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1. 发明授权

US08569787B2 Light source apparatus using semiconductor light emitting device 失效
标题翻译：使用半导体发光元件的光源装置
公开(公告)号：US08569787B2
公开(公告)日：2013-10-29
申请号：US13154916
申请日：2011-06-07
申请人： Hideo Nishiuchi , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
发明人： Hideo Nishiuchi , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L24/06 , H01L33/0095 , H01L33/507 , H01L33/508 , H01L33/647 , H01L2224/06051 , H01L2924/12041 , H01L2933/0066 , H01L2924/00
摘要： According to one embodiment, a light source apparatus includes a semiconductor light emitting device, a mounting substrate, first and second connection members. The semiconductor light emitting device includes a light emitting unit, first and second conductive members, a sealing member, and an optical layer. The mounting substrate includes a base body, first and second substrate electrodes. The connection member electrically connects the conductive member to the substrate electrode. The conductive member is electrically connected to the light emitting unit electrode and includes first and second columnar portions provided on the second major surface. The sealing member covers side surfaces of the first and the second conductive members. The optical layer is provided on the first major surface of the semiconductor stacked body and includes a wavelength conversion unit. A surface area of the second substrate electrode is not less than 100 times a cross-sectional area of the second columnar portion.
摘要翻译：根据一个实施例，光源装置包括半导体发光器件，安装衬底，第一和第二连接构件。半导体发光器件包括发光单元，第一和第二导电构件，密封构件和光学层。安装基板包括基体，第一和第二基板电极。连接构件将导电构件电连接到基板电极。导电构件电连接到发光单元电极，并且包括设置在第二主表面上的第一和第二柱状部分。密封构件覆盖第一导电构件和第二导电构件的侧表面。光学层设置在半导体层叠体的第一主表面上并且包括波长转换单元。第二基板电极的表面积不小于第二柱状部分的横截面面积的100倍。

2. 发明申请

US20130082294A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20130082294A1
公开(公告)日：2013-04-04
申请号：US13607480
申请日：2012-09-07
申请人： Toshiya NAKAYAMA , Kazuhito HIGUCHI , Hiroshi KOIZUMI , Hideo NISHIUCHI , Susumu OBATA , Akiya KIMURA , Yoshiaki SUGIZAKI , Akihiro KOJIMA , Yosuke AKIMOTO
发明人： Toshiya NAKAYAMA , Kazuhito HIGUCHI , Hiroshi KOIZUMI , Hideo NISHIUCHI , Susumu OBATA , Akiya KIMURA , Yoshiaki SUGIZAKI , Akihiro KOJIMA , Yosuke AKIMOTO
IPC分类号： H01L33/50
CPC分类号： H01L33/56 , H01L27/15 , H01L33/502 , H01L33/505 , H01L33/508 , H01L33/54 , H01L2933/0041
摘要： According to one embodiment, a light-emitting unit which emits light, a wavelength conversion unit which includes a phosphor and which is provided on a main surface of the light-emitting unit, and a transparent resin which is provided on top of the wavelength conversion unit, are prepared. The transparent resin has a greater modulus of elasticity and/or a higher Shore hardness than the wavelength conversion unit.
摘要翻译：根据一个实施例，发射光的发光单元，包括荧光体并设置在发光单元的主表面上的波长转换单元和设置在波长转换器顶部的透明树脂单位，准备。透明树脂具有比波长转换单元更大的弹性模量和/或更高的肖氏硬度。

