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1. 发明授权

US08776451B2 Extendible structure 失效
标题翻译：可扩展结构
公开(公告)号：US08776451B2
公开(公告)日：2014-07-15
申请号：US13126880
申请日：2009-11-05
申请人： Akihito Watanabe , Hiroaki Ito , Toshiyuki Hori , Nobuyoshi Kawabata
发明人： Akihito Watanabe , Hiroaki Ito , Toshiyuki Hori , Nobuyoshi Kawabata
IPC分类号： E04H12/34 , H01Q1/08 , H01Q1/12 , E04H12/18 , E04H15/20
CPC分类号： H01Q1/087 , B64G1/222 , B64G1/66 , E04H12/185 , E04H15/20 , H01Q1/1235 , H01Q1/288
摘要： An extendible structure which includes an elongated extendible member having elasticity, and a storage part that serves to store the extendible member by winding it up, wherein a tip end of the extendible member can be extended from the storage part in a one-dimensional manner, so that an extendible part thus extended becomes a hollow tubular structure. The extendible member is composed of three divided extendible members so that the extendible part of the hollow tubular structure is divided into three parts, and the individual divided extendible members are constructed such that their tip end portions are joined with one another, and at the same time, their base end portions are wound around individual storage parts, respectively, independently from each other. Surface fasteners are each provided on a side of each of the divided extendible members.
摘要翻译：一种可延伸的结构，其包括具有弹性的细长的可延伸部件，以及用于通过卷绕所述可延伸部件来存储所述可延伸部件的存储部件，其中所述可延伸部件的末端可以以一维方式从所述存储部件延伸，使得如此延伸的可延伸部分变成中空管状结构。可延伸构件由三个可分开的可延伸构件组成，使得中空管状结构的可延伸部分被分成三部分，并且各个分开的可延伸构件被构造成使得它们的前端部彼此接合，时间，它们的基端部分别彼此独立地缠绕在各个存储部件上。表面紧固件各自设置在每个分开的可延伸构件的一侧。

2. 发明申请

US20080014683A1 Wiring base, semiconductor device, manufacturing method thereof and electronic equipment 有权
标题翻译：接线基座，半导体器件，其制造方法和电子设备
公开(公告)号：US20080014683A1
公开(公告)日：2008-01-17
申请号：US11879993
申请日：2007-07-19
申请人： Toshiyuki Hori
发明人： Toshiyuki Hori
IPC分类号： H01L21/52
CPC分类号： H01L24/81 , H01L23/49838 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is mounted to the wiring base. The electrodes and the wiring pattern face one another and are electrically connected. The wiring base and the semiconductor chip are bonded by curing the resin paste. The wiring pattern includes a wiring that continuously includes two or more first parts located inside a semiconductor chip mounting region and a second part that connects at least two of the first parts. The second part is located outside the semiconductor chip mounting region.
摘要翻译：提供一种制造半导体器件的方法。将树脂膏施加到包括布线图案的布线基底。然后，将具有多个电极的半导体芯片安装在布线基板上。电极和布线图形彼此面对并电连接。通过固化树脂浆料来接合布线基底和半导体芯片。布线图案包括连续地包括位于半导体芯片安装区域内的两个或更多个第一部分的布线和连接至少两个第一部分的第二部分。第二部分位于半导体芯片安装区域的外部。

3. 发明申请

US20110253827A1 EXTENDIBLE STRUCTURE 失效
标题翻译：可扩展的结构
公开(公告)号：US20110253827A1
公开(公告)日：2011-10-20
申请号：US13126880
申请日：2009-11-05
申请人： Akihito Watanabe , Hiroaki Ito , Toshiyuki Hori , Nobuyoshi Kawabata
发明人： Akihito Watanabe , Hiroaki Ito , Toshiyuki Hori , Nobuyoshi Kawabata
IPC分类号： B65H75/00
CPC分类号： H01Q1/087 , B64G1/222 , B64G1/66 , E04H12/185 , E04H15/20 , H01Q1/1235 , H01Q1/288
摘要： An extendible structure which includes an elongated extendible member having elasticity, and a storage part that serves to store the extendible member by winding it up, wherein a tip end of the extendible member can be extended from the storage part in a one-dimensional manner, so that an extendible part thus extended becomes a hollow tubular structure. The extendible member is composed of three divided extendible members so that the extendible part of the hollow tubular structure is divided into three parts, and the individual divided extendible members are constructed such that their tip end portions are joined with one another, and at the same time, their base end portions are wound around individual storage parts, respectively, independently from each other. Surface fasteners are each provided on a side of each of the divided extendible members.
摘要翻译：一种可延伸的结构，其包括具有弹性的细长的可延伸部件，以及用于通过卷绕所述可延伸部件来存储所述可延伸部件的存储部件，其中所述可延伸部件的末端可以以一维方式从所述存储部件延伸，使得如此延伸的可延伸部分变成中空管状结构。可延伸构件由三个可分开的可延伸构件组成，使得中空管状结构的可延伸部分被分成三部分，并且各个分开的可延伸构件被构造成使得它们的前端部彼此接合，时间，它们的基端部分别彼此独立地缠绕在各个存储部件上。表面紧固件各自设置在每个分开的可延伸构件的一侧。

