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1. 发明授权

US06742117B1 IC card and method of using IC card 失效
标题翻译： IC卡和使用IC卡的方法
公开(公告)号：US06742117B1
公开(公告)日：2004-05-25
申请号：US09341697
申请日：1999-07-26
申请人： Junichi Hikita , Yoshihiro Ikefuji , Toyokazu Komuro
发明人： Junichi Hikita , Yoshihiro Ikefuji , Toyokazu Komuro
IPC分类号： G06K1900
CPC分类号： G07F7/1008 , G06F12/1408 , G06F2211/007 , G06Q20/341 , G06Q20/355
摘要： A private key write control unit (48) permits writing of a private key just once into a private key storage unit (36) after initialization. Similarly, a particular data write control unit (42) permits writing of particular data only once into a data storage unit (34) after initialization. Since a person other than the IC card manufacturer can write in a private key or particular data after the fabrication stage of the IC card, flexibility in the application of IC cards can be ensured. Also, improper usage of a card can be prevented since the written data is inhibited of being rewritten. The IC card manufacturer can initialize the data storage unit (34) and the private key storage unit (36) by a data initialization unit (44) and a private key initialization unit (46). Therefore, the cost of an IC card can be reduced by allowing reusage of IC cards.
摘要翻译：私钥写入控制单元（48）允许在初始化之后将私钥写入私钥存储单元（36）。类似地，特定数据写入控制单元（42）允许在初始化之后将特定数据仅写入数据存储单元（34）。由于IC卡制造商以外的人员可以在IC卡的制造阶段之后写入私钥或特定数据，所以可以确保应用IC卡的灵活性。此外，可以防止卡的不正确使用，因为禁止写入的数据被重写。 IC卡制造商可以通过数据初始化单元（44）和专用密钥初始化单元（46）来初始化数据存储单元（34）和专用密钥存储单元（36）。因此，可以通过重新使用IC卡来降低IC卡的成本。

2. 发明申请

US20090236137A1 Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board 失效
标题翻译：形成抗蚀剂图案的方法，生产电路板和电路板的方法
公开(公告)号：US20090236137A1
公开(公告)日：2009-09-24
申请号：US12227377
申请日：2006-05-17
申请人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
发明人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
IPC分类号： H05K1/11 , G03F7/20
CPC分类号： H05K3/426 , H05K1/116 , H05K3/002 , H05K3/108 , H05K2201/09545 , H05K2203/0191 , H05K2203/0574 , H05K2203/1184 , H05K2203/1394
摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.
摘要翻译：提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路板。一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法图案和电路板。

3. 发明授权

US08143533B2 Method for forming resist pattern, method for producing circuit board, and circuit board 失效
标题翻译：抗蚀剂图案形成方法，电路基板的制造方法以及电路基板
公开(公告)号：US08143533B2
公开(公告)日：2012-03-27
申请号：US12227377
申请日：2006-05-17
申请人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
发明人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
IPC分类号： H05K1/03
CPC分类号： H05K3/426 , H05K1/116 , H05K3/002 , H05K3/108 , H05K2201/09545 , H05K2203/0191 , H05K2203/0574 , H05K2203/1184 , H05K2203/1394
摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.
摘要翻译：提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路板。一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法图案和电路板。

4. 发明授权

US07679004B2 Circuit board manufacturing method and circuit board 有权
标题翻译：电路板制造方法和电路板
公开(公告)号：US07679004B2
公开(公告)日：2010-03-16
申请号：US10598524
申请日：2005-03-02
申请人： Katsuya Fukase , Toyoaki Sakai , Munetoshi Irisawa , Toyokazu Komuro , Yasuo Kaneda , Masanori Natsuka , Wakana Aizawa
发明人： Katsuya Fukase , Toyoaki Sakai , Munetoshi Irisawa , Toyokazu Komuro , Yasuo Kaneda , Masanori Natsuka , Wakana Aizawa
IPC分类号： H01R12/04 , H05K1/00
CPC分类号： H05K3/064 , H05K1/116 , H05K3/0094 , H05K3/061 , H05K3/065 , H05K3/108 , H05K3/421 , H05K3/427 , H05K2201/09381 , H05K2201/09563 , H05K2201/09581 , H05K2201/098 , H05K2203/0517 , H05K2203/0577 , H05K2203/0582 , H05K2203/1184 , H05K2203/1394
摘要： As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.
摘要翻译：作为在电路基板的制造方法中解决在形成抗蚀剂层和电镀抗蚀剂层时的取向引起的焊盘和孔的位置偏移的问题的方法，提供了一种方法，制造电路板，包括以下步骤：在表面上具有导电层的绝缘基板的表面上形成第一树脂层和通孔或/或非通孔的内壁，形成第二树脂层，所述第二树脂层在设置在表面导电层上的第一树脂层上的第一树脂层的显影液中不溶或微溶，用第一树脂层的显影液除去设在孔上的第一树脂层，制造电路板，包括对第一树脂层的表面均匀充电以对设置在孔上的第一树脂层引起电位差的步骤，在形成第二树脂层之前，在表面导电层上设置阴极层。此外，提供一种电路板，其具有位置偏移小且精度高的孔。