3. 发明授权

US08350283B2 Semiconductor light emitting device and method for manufacturing same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08350283B2
公开(公告)日：2013-01-08
申请号：US13152654
申请日：2011-06-03
申请人： Hideo Nishiuchi , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
发明人： Hideo Nishiuchi , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
IPC分类号： H01L33/50
CPC分类号： H01L33/647 , H01L33/0079 , H01L33/44 , H01L33/505 , H01L33/58 , H01L33/62 , H01L33/642 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting unit, first and second conductive members, an insulating layer, a sealing member, and an optical layer. The light emitting unit includes a semiconductor stacked body and first and second electrodes. The semiconductor stacked body includes first and second semiconductor layers and a light emitting layer, and has a major surface on a second semiconductor layer side. The first and second electrodes are connected to the first and second semiconductor layers on the major surface side, respectively. The first conductive member is connected to the first electrode and includes a first columnar portion covering a portion of the second semiconductor. The insulating layer is provided between the first columnar portion and the portion of the second semiconductor. The sealing member covers side surfaces of the conductive members. The optical layer is provided on the other major surface.
摘要翻译：根据一个实施例，半导体发光器件包括发光单元，第一和第二导电构件，绝缘层，密封构件和光学层。发光单元包括半导体层叠体和第一和第二电极。半导体层叠体包括第一和第二半导体层和发光层，并且在第二半导体层侧具有主表面。第一和第二电极分别连接到主表面侧的第一和第二半导体层。第一导电构件连接到第一电极并且包括覆盖第二半导体的一部分的第一柱状部分。绝缘层设置在第一柱状部分和第二半导体的部分之间。密封构件覆盖导电构件的侧表面。光学层设置在另一个主表面上。

4. 发明授权

US08348583B2 Container and loader for substrate 有权
标题翻译：用于基材的容器和装载机
公开(公告)号：US08348583B2
公开(公告)日：2013-01-08
申请号：US10036802
申请日：2001-12-21
申请人： Toshiaki Fujii , Osamu Horita , Koji Ohyama , Toshiya Nakayama , Fumio Sakiya , Mineo Kinpara
发明人： Toshiaki Fujii , Osamu Horita , Koji Ohyama , Toshiya Nakayama , Fumio Sakiya , Mineo Kinpara
IPC分类号： B65G49/07
CPC分类号： H01L21/67772
摘要： A loader is provided, which is disposed in a low cleanliness room along a border between the low cleanliness room and a high cleanliness room, for transporting a dust free article between an inside of a container receiving the dust free article and the high cleanliness room, comprising a movable stage for mounting the container; an opening portion through which the dust free article is transported between the container and the high cleanliness room; a door for opening and closing the opening portion; a unifying means for unifying a cover of the container and the door when the container approaches the door; and a driving apparatus for moving the cover and the door unified within the loader to open and close the opening portion and the container.
摘要翻译：提供一种装载机，其设置在低洁净室和低洁净室之间的边界的低洁净室中，用于在容纳无尘物品的容器的内部和高洁净室之间运送无尘物品，包括用于安装所述容器的可移动台; 开口部分，无尘物品通过该开口部分在容器和高洁净室之间输送; 用于打开和关闭开口部分的门; 用于当容器接近门时统一容器和门的盖的统一装置; 以及驱动装置，用于将盖和门一体地移动到装载机内，以打开和关闭开口部分和容器。

5. 发明申请

US20110297983A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20110297983A1
公开(公告)日：2011-12-08
申请号：US13152654
申请日：2011-06-03
申请人： Hideo NISHIUCHI , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
发明人： Hideo NISHIUCHI , Kazuhito Higuchi , Susumu Obata , Toshiya Nakayama
IPC分类号： H01L33/50
CPC分类号： H01L33/647 , H01L33/0079 , H01L33/44 , H01L33/505 , H01L33/58 , H01L33/62 , H01L33/642 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a light emitting unit, first and second conductive members, an insulating layer, a sealing member, and an optical layer. The light emitting unit includes a semiconductor stacked body and first and second electrodes. The semiconductor stacked body includes first and second semiconductor layers and a light emitting layer, and has a major surface on a second semiconductor layer side. The first and second electrodes are connected to the first and second semiconductor layers on the major surface side, respectively. The first conductive member is connected to the first electrode and includes a first columnar portion covering a portion of the second semiconductor. The insulating layer is provided between the first columnar portion and the portion of the second semiconductor. The sealing member covers side surfaces of the conductive members. The optical layer is provided on the other major surface.
摘要翻译：根据一个实施例，半导体发光器件包括发光单元，第一和第二导电构件，绝缘层，密封构件和光学层。发光单元包括半导体层叠体和第一和第二电极。半导体层叠体包括第一和第二半导体层和发光层，并且在第二半导体层侧具有主表面。第一和第二电极分别连接到主表面侧的第一和第二半导体层。第一导电构件连接到第一电极并且包括覆盖第二半导体的一部分的第一柱状部分。绝缘层设置在第一柱状部分和第二半导体的部分之间。密封构件覆盖导电构件的侧表面。光学层设置在另一个主表面上。

