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1. 发明授权

US08459561B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08459561B2
公开(公告)日：2013-06-11
申请号：US12204320
申请日：2008-09-04
申请人： Tomoyuki Aoki , Takuya Tsurume , Hiroki Adachi , Nozomi Horikoshi , Hisashi Ohtani
发明人： Tomoyuki Aoki , Takuya Tsurume , Hiroki Adachi , Nozomi Horikoshi , Hisashi Ohtani
IPC分类号： G06K19/06
CPC分类号： H01L23/29 , G06K19/07749 , H01L21/563 , H01L23/145 , H01L23/295 , H01L23/3121 , H01L23/60 , H01L23/66 , H01L27/1214 , H01L27/1266 , H01L27/13 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/12032 , H01L2924/12044 , H01L2924/19041 , H01L2924/3025 , Y10T428/31522 , H01L2924/00
摘要： A separation layer and a semiconductor element layer including a thin film transistor are formed. A conductive resin electrically connected to the semiconductor element layer is formed. A first sealing layer including a fiber and an organic resin layer is formed over the semiconductor element layer and the conductive resin. A groove is formed in the first sealing layer, the semiconductor element layer, and the separation layer. A liquid is dropped into the groove to separate the separation layer and the semiconductor element layer. The first sealing layer over the conductive resin is removed to form an opening. A set of the first sealing layer and the semiconductor element layer is divided into a chip. The chip is bonded to an antenna formed over a base material. A second sealing layer including a fiber and an organic resin layer is formed so as to cover the antenna and the chip.
摘要翻译：形成包括薄膜晶体管的分离层和半导体元件层。形成与半导体元件层电连接的导电树脂。包含纤维和有机树脂层的第一密封层形成在半导体元件层和导电树脂上。在第一密封层，半导体元件层和分离层中形成凹槽。将液体滴入槽中以分离分离层和半导体元件层。去除导电树脂上的第一密封层以形成开口。一组第一密封层和半导体元件层被分成芯片。芯片结合到形成在基材上的天线。形成包括纤维和有机树脂层的第二密封层，以覆盖天线和芯片。

2. 发明授权

US08039353B2 Semiconductor device and manufacturing method of semiconductor device 有权
标题翻译：半导体器件及半导体器件的制造方法
公开(公告)号：US08039353B2
公开(公告)日：2011-10-18
申请号：US12854060
申请日：2010-08-10
申请人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Eiji Sugiyama , Kaori Ogita , Naoto Kusumoto
发明人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Eiji Sugiyama , Kaori Ogita , Naoto Kusumoto
IPC分类号： H01L21/027 , H01L21/033 , H01L21/78
CPC分类号： H01L23/293 , H01L23/49855 , H01L23/66 , H01L27/1248 , H01L27/1266 , H01L27/13 , H01L28/10 , H01L2223/6677 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer. In addition, a substrate covering an element formation layer side is a substrate having a support on its surface is used in the manufacturing process.
摘要翻译：本发明提供了利用半导体器件中使用的柔性衬底的优点的薄且可弯曲的半导体器件以及半导体器件的制造方法。半导体器件具有被绝缘层覆盖的至少一个表面，该绝缘层用作用于保护的衬底。在半导体器件中，绝缘层形成在用作天线的导电层上，使得不覆盖导电层的部分中的绝缘层的厚度比值至少为1.2，并且该值在导电层上形成的绝缘层与导电层的厚度比为至少0.2。此外，导电层而不是绝缘层不会在半导体器件的侧面露出，并且绝缘层覆盖TFT和导电层。此外，在制造过程中使用覆盖元件形成层侧的基板是其表面上具有支撑体的基板。

