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    • 1. 发明授权
    • Process for the production of an electrically conductive structure
    • 制造导电结构的方法
    • US08077114B2
    • 2011-12-13
    • US12163442
    • 2008-06-27
    • Walter LehnbergerMichael Rohm
    • Walter LehnbergerMichael Rohm
    • H01Q1/38H05K1/11H05K3/24
    • H05K3/241H05K1/111H05K2201/09381H05K2201/09781H05K2201/10636Y02P70/611Y10T29/49169Y10T428/24612
    • The invention concerns a process for the production of an electrically conductive structure on a carrier substrate comprising at least two conductor track portions spaced in a region of a width b over the entire width b at between 500 μm and 1 μm and a multi-layer film body. A conductive layer in the form of the conductor track portions is produced on the surface of the carrier substrate. A metallic coating forming the electrically conductive structure is deposited on the conductive layer by application of a flow of current in an electrolyte which contains a dissolved coating metal. In the production of the conductive layer the conductive layer is additionally produced in the form of conductor track extensions which are arranged on both sides of the conductor track portions and which are convexly curved away from the oppositely disposed conductor track portion.
    • 本发明涉及一种用于在载体基底上制造导电结构的方法,该方法包括在整个宽度b为500μm和1μm之间的宽度为b的区域间隔开的至少两个导体轨道部分和多层膜 身体。 导体轨迹部分形式的导电层在载体基片的表面上产生。 形成导电结构的金属涂层通过在含有溶解的涂覆金属的电解质中施加电流而沉积在导电层上。 在导电层的制造中,导电层另外以导体轨道延伸部的形式制造,导体轨道延伸部布置在导体轨道部分的两侧,并且远离相对设置的导体轨道部分凸出地弯曲。
    • 2. 发明申请
    • Process for the production of an electrically conductive structure
    • 制造导电结构的方法
    • US20090004437A1
    • 2009-01-01
    • US12163442
    • 2008-06-27
    • Walter LehnbergerMichael Rohm
    • Walter LehnbergerMichael Rohm
    • B32B3/00B05D5/12
    • H05K3/241H05K1/111H05K2201/09381H05K2201/09781H05K2201/10636Y02P70/611Y10T29/49169Y10T428/24612
    • The invention concerns a process for the production of an electrically conductive structure on a carrier substrate comprising at least two conductor track portions spaced in a region of a width b over the entire width b at between 500 μm and 1 μm and a multi-layer film body. A conductive layer in the form of the conductor track portions is produced on the surface of the carrier substrate. A metallic coating forming the electrically conductive structure is deposited on the conductive layer by application of a flow of current in an electrolyte which contains a dissolved coating metal. In the production of the conductive layer the conductive layer is additionally produced in the form of conductor track extensions which are arranged on both sides of the conductor track portions and which are convexly curved away from the oppositely disposed conductor track portion.
    • 本发明涉及一种用于在载体基底上制造导电结构的方法,该方法包括在500μm和1μm之间的整个宽度b上在宽度为b的区域间隔开的至少两个导体轨迹部分和多层膜 身体。 导体轨迹部分形式的导电层在载体基片的表面上产生。 形成导电结构的金属涂层通过在含有溶解的涂覆金属的电解质中施加电流而沉积在导电层上。 在导电层的制造中,导电层另外以导体轨道延伸部的形式制造,导体轨道延伸部布置在导体轨道部分的两侧,并且远离相对设置的导体轨道部分凸出地弯曲。