4. 发明授权

US07547580B2 Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region 有权
标题翻译：一种制造半导体布线基板的方法，该半导体布线基底包括具有在安装区域内部和外部延伸的布线的布线基底
公开(公告)号：US07547580B2
公开(公告)日：2009-06-16
申请号：US11879993
申请日：2007-07-19
申请人： Toshiyuki Hori
发明人： Toshiyuki Hori
IPC分类号： H01L21/58
CPC分类号： H01L24/81 , H01L23/49838 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is mounted to the wiring base. The electrodes and the wiring pattern face one another and are electrically connected. The wiring base and the semiconductor chip are bonded by curing the resin paste. The wiring pattern includes a wiring that continuously includes two or more first parts located inside a semiconductor chip mounting region and a second part that connects at least two of the first parts. The second part is located outside the semiconductor chip mounting region.
摘要翻译：提供一种制造半导体器件的方法。将树脂膏施加到包括布线图案的布线基底。然后，将具有多个电极的半导体芯片安装在布线基板上。电极和布线图形彼此面对并电连接。通过固化树脂浆料来接合布线基底和半导体芯片。布线图案包括连续地包括位于半导体芯片安装区域内的两个或更多个第一部分的布线和连接至少两个第一部分的第二部分。第二部分位于半导体芯片安装区域的外部。

5. 发明申请

US20070270337A1 Pharmaceutical Compositions for Preventing or Treating Th1-Mediated Immune Diseases 审中-公开
标题翻译：用于预防或治疗Th1介导的免疫疾病的药物组合物
公开(公告)号：US20070270337A1
公开(公告)日：2007-11-22
申请号：US10560378
申请日：2004-06-11
申请人： Toshiyuki Hori
发明人： Toshiyuki Hori
IPC分类号： A61K38/17 , A61P37/02
CPC分类号： A61K38/2242
摘要： [Problems] The present invention provides a pharmaceutical composition for preventing or treating Th1-mediated immune diseases. [Means for Solving] There is obtained a pharmaceutical composition provided for prevention or treatment of Th1-mediated immune diseases, which comprises as an active ingredient a substance capable of acting on the NP receptor GC-A expressed on dendritic cells to enhance cGMP production and thereby driving T cells to differentiate into Th2-type cells by regulating cytokine production from dendritic cells.
摘要翻译：本发明提供了用于预防或治疗Th1介导的免疫疾病的药物组合物。 [解决手段]获得了用于预防或治疗Th1介导的免疫疾病的药物组合物，其包含能够作用于在树突状细胞上表达的NP受体GC-A上以增强cGMP产生的物质作为活性成分，从而通过调节树突状细胞的细胞因子产生来驱动T细胞分化成Th2型细胞。

6. 发明申请

US20050112797A1 Wiring base, semiconductor device manufacturing method thereof and electronic equipment 有权
标题翻译：接线基座，半导体器件的制造方法以及电子设备
公开(公告)号：US20050112797A1
公开(公告)日：2005-05-26
申请号：US10948075
申请日：2004-09-23
申请人： Toshiyuki Hori
发明人： Toshiyuki Hori
IPC分类号： H01L23/12 , H01L21/44 , H01L21/60 , H01L23/498
CPC分类号： H01L24/81 , H01L23/49838 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is mounted to the wiring base. The electrodes and the wiring pattern face one another and are electrically connected. The wiring base and the semiconductor chip are bonded by curing the resin paste. The wiring pattern includes a wiring that continuously includes two or more first parts located inside a semiconductor chip mounting region and a second part that connects at least two of the first parts. The second part is located outside the semiconductor chip mounting region.
摘要翻译：提供一种制造半导体器件的方法。将树脂膏施加到包括布线图案的布线基底。然后，将具有多个电极的半导体芯片安装在布线基板上。电极和布线图形彼此面对并电连接。通过固化树脂浆料来接合布线基底和半导体芯片。布线图案包括连续地包括位于半导体芯片安装区域内的两个或更多个第一部分的布线和连接至少两个第一部分的第二部分。第二部分位于半导体芯片安装区域的外部。