3. 发明授权

US07994030B2 Method for manufacturing antenna and method for manufacturing semiconductor device 有权
标题翻译：制造天线的方法及制造半导体器件的方法
公开(公告)号：US07994030B2
公开(公告)日：2011-08-09
申请号：US12645511
申请日：2009-12-23
申请人： Tomoyuki Aoki , Daiki Yamada
发明人： Tomoyuki Aoki , Daiki Yamada
IPC分类号： H01L21/20 , H01L21/36
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/6836 , H01L21/76826 , H01L21/76856 , H01L23/5227 , H01L24/83 , H01L27/1285 , H01L27/1292 , H01L27/13 , H01L2221/68327 , H01L2221/6834 , H01L2221/6835 , H01L2221/68363 , H01L2223/6677 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01012 , H01L2924/01067 , H01L2924/01068 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01Q1/2225 , H05K1/095 , H05K3/02 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.
摘要翻译：本发明提供一种具有低电阻的天线和具有提高通信距离的天线的半导体器件。含有导电颗粒的流体被施加在物体上。在固化含有导电颗粒的流体之后，用激光照射流体以形成天线。作为施加含有导电性粒子的流体的方法，使用丝网印刷，旋涂，浸渍或液滴喷射法。此外，使用波长为1nm以上且380nm以下的固体激光器作为激光。

4. 发明授权

US07335951B2 Semiconductor device and method for manufacturing the same 有权
公开(公告)号：US07335951B2
公开(公告)日：2008-02-26
申请号：US10957747
申请日：2004-10-05
申请人： Kazuo Nishi , Hiroki Adachi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara , Tomoyuki Aoki , Eiji Sugiyama , Hironobu Takahashi
发明人： Kazuo Nishi , Hiroki Adachi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara , Tomoyuki Aoki , Eiji Sugiyama , Hironobu Takahashi
IPC分类号： H01L27/01
CPC分类号： H01L31/0203 , H01L27/1446 , H01L27/14618 , H01L31/048 , H01L2924/0002 , Y02E10/50 , H01L2924/00
摘要： The present invention provides a semiconductor device formed over an insulating substrate, typically a semiconductor device having a structure in which mounting strength to a wiring board can be increased in an optical sensor, a solar battery, or a circuit using a TFT, and which can make it mount on a wiring board with high density, and further a method for manufacturing the same. According to the present invention, in a semiconductor device, a semiconductor element is formed on an insulating substrate, a concave portion is formed on a side face of the semiconductor device, and a conductive film electrically connected to the semiconductor element is formed in the concave portion.

5. 发明申请

US20080012126A1 Paper including semiconductor device and manufacturing method thereof 有权
标题翻译：纸包括半导体器件及其制造方法
公开(公告)号：US20080012126A1
公开(公告)日：2008-01-17
申请号：US11819157
申请日：2007-06-25
申请人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Kaori Ogita , Naoto Kusumoto
发明人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Kaori Ogita , Naoto Kusumoto
IPC分类号： H01L23/06 , D21F13/00
CPC分类号： D21H21/48 , B32B29/00 , D21H27/32 , G06K19/07749 , H01L23/49855 , H01L27/1214 , H01L27/1255 , H01L27/1266 , H01L29/78603 , H01L2924/0002 , H01L2924/00
摘要： Paper embedded with a semiconductor device capable of communicating wirelessly is realized, whose unevenness of a portion including the semiconductor device does not stand out and the paper is thin with a thickness of less than or equal to 130 μm. A semiconductor device is provided with a circuit portion and an antenna, and the circuit portion includes a thin film transistor. The circuit portion and the antenna are separated from a substrate used during manufacturing, and are interposed between a flexible base and a sealing layer and protected. The semiconductor device can be bent, and the thickness of the semiconductor device itself is less than or equal to 30 μm. The semiconductor device is embedded in a paper in a papermaking process.
摘要翻译：实现了能够无线通信的半导体器件的纸张，其中包括半导体器件的部分的不均匀性不突出，并且纸薄，厚度小于或等于130μm。半导体器件设置有电路部分和天线，并且电路部分包括薄膜晶体管。电路部分和天线与在制造期间使用的基板分离，并且被插入在柔性基底和密封层之间并被保护。半导体器件可以弯曲，并且半导体器件本身的厚度小于或等于30μm。半导体器件以造纸工艺嵌入纸中。

