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1. 发明申请

US20120002828A1 AUDIO PROCESSING DEVICE, AUDIO PROCESSING METHOD, AND PROGRAM 有权
标题翻译：音频处理设备，音频处理方法和程序
公开(公告)号：US20120002828A1
公开(公告)日：2012-01-05
申请号：US13161604
申请日：2011-06-16
申请人： Tomoaki Muramatsu , Nobuhiko Nakamura , Yoshio Oguchi , Masanobu Sayama
发明人： Tomoaki Muramatsu , Nobuhiko Nakamura , Yoshio Oguchi , Masanobu Sayama
IPC分类号： H04R5/02
CPC分类号： H04S3/008 , H04N5/642 , H04N13/30 , H04N13/341 , H04R2499/15 , H04S2400/11
摘要： There is provided an audio processing device including an estimation unit configured to estimate a user's representative perceived position of a stereoscopic image from a difference between a left-eye image and a right-eye image of the stereoscopic image displayed on a display device, and an audio controller configured to control audio output of an audio output device in accordance with the representative perceived position estimated by the estimation unit.
摘要翻译：提供了一种音频处理装置，包括：估计单元，被配置为从显示装置上显示的立体图像的左眼图像和右眼图像之间的差异估计立体图像的用户的代表感知位置，以及音频控制器，其被配置为根据由所述估计单元估计的代表感知位置来控制音频输出设备的音频输出。

2. 发明申请

US20080176410A1 Method For Forming A Coating With A Liquid, And Method For Manufacturing A Semiconductor Device 有权
标题翻译：用液体形成涂层的方法以及制造半导体器件的方法
公开(公告)号：US20080176410A1
公开(公告)日：2008-07-24
申请号：US11772638
申请日：2007-07-02
申请人： Tomoaki Muramatsu , Yuko Kaimoto , Ichiro Omata
发明人： Tomoaki Muramatsu , Yuko Kaimoto , Ichiro Omata
IPC分类号： H01L21/31 , B05C11/08
CPC分类号： H01L21/6715
摘要： A method of forming a liquid coating on a substrate that reduces the amount of consumption of the coating liquid and achieves a more even distribution of the thickness of the liquid coating film. The method may include supplying a solvent to a surface of a substrate, starting a supply of a coating liquid to the surface of the substrate while rotating the substrate at a first rotation speed, stopping a rotation of the substrate by decelerating the rotation of the substrate at a deceleration larger than 30000 rpm/sec at a point of time when the supply of the coating liquid is stopped, and then rotating the substrate at a second rotation speed. Accordingly, the dispense amount of the coating liquid is reduced and the film thickness of the coating liquid is flatten.
摘要翻译：一种在基板上形成液体涂层的方法，其减少涂布液的消耗量并且实现液体涂膜的厚度的更均匀分布。该方法可以包括将溶剂供应到基材的表面，开始向基材的表面供应涂料，同时以第一转速旋转基材，通过减速基材的旋转来停止基材的旋转在停止供给涂布液的时刻，以大于30000rpm /秒的减速度，然后以第二转速旋转基板。因此，涂布液的分配量减少，涂布液的膜厚变平。

3. 发明授权

US07754619B2 Method for forming a coating with a liquid, and method for manufacturing a semiconductor device 有权
标题翻译：用液体形成涂层的方法，以及制造半导体器件的方法
公开(公告)号：US07754619B2
公开(公告)日：2010-07-13
申请号：US11772638
申请日：2007-07-02
申请人： Tomoaki Muramatsu , Yuko Kaimoto , Ichiro Omata
发明人： Tomoaki Muramatsu , Yuko Kaimoto , Ichiro Omata
IPC分类号： H01L21/312 , H01L21/47 , B05D3/12 , B05D5/12
CPC分类号： H01L21/6715
摘要： A method of forming a liquid coating on a substrate that reduces the amount of consumption of the coating liquid and achieves a more even distribution of the thickness of the liquid coating film. The method may include supplying a solvent to a surface of a substrate, starting a supply of a coating liquid to the surface of the substrate while rotating the substrate at a first rotation speed, stopping a rotation of the substrate by decelerating the rotation of the substrate at a deceleration larger than 30000 rpm/sec at a point of time when the supply of the coating liquid is stopped, and then rotating the substrate at a second rotation speed. Accordingly, the dispense amount of the coating liquid is reduced and the film thickness of the coating liquid is flatten.
摘要翻译：一种在基板上形成液体涂层的方法，其减少涂布液的消耗量并且实现液体涂膜的厚度的更均匀分布。该方法可以包括将溶剂供应到基材的表面，开始向基材的表面供应涂料，同时以第一转速旋转基材，通过减速基材的旋转来停止基材的旋转在停止供给涂布液的时刻，以大于30000rpm /秒的减速度，然后以第二转速旋转基板。因此，涂布液的分配量减少，涂布液的膜厚变平。