7. 发明授权

US07262496B2 Wiring base with wiring extending inside and outside of a mounting region 有权
标题翻译：接线基座，布线在安装区域内外延伸
公开(公告)号：US07262496B2
公开(公告)日：2007-08-28
申请号：US10948075
申请日：2004-09-23
申请人： Toshiyuki Hori
发明人： Toshiyuki Hori
IPC分类号： H01L23/498
CPC分类号： H01L24/81 , H01L23/49838 , H01L23/4985 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00 , H01L2224/05599
摘要： A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is mounted to the wiring base. The electrodes and the wiring pattern face one another and are electrically connected. The wiring base and the semiconductor chip are bonded by curing the resin paste. The wiring pattern includes a wiring that continuously includes two or more first parts located inside a semiconductor chip mounting region and a second part that connects at least two of the first parts. The second part is located outside the semiconductor chip mounting region.
摘要翻译：提供一种制造半导体器件的方法。将树脂膏施加到包括布线图案的布线基底。然后，将具有多个电极的半导体芯片安装在布线基板上。电极和布线图形彼此面对并电连接。通过固化树脂浆料来接合布线基底和半导体芯片。布线图案包括连续地包括位于半导体芯片安装区域内的两个或更多个第一部分的布线和连接至少两个第一部分的第二部分。第二部分位于半导体芯片安装区域的外部。

8. 发明授权

US5072473A Full-automated washer 失效
标题翻译：全自动洗衣机
公开(公告)号：US5072473A
公开(公告)日：1991-12-17
申请号：US646857
申请日：1991-01-28
申请人： Sizuo Thuruta , Yoshiaki Takeda , Isao Hiyama , Kenichi Kubo , Toshikazu Ohonishi , Hideyuki Tobita , Tamotu Shikamori , Hiroshi Ohsugi , Hiroshi Kinoshita , Kazufumi Ikeda , Yoshio Ohwa , Toshiyuki Hori , Masayoshi Hirayama , Takeo Honma
发明人： Sizuo Thuruta , Yoshiaki Takeda , Isao Hiyama , Kenichi Kubo , Toshikazu Ohonishi , Hideyuki Tobita , Tamotu Shikamori , Hiroshi Ohsugi , Hiroshi Kinoshita , Kazufumi Ikeda , Yoshio Ohwa , Toshiyuki Hori , Masayoshi Hirayama , Takeo Honma
IPC分类号： D06F33/02 , D06F39/00
CPC分类号： D06F39/003 , D06F33/02 , D06F2202/12 , D06F2204/02 , D06F2204/06 , D06F2204/086 , D06F2212/02
摘要： In a full-automated washer, a cloth amount sensor detects a quantity of an object being washed which is thrown into a washing drum as a value inclusive of information regarding a degree of bulkiness of the object to be washed. A processing circuit included in the full-automated washer is responsive to a detection output signal from the cloth amount sensor to determine a water supply amount, a cleanser feed amount, a stirring time and a rinsing time. The cloth amount sensor is mounted to a stirring motor. Upon an OFF-state of the motor, the detection output signal is generated by measuring a voltage waveform induced by inertial motion which varies in accordance the degree of bulkiness of the object to be washed.
摘要翻译：在全自动洗衣机中，布量传感器检测作为洗涤滚筒中被冲洗物体的数量，其值包括关于待洗涤物体的蓬松度的信息。包括在全自动洗衣机中的处理电路响应于来自布量传感器的检测输出信号来确定供水量，清洁剂进料量，搅拌时间和漂洗时间。布量传感器安装在搅拌马达上。在电动机的关闭状态下，通过测量根据被洗涤物体的蓬松度而变化的惯性运动引起的电压波形来生成检测输出信号。

9. 发明授权

US4803118A Composite cushion 失效
标题翻译：复合垫
公开(公告)号：US4803118A
公开(公告)日：1989-02-07
申请号：US179553
申请日：1988-04-08
申请人： Hidehito Sogi , Toshiyuki Hori
发明人： Hidehito Sogi , Toshiyuki Hori
IPC分类号： A47C7/20 , A47C27/14 , B29C39/10 , B29K105/04 , B29L31/58 , B32B5/08 , B32B5/24 , D03D1/00 , B32B3/26 , B32B7/00
CPC分类号： A47C27/16 , A47C7/20 , Y10T428/249981 , Y10T428/249986 , Y10T442/3065 , Y10T442/326 , Y10T442/3341
摘要： A composite cushion, useful for vehicle transportation, furniture and bedding, of foam having a fabric embedded therein which provides a spring function, good seating comfort and soft suspension, and which maintain its shape and desirable properties for a long period.

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