6. 发明申请

US20070020932A1 Manufacturing method of wiring board and semiconductor device 有权
标题翻译：接线板和半导体器件的制造方法
公开(公告)号：US20070020932A1
公开(公告)日：2007-01-25
申请号：US11474934
申请日：2006-06-27
申请人： Junya Maruyama , Tomoyuki Aoki
发明人： Junya Maruyama , Tomoyuki Aoki
IPC分类号： H01L21/44
CPC分类号： H05K3/205 , H01L2224/11 , H01L2924/12044 , H05K3/245 , H05K2203/0117 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/49144 , Y10T29/49155 , Y10T29/49224 , H01L2924/00
摘要： A manufacturing method of a wiring board and a semiconductor device at low cost and by a simple process, without performing complicated steps many times is proposed. Furthermore, a manufacturing method of a wiring board at low cost and with fewer adverse effects on the environment, and a manufacturing method of a semiconductor device using the wiring board are proposed. A pattern of a conductive material is formed over a first substrate, a conductive film is formed over the pattern by an electrolytic plating process, the pattern and the conductive film are separated, an IC chip including at least one thin film transistor is formed over a second substrate, and the conductive film is electrically connected to the IC chip.
摘要翻译：提出了一种以低成本和简单的方法制造布线板和半导体器件的方法，而不需要多次复杂的步骤。此外，提出了一种低成本并且对环境的不利影响较少的布线板的制造方法以及使用该布线板的半导体装置的制造方法。导电材料的图形形成在第一基板上，通过电解电镀工艺在图案上形成导电膜，图案和导电膜被分离，包括至少一个薄膜晶体管的IC芯片形成在第二基板，并且导电膜电连接到IC芯片。

7. 发明申请

US20060270175A1 Method for manufacturing antenna and method for manufacturing semiconductor device 有权
公开(公告)号：US20060270175A1
公开(公告)日：2006-11-30
申请号：US11433546
申请日：2006-05-15
申请人： Tomoyuki Aoki , Daiki Yamada
发明人： Tomoyuki Aoki , Daiki Yamada
IPC分类号： H01L21/20
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/6836 , H01L21/76826 , H01L21/76856 , H01L23/5227 , H01L24/83 , H01L27/1285 , H01L27/1292 , H01L27/13 , H01L2221/68327 , H01L2221/6834 , H01L2221/6835 , H01L2221/68363 , H01L2223/6677 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01012 , H01L2924/01067 , H01L2924/01068 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01Q1/2225 , H05K1/095 , H05K3/02 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.

8. 发明申请

US20060089867A1 Inventory control system and method 审中-公开
标题翻译：库存控制系统和方法
公开(公告)号：US20060089867A1
公开(公告)日：2006-04-27
申请号：US11255151
申请日：2005-10-21
申请人： Toshiyuki Sakuma , Tomoyuki Aoki , Yuichi Kaneko
发明人： Toshiyuki Sakuma , Tomoyuki Aoki , Yuichi Kaneko
IPC分类号： G06Q99/00 , G05B19/418
CPC分类号： G06Q10/087 , Y02P90/18
摘要： The invention suppresses stock excess or deficiency of circulation items through a life cycle of the circulation items. In an inventory control system, an information processing device calculates an index (KPI) which shows a current phase of a circulation item from actual data of the circulation item, at predetermined timing (S1101) . After that, the information processing device compares a shift condition stored in a code storage area with KPI, and in case that KPI satisfies the shift condition, it judges that a phase of the circulation item is changed (S1103). Here, when a user inputs renewal permission of safety stock quantity of circulation item (S1104), the information processing device calculates safety stock quantity of circulation items in the shifted phase (S1107).
摘要翻译：本发明通过流通物品的生命周期来抑制流通物品的库存过量或不足。在库存控制系统中，信息处理装置在规定的定时，根据循环项目的实际数据，计算出显示循环项目的当前阶段的指标（KPI）（S 1101）。之后，信息处理装置将存储在代码存储区域中的移位条件与KPI进行比较，并且在KPI满足移位条件的情况下，判断循环项目的相位改变（S101）。这里，当用户输入循环项目的安全库存量的更新许可时（S1104），信息处理装置计算移动阶段的循环项目的安全库存量（S 1107）。