6. 发明申请

US20050209391A1 Transport and storage carrier of semiconductor parts containing wafer 审中-公开
标题翻译：包含晶圆的半导体零件的运输和存储载体
公开(公告)号：US20050209391A1
公开(公告)日：2005-09-22
申请号：US10802059
申请日：2004-03-17
申请人： Toshiya Nakayama , Osamu Sugiyama , Kiyozumi Tani
发明人： Toshiya Nakayama , Osamu Sugiyama , Kiyozumi Tani
IPC分类号： C08K3/04 , C08K7/06
CPC分类号： C08K7/06
摘要： A transport and storage carrier for semiconductor members including wafers which is characterized in that the carrier is molded from a resin composition comprising a synthetic resin having a melting temperature of at least 300° C. and a carbon fibril admixed with the resin, the molded carrier being 1 to 5 seconds in average charge decay time for decay of 1,000 V to 5 V.
摘要翻译：一种用于包括晶片的半导体构件的运输和存储载体，其特征在于，所述载体由包含熔融温度至少为300℃的合成树脂和与所述树脂混合的碳原纤维的树脂组合物模制，所述模制载体平均电荷衰减时间为1至5秒，用于1000V至5V的衰减。

7. 发明授权

US08614455B2 Semiconductor light emitting device 失效
标题翻译：半导体发光器件
公开(公告)号：US08614455B2
公开(公告)日：2013-12-24
申请号：US13424687
申请日：2012-03-20
申请人： Susumu Obata , Kazuhito Higuchi , Hideo Nishiuchi , Akiya Kimura , Toshiya Nakayama , Yoshiaki Sugizaki , Akihiro Kojima , Yosuke Akimoto
发明人： Susumu Obata , Kazuhito Higuchi , Hideo Nishiuchi , Akiya Kimura , Toshiya Nakayama , Yoshiaki Sugizaki , Akihiro Kojima , Yosuke Akimoto
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： According to an embodiment, a semiconductor light emitting device includes a stacked body, first and second electrodes, first and second interconnections, first and second pillars and a first insulating layer. The stacked body includes first and second semiconductor layers and a light emitting layer. The first and second electrodes are connected to the first and second semiconductor layers respectively. The first and second interconnections are connected to the first and second electrode respectively. The first and second pillars are connected to the first and second interconnections respectively. The first insulating layer is provided on the interconnections and the pillars. The first and second pillars have first and second monitor pads exposed in a surface of the first insulating layer. The first and second interconnections have first and second bonding pads exposed in a side face connected with the surface of the first insulating layer.
摘要翻译：根据实施例，半导体发光器件包括层叠体，第一和第二电极，第一和第二互连，第一和第二柱以及第一绝缘层。层叠体包括第一和第二半导体层和发光层。第一和第二电极分别连接到第一和第二半导体层。第一和第二互连分别连接到第一和第二电极。第一和第二支柱分别连接到第一和第二互连。第一绝缘层设置在互连和支柱上。第一和第二支柱具有暴露在第一绝缘层的表面中的第一和第二监视器焊盘。第一和第二互连具有暴露在与第一绝缘层的表面连接的侧面中的第一和第二接合焊盘。

8. 发明授权

US08987762B2 Semiconductor light-emitting device and manufacturing method of the same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08987762B2
公开(公告)日：2015-03-24
申请号：US13607480
申请日：2012-09-07
申请人： Toshiya Nakayama , Kazuhito Higuchi , Hiroshi Koizumi , Hideo Nishiuchi , Susumu Obata , Akiya Kimura , Yoshiaki Sugizaki , Akihiro Kojima , Yosuke Akimoto
发明人： Toshiya Nakayama , Kazuhito Higuchi , Hiroshi Koizumi , Hideo Nishiuchi , Susumu Obata , Akiya Kimura , Yoshiaki Sugizaki , Akihiro Kojima , Yosuke Akimoto
IPC分类号： H01L33/50 , H01L33/56 , H01L33/54
CPC分类号： H01L33/56 , H01L27/15 , H01L33/502 , H01L33/505 , H01L33/508 , H01L33/54 , H01L2933/0041
摘要： According to one embodiment, a light-emitting unit which emits light, a wavelength conversion unit which includes a phosphor and which is provided on a main surface of the light-emitting unit, and a transparent resin which is provided on top of the wavelength conversion unit, are prepared. The transparent resin has a greater modulus of elasticity and/or a higher Shore hardness than the wavelength conversion unit.
摘要翻译：根据一个实施例，发射光的发光单元，包括荧光体并设置在发光单元的主表面上的波长转换单元和设置在波长转换器顶部的透明树脂单位，准备。透明树脂具有比波长转换单元更大的弹性模量和/或更高的肖氏硬度。