4. 发明授权

US6033728A Apparatus for spin coating, a method for spin coating and a method for manufacturing semiconductor device 失效
标题翻译：旋涂装置，旋涂法及半导体装置的制造方法
公开(公告)号：US6033728A
公开(公告)日：2000-03-07
申请号：US625675
申请日：1996-04-03
申请人： Kenji Kikuchi , Tomoaki Muramatsu
发明人： Kenji Kikuchi , Tomoaki Muramatsu
IPC分类号： B05C5/00 , B05C11/08 , B05D1/40 , G03F7/16 , H01L21/027 , H01L21/312 , B05D3/12 , H01L21/469
CPC分类号： B05C11/08 , G03F7/162
摘要： The invention relates to an apparatus for spin coating for forming a resist film, an SOG film, a polyimide film, and the like in manufacturing semiconductor devices and has the object of forming a coated film with a specified and uniform thickness even in case that an amount of discharged coating solution is a little. An apparatus for spin coating of the invention comprises a rotatable table for placing a wafer, a coating solution discharging means which is set above the rotatable table and discharges a coating solution on the surface of the wafer, and a solvent discharging means which is above the rotatable table and discharges a solvent capable of dissolving the coating solution.
摘要翻译：本发明涉及在制造半导体器件中用于形成抗蚀剂膜，SOG膜，聚酰亚胺膜等的旋涂装置，其目的是形成具有规定均匀厚度的涂膜，即使在排出涂层溶液的量有一点。本发明的旋涂装置包括：用于放置晶片的可旋转工作台，设置在可旋转工作台上方的涂布液排出装置，并将涂层溶液排出到晶片表面上;溶剂排出装置，可旋转的桌子并排出能够溶解涂布溶液的溶剂。

5. 发明授权

US09351092B2 Audio processing device, audio processing method, and program 有权
标题翻译：音频处理装置，音频处理方法和程序
公开(公告)号：US09351092B2
公开(公告)日：2016-05-24
申请号：US13161604
申请日：2011-06-16
申请人： Tomoaki Muramatsu , Nobuhiko Nakamura , Yoshio Oguchi , Masanobu Sayama
发明人： Tomoaki Muramatsu , Nobuhiko Nakamura , Yoshio Oguchi , Masanobu Sayama
IPC分类号： H04R5/02 , H04R1/02 , H04S3/00 , H04N5/64 , H04N13/04
CPC分类号： H04S3/008 , H04N5/642 , H04N13/30 , H04N13/341 , H04R2499/15 , H04S2400/11
摘要： There is provided an audio processing device including an estimation unit configured to estimate a user's representative perceived position of a stereoscopic image from a difference between a left-eye image and a right-eye image of the stereoscopic image displayed on a display device, and an audio controller configured to control audio output of an audio output device in accordance with the representative perceived position estimated by the estimation unit.
摘要翻译：提供了一种音频处理装置，包括：估计单元，被配置为从显示装置上显示的立体图像的左眼图像和右眼图像之间的差异估计立体图像的用户的代表感知位置，以及音频控制器，其被配置为根据由所述估计单元估计的代表感知位置来控制音频输出设备的音频输出。

6. 发明授权

US5733182A Ultra flat polishing 失效
标题翻译：超平面抛光
公开(公告)号：US5733182A
公开(公告)日：1998-03-31
申请号：US354907
申请日：1994-12-12
申请人： Tomoaki Muramatsu , Takashi Yoshida
发明人： Tomoaki Muramatsu , Takashi Yoshida
IPC分类号： B24B37/04 , B24B37/30 , B24B41/06 , H01L21/304 , B24B5/00
CPC分类号： B24B37/04 , B24B41/068
摘要： A polishing apparatus comprises a pressure container having a first opening at its bottom and being rotatable about an axis perpendicular to a plane of the first opening; a wafer support coupled elastically to the first opening, sealing the first opening hermetically and having a wafer supporting surface; and a lower surface plate disposed underneath the wafer supporting surface and having a polishing surface approximately parallel to the wafer supporting surface. The wafer support may be provided with flatness adjusting means for selectively applying a larger pressure on a region of the wafer held on the wafer supporting surface than a pressure on other region. The flatness adjusting means may comprise a plurality of pressing pins, or may comprise a hollow within the wafer support, a surface plate having elasticity and sealing the hollow, and means for applying pressure to the hollow. Wafer can be polished under uniform pressure applied on the back surface. Flatness of the wafer can be improved.
摘要翻译：抛光装置包括：压力容器，其底部具有第一开口，并可围绕垂直于第一开口平面的轴线旋转; 晶片支撑件，其弹性耦合到所述第一开口，密封所述第一开口并具有晶片支撑表面; 以及设置在晶片支撑表面下方并具有大致平行于晶片支撑表面的抛光表面的下表面板。晶片支撑件可以设置有平坦度调节装置，用于在保持在晶片支撑表面上的晶片的区域上选择性地施加比在其它区域上的压力更大的压力。平坦度调节装置可以包括多个按压销，或者可以包括晶片支撑件内的中空部分，具有弹性并密封中空部分的表面板以及向中空部分施加压力的装置。晶圆可以在施加在背面的均匀压力下抛光。可以提高晶片的平坦度。

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