9. 发明授权

US06379552B1 Method for resolving optical isomers 失效
标题翻译：拆分光学异构体的方法
公开(公告)号：US06379552B1
公开(公告)日：2002-04-30
申请号：US09347062
申请日：1999-07-02
申请人： Tetsuji Kitagawa , Atsushi Okamoto , Takashi Kanai , Katsuhiro Shibayama , Tomoyuki Aoki , Shinobu Yamakawa
发明人： Tetsuji Kitagawa , Atsushi Okamoto , Takashi Kanai , Katsuhiro Shibayama , Tomoyuki Aoki , Shinobu Yamakawa
IPC分类号： B01D1500
CPC分类号： C07B57/00
摘要： A method for efficiently resolving optical isomers, in which a discriminating liquid consisting of a discriminating agent capable of discriminating optical isomers and a diluent are brought into contact with a mixture containing said optical isomers in countercurrent flow, to resolve the optical isomers by adsorption separation, distillation separation, absorption separation or membrane separation, and recovered at an optical isomer content of 5 wt % or less for recycled use, under one or more of the following conditions: (a) the dielectric constant of the diluent is 30 or less and the viscosity of the discriminating liquid is 0.2 Pa·s or less at the temperature of the resolving operation; (b) the discriminating agent contained has the effect of splitting the 1H or 13C-NMR spectrum peak of the optical isomers when added and the diluent contained has a dielectric constant equal to or lower than the dielectric constant of the measuring solvent at the time of measuring the 1H or 13C-NMR spectrum; (c) the boiling point of at least one compound of the discriminating agent at the pressure of the resolving operation is higher than the boiling point of at least one compound of the diluent at the pressure of the resolving operation; (d) the boiling point of at least one compound of the diluent at the pressure of the resolving operation is higher than the boiling point of the optical isomers to be resolved, at the pressure of the resolving operation, by 10° C. or more; and (e) the concentration of the discriminating agent in the discriminating liquid is 10 wt % or more.
摘要翻译：光学异构体的有效解决方法是将由能够鉴别光学异构体的识别剂组成的识别液与稀释剂逆流流动地与包含所述光学异构体的混合物接触，从而通过吸附分离来分解光学异构体，蒸馏分离，吸收分离或膜分离，并在一种或多种以下条件下以5重量％以下的光学异构体含量回收再循环使用：（a）稀释剂的介电常数为30以下，鉴定液的粘度在分解操作的温度下为0.2Pa.s以下;（b）所含的鉴别剂具有在添加时分解光学异构体的1H或13C-NMR谱峰的作用，并且稀释剂含有介电常数等于或低于在测量1H或13C-NMR谱时测量溶剂的介电常数（c）解析操作压力下鉴别剂的至少一种化合物的沸点高于分解操作压力下至少一种稀释剂化合物的沸点;（d）在拆分操作压力下，至少一种稀释剂化合物的沸点高于分解操作压力下要拆分的光学异构体的沸点10℃或更高; 和（e）鉴别液中鉴别剂的浓度为10重量％以上。

10. 发明授权

US5336425A Acidic aluminum cleaner containing an oxidant and a nonionic surfactant stabilized by a glycol 失效
标题翻译：含有氧化剂和由二醇稳定的非离子表面活性剂的酸性铝清洁剂
公开(公告)号：US5336425A
公开(公告)日：1994-08-09
申请号：US971924
申请日：1992-12-21
申请人： Tomoyuki Aoki , Yasuo Iino , Yoji Ono , Shinichiro Asai
发明人： Tomoyuki Aoki , Yasuo Iino , Yoji Ono , Shinichiro Asai
IPC分类号： C11D10/02 , C23G1/12 , C11D1/72 , C23F1/20 , C23F1/22
CPC分类号： C23G1/125
摘要： The stability of an acidic liquid cleaner for aluminum comprising mineral acid, oxidant, polyvalent metal ions, and surfactant is substantially improved by the presence in the cleaner of from 0.05 to 5 g/L of a component selected from the group of glycols containing from 2 to 10 carbon atoms per molecule and mixtures of such glycols. The effectiveness of the cleaner for primary cleaning and de-smutting of aluminum and its alloys is not impaired and may even be improved by the addition of the glycol component.
摘要翻译： PCT No.PCT / US91 / 04263 Sec。 371日期：1993年12月21日 102（e）1993年12月21日的PCT日期1992年6月14日PCT。由含有无机酸，氧化剂，多价金属离子和表面活性剂的铝的酸性液体清洁剂的稳定性通过在 0.05至5g / L选自每分子含有2至10个碳原子的二醇的组分和这些二醇的混合物。用于铝及其合金的初步清洁和去除的清洁剂的有效性不受损害，甚至可以通过加入二醇组分来改善。

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