，并且导电层的第二区域区域至少在与至少一个天线结构相邻的区域中被细分至少彼此电绝缘的岛状区域。至少一个天线配置适用于非接触耦合的应答器，特别是用于RFID标签或智能标签。

4. 发明授权

US08098208B2 Antenna configuration and use thereof 失效
标题翻译：天线配置及其使用
公开(公告)号：US08098208B2
公开(公告)日：2012-01-17
申请号：US12302555
申请日：2007-05-26
申请人： Jurgen Ficker , Heinrich Wild , Wolfgang Clemens , Walter Lehnberger , Markus Lorenz
发明人： Jurgen Ficker , Heinrich Wild , Wolfgang Clemens , Walter Lehnberger , Markus Lorenz
IPC分类号： H01Q1/38
CPC分类号： H01Q1/2225 , G06K19/07749 , G06K19/07779 , G06K19/07783 , H01Q7/00 , Y10T29/49018
摘要： The invention relates to an antenna configuration, comprising at least one electrically insulating carrier substrate and at least one electrically conductive layer applied on at least one side of the carrier substrate, the electrically conductive layer having a first area region and a second area region, and the first area region of the electrically conductive layer having the form of at least one antenna structure. The at least one antenna structure is present in a manner electrically insulated from the second area region of the electrically conductive layer, and the second area region of the electrically conductive layer is subdivided, at least in regions directly adjacent to the at least one antenna structure, into island regions that are at least electrically insulated from one another. The at least one antenna configuration is suitable for use for contactlessly coupled transponders, in particular for RFID Tags or Smart Tags.
摘要翻译：本发明涉及一种天线配置，其包括至少一个电绝缘载体衬底和施加在载体衬底的至少一侧上的至少一个导电层，该导电层具有第一区域区域和第二区域区域，以及所述导电层的第一区域区域具有至少一个天线结构的形式。至少一个天线结构以与导电层的第二区域区域电绝缘的方式存在，并且导电层的第二区域区域至少在与至少一个天线结构相邻的区域中被细分至少彼此电绝缘的岛状区域。至少一个天线配置适用于非接触耦合的应答器，特别是用于RFID标签或智能标签。

5. 发明授权

US08077114B2 Process for the production of an electrically conductive structure 失效
标题翻译：制造导电结构的方法
公开(公告)号：US08077114B2
公开(公告)日：2011-12-13
申请号：US12163442
申请日：2008-06-27
申请人： Walter Lehnberger , Michael Rohm
发明人： Walter Lehnberger , Michael Rohm
IPC分类号： H01Q1/38 , H05K1/11 , H05K3/24
CPC分类号： H05K3/241 , H05K1/111 , H05K2201/09381 , H05K2201/09781 , H05K2201/10636 , Y02P70/611 , Y10T29/49169 , Y10T428/24612
摘要： The invention concerns a process for the production of an electrically conductive structure on a carrier substrate comprising at least two conductor track portions spaced in a region of a width b over the entire width b at between 500 μm and 1 μm and a multi-layer film body. A conductive layer in the form of the conductor track portions is produced on the surface of the carrier substrate. A metallic coating forming the electrically conductive structure is deposited on the conductive layer by application of a flow of current in an electrolyte which contains a dissolved coating metal. In the production of the conductive layer the conductive layer is additionally produced in the form of conductor track extensions which are arranged on both sides of the conductor track portions and which are convexly curved away from the oppositely disposed conductor track portion.
摘要翻译：本发明涉及一种用于在载体基底上制造导电结构的方法，该方法包括在整个宽度b为500μm和1μm之间的宽度为b的区域间隔开的至少两个导体轨道部分和多层膜身体。导体轨迹部分形式的导电层在载体基片的表面上产生。形成导电结构的金属涂层通过在含有溶解的涂覆金属的电解质中施加电流而沉积在导电层上。在导电层的制造中，导电层另外以导体轨道延伸部的形式制造，导体轨道延伸部布置在导体轨道部分的两侧，并且远离相对设置的导体轨道部分凸出地弯曲。

6. 发明申请

US20090053508A1 Method for producing a partially shaped electrically conductive structure 审中-公开
标题翻译：用于制造部分成形的导电结构的方法
公开(公告)号：US20090053508A1
公开(公告)日：2009-02-26
申请号：US11918815
申请日：2006-04-26
申请人： Walter Lehnberger , Heinrich Wild
发明人： Walter Lehnberger , Heinrich Wild
IPC分类号： B32B5/16 , B05D5/12
CPC分类号： H05K3/102 , G03G5/16 , H05K2203/052 , Y10T428/25 , Y10T428/256
摘要： There is described a process for the production of a partially shaped electrically conductive structure on a carrier substrate (16), wherein it is provided that a latent magnetic image of the graphic form of the electrically conductive structure, which latent magnetic image is formed from magnetic image points (11m) and non-magnetic image points, is produced from a digital data set which defines the graphic form of the electrically conductive structure on a magnetisable printing form (11), and that by means of the printing form (11) magnetic particles having an electrically conductive surface, which are attracted by the magnetic image points are arranged by the lateral magnetic image to afford the graphic form of the electrically conductive structure on the carrier substrate (16) and are fixed there. A multi-layer body produced with that process is further described.
摘要翻译：描述了在载体基板（16）上制造部分成形的导电结构的方法，其中提供导电结构的图形形式的潜在磁性图像，该潜在磁图像由磁性图像点（11m）和非磁性图像点由数字数据集产生，该数字数据集限定了可磁化印刷形式（11）上的导电结构的图形，并且通过印刷形式（11）磁性由磁性图像点吸引的具有导电表面的颗粒通过横向磁图像布置，以在载体基板（16）上提供导电结构的图形形式并且固定在那里。进一步描述用该工艺生产的多层体。

7. 发明申请

US20090004437A1 Process for the production of an electrically conductive structure 失效
标题翻译：制造导电结构的方法
公开(公告)号：US20090004437A1
公开(公告)日：2009-01-01
申请号：US12163442
申请日：2008-06-27
申请人： Walter Lehnberger , Michael Rohm
发明人： Walter Lehnberger , Michael Rohm
IPC分类号： B32B3/00 , B05D5/12
CPC分类号： H05K3/241 , H05K1/111 , H05K2201/09381 , H05K2201/09781 , H05K2201/10636 , Y02P70/611 , Y10T29/49169 , Y10T428/24612
摘要： The invention concerns a process for the production of an electrically conductive structure on a carrier substrate comprising at least two conductor track portions spaced in a region of a width b over the entire width b at between 500 μm and 1 μm and a multi-layer film body. A conductive layer in the form of the conductor track portions is produced on the surface of the carrier substrate. A metallic coating forming the electrically conductive structure is deposited on the conductive layer by application of a flow of current in an electrolyte which contains a dissolved coating metal. In the production of the conductive layer the conductive layer is additionally produced in the form of conductor track extensions which are arranged on both sides of the conductor track portions and which are convexly curved away from the oppositely disposed conductor track portion.
摘要翻译：本发明涉及一种用于在载体基底上制造导电结构的方法，该方法包括在500μm和1μm之间的整个宽度b上在宽度为b的区域间隔开的至少两个导体轨迹部分和多层膜身体。导体轨迹部分形式的导电层在载体基片的表面上产生。形成导电结构的金属涂层通过在含有溶解的涂覆金属的电解质中施加电流而沉积在导电层上。在导电层的制造中，导电层另外以导体轨道延伸部的形式制造，导体轨道延伸部布置在导体轨道部分的两侧，并且远离相对设置的导体轨道部分凸出地弯曲。

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