9. 发明申请

US20130069102A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体发光装置，发光模块及其制造方法
公开(公告)号：US20130069102A1
公开(公告)日：2013-03-21
申请号：US13607418
申请日：2012-09-07
申请人： Akiya KIMURA , Kazuhito Higuchi , Hideo Nishiuchi , Susumu Obata , Toshiya Nakayama , Yoshiaki Sugizaki , Akihiro Kojima , Yosuke Akimoto
发明人： Akiya KIMURA , Kazuhito Higuchi , Hideo Nishiuchi , Susumu Obata , Toshiya Nakayama , Yoshiaki Sugizaki , Akihiro Kojima , Yosuke Akimoto
IPC分类号： H01L33/36
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
摘要： A semiconductor light-emitting device includes a laminated body that is configured to emit light from a main surface thereof, first and second electrodes, each disposed on a surface of the laminated body that is opposite the main surface, a first terminal that is electrically coupled to the first electrode, has a concave edge but not a convex edge, and has at most three exposed sides, and a second terminal that is electrically coupled to the second electrode, has a concave edge but not a convex edge, and has at most three exposed sides.
摘要翻译：一种半导体发光器件，包括被配置为从其主表面发光的层叠体，每个设置在层叠体的与主表面相对的表面上的第一和第二电极，电耦合的第一端子具有凹形边缘但不具有凸边缘，并且具有至多三个外露侧面，并且电耦合到第二电极的第二端子具有凹形边缘但不具有凸起边缘，并且具有至多三个暴露的一面。

10. 发明申请

US20120241792A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 失效
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20120241792A1
公开(公告)日：2012-09-27
申请号：US13424687
申请日：2012-03-20
申请人： Susumu Obata , Kazuhito Higuchi , Hideo Nishiuchi , Akiya Kimura , Toshiya Nakayama , Yoshiaki Sugizaki , Akihiro Kojima , Yosuke Akimoto
发明人： Susumu Obata , Kazuhito Higuchi , Hideo Nishiuchi , Akiya Kimura , Toshiya Nakayama , Yoshiaki Sugizaki , Akihiro Kojima , Yosuke Akimoto
IPC分类号： H01L33/60 , H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： According to an embodiment, a semiconductor light emitting device includes a stacked body, first and second electrodes, first and second interconnections, first and second pillars and a first insulating layer. The stacked body includes first and second semiconductor layers and a light emitting layer. The first and second electrodes are connected to the first and second semiconductor layers respectively. The first and second interconnections are connected to the first and second electrode respectively. The first and second pillars are connected to the first and second interconnections respectively. The first insulating layer is provided on the interconnections and the pillars. The first and second pillars have first and second monitor pads exposed in a surface of the first insulating layer. The first and second interconnections have first and second bonding pads exposed in a side face connected with the surface of the first insulating layer.
摘要翻译：根据实施例，半导体发光器件包括层叠体，第一和第二电极，第一和第二互连，第一和第二柱以及第一绝缘层。层叠体包括第一和第二半导体层和发光层。第一和第二电极分别连接到第一和第二半导体层。第一和第二互连分别连接到第一和第二电极。第一和第二支柱分别连接到第一和第二互连。第一绝缘层设置在互连和支柱上。第一和第二支柱具有暴露在第一绝缘层的表面中的第一和第二监视器焊盘。第一和第二互连具有暴露在与第一绝缘层的表面连接的侧面中的第一和第二接合焊盘。

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