5. 发明申请

US20070181994A1 Circuit board manufacturing method and circuit board 有权
标题翻译：电路板制造方法和电路板
公开(公告)号：US20070181994A1
公开(公告)日：2007-08-09
申请号：US10598524
申请日：2005-03-02
申请人： Katsuya Fukase , Toyoaki Sakai , Munetoshi Irisawa , Toyokazu Komuro , Yasuo Kaneda , Masanori Natsuka , Wakana Aizawa
发明人： Katsuya Fukase , Toyoaki Sakai , Munetoshi Irisawa , Toyokazu Komuro , Yasuo Kaneda , Masanori Natsuka , Wakana Aizawa
IPC分类号： H01L23/12 , H01L21/00
CPC分类号： H05K3/064 , H05K1/116 , H05K3/0094 , H05K3/061 , H05K3/065 , H05K3/108 , H05K3/421 , H05K3/427 , H05K2201/09381 , H05K2201/09563 , H05K2201/09581 , H05K2201/098 , H05K2203/0517 , H05K2203/0577 , H05K2203/0582 , H05K2203/1184 , H05K2203/1394
摘要： As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.
摘要翻译：作为在电路基板的制造方法中解决在形成抗蚀剂层和电镀抗蚀剂层时的取向引起的焊盘和孔的位置偏移的问题的方法，提供了一种方法，制造电路板，包括以下步骤：在表面上具有导电层的绝缘基板的表面上形成第一树脂层和通孔或/或非通孔的内壁，形成第二树脂层，所述第二树脂层在设置在表面导电层上的第一树脂层上的第一树脂层的显影液中不溶或微溶，用第一树脂层的显影液除去设在孔上的第一树脂层，制造电路板，包括对第一树脂层的表面均匀充电以对设置在孔上的第一树脂层引起电位差的步骤，在形成第二树脂层之前，在表面导电层上设置阴极层。此外，提供一种电路板，其具有位置偏移小且精度高的孔。

6. 发明授权

US06551753B1 Liquid developing method of printed wiring board 失效
标题翻译：印刷电路板液体显影方法
公开(公告)号：US06551753B1
公开(公告)日：2003-04-22
申请号：US09550310
申请日：2000-04-14
申请人： Masanori Natsuka , Yasuo Kaneda , Munetoshi Irisawa , Toyokazu Komuro , Noritaka Inoue , Kenji Hyodo
发明人： Masanori Natsuka , Yasuo Kaneda , Munetoshi Irisawa , Toyokazu Komuro , Noritaka Inoue , Kenji Hyodo
IPC分类号： G03G1310
CPC分类号： G03G13/22 , H05K3/065
摘要： There is disclosed a liquid developing method of a printed wiring board using a one-surface stepwise developing system which forms a resist pattern stepwisely according to an electrophotographic reverse developing method on each surface of a material to be developed obtained by forming photo-conductive layers on both surfaces of a both-surfaces copper-clad laminated board, wherein the method comprises the steps of subjecting to a static charging treatment on a surface to which no electrostatic latent image is formed which surface is positioned opposing to an electrostatic latent image-formed surface which is a surface to be exposed, or to a non-developing surface between completion of an exposure treatment and before a liquid toner developing treatment, and subjecting to the liquid toner developing treatment to form a toner image corresponding to the resist pattern on the electrostatically latent image-formed surface.
摘要翻译：公开了一种使用单面逐步显影系统的印刷电路板的液体显影方法，所述单面逐步显影系统根据电子照相反显影方法在通过在其上形成光导层获得的待显影材料的每个表面上逐步形成抗蚀剂图案两面覆铜层压板的两面，其特征在于，所述方法包括以下步骤：在不与静电潜像形成表面相对的表面上形成没有静电潜像的表面进行静电充电处理即在曝光处理完成之前和在液体调色剂显影处理之前的待曝光表面或非显影表面，以及进行液体调色剂显影处理以在静电上形成对应于抗蚀剂图案的调色剂图像潜像形成表面。

7. 发明授权

US06478228B1 Card mounted with circuit chip and circuit chip module 失效
标题翻译：卡片安装有电路芯片和电路芯片模块
公开(公告)号：US06478228B1
公开(公告)日：2002-11-12
申请号：US09331190
申请日：1999-06-24
申请人： Yoshihiro Ikefuji , Shigemi Chimura , Toyokazu Komuro
发明人： Yoshihiro Ikefuji , Shigemi Chimura , Toyokazu Komuro
IPC分类号： G06K1906
CPC分类号： G06K19/07747 , G06K19/07728 , G06K19/07745 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07783 , H01L2224/48091 , H01L2924/01039 , H01L2924/19041 , H01L2924/3011 , H01L2924/00014
摘要： A highly rigid ceramic frame (38) is embedded in a layer of a core member (34). An IC chip (42) is held inside (38a) via an elastic member (40). IC chip 42 arranged inside (38a) will not be greatly deformed even when a strong bending, torsional, or pressing force is applied to the IC card (30). An impact, when exerted on the IC card (30), will not be directly conveyed to the IC chip (42). A coil (44) formed by printing and the like is provided at an upper end face (38b) of the ceramic frame (38). The coil (44) is connected to the IC chip (42) by a wire (46). By forming the IC chip (42), the ceramic frame (38) and the coil (44) integrally in advance, the workability in fabrication is improved. Therefore, a circuit chip mounted card of high reliability and low fabrication cost can be provided.
摘要翻译：高度刚性的陶瓷框架（38）嵌入在芯构件（34）的层中。 IC芯片（42）经由弹性部件（40）保持在内部（38a）内。即使当对IC卡（30）施加强烈的弯曲，扭转或按压力时，布置在内部（38a）内的IC芯片42也不会发生大的变形。当施加在IC卡（30）上时的影响将不会直接传送到IC芯片（42）。通过印刷等形成的线圈（44）设置在陶瓷框架（38）的上端面（38b）处。线圈（44）通过线（46）连接到IC芯片（42）。通过预先一体地形成IC芯片（42），陶瓷框架（38）和线圈（44），提高了制造中的可加工性。因此，可以提供高可靠性和低制造成本的电路芯片安装卡。

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