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1. 发明授权

US08507954B2 Integrated CMOS porous sensor having sensor electrodes formed with the interconnect conductors of a MOS circuit 有权
标题翻译：集成CMOS多孔传感器，其具有由MOS电路的互连导体形成的传感器电极
公开(公告)号：US08507954B2
公开(公告)日：2013-08-13
申请号：US12975846
申请日：2010-12-22
申请人： Timothy Cummins
发明人： Timothy Cummins
IPC分类号： H01L29/66
CPC分类号： G01N27/22 , G01N27/121 , G01N27/223 , H01L23/528 , H01L27/0629 , H01L27/105 , H01L27/15 , H01L2924/0002 , H01L2924/00
摘要： A single chip wireless sensor comprises a microcontroller connected by a transmit/receive interface to a wireless antenna. The microcontroller is also connected to an 8 kB RAM, a USB interface, an RS232 interface, 64 kB flash memory, and a 32 kHz crystal. The device senses humidity and temperature, and a humidity sensor is connected by an 18 bit ΣΔ A-to-D converter to the microcontroller and a temperature sensor is connected by a 12 bit SAR A-to-D converter to the microcontroller. The device is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process.
摘要翻译：单芯片无线传感器包括通过发射/接收接口连接到无线天线的微控制器。微控制器还连接到8 kB RAM，USB接口，RS232接口，64 kB闪存和32 kHz晶振。该器件感测湿度和温度，湿度传感器由18位SigmaDelta A-D转换器连接到微控制器，温度传感器通过12位SAR A-D转换器连接到微控制器。该器件是在单个工艺中制造的集成芯片，其中电子器件和传感器元件都使用标准CMOS处理技术制造，应用于在集成过程中实现电子和感测元件。

2. 发明申请

US20110089439A1 INTEGRATED CMOS POROUS SENSOR 有权
标题翻译：集成CMOS多孔传感器
公开(公告)号：US20110089439A1
公开(公告)日：2011-04-21
申请号：US12975846
申请日：2010-12-22
申请人： Timothy Cummins
发明人： Timothy Cummins
IPC分类号： H01L31/12 , H01L31/18
CPC分类号： G01N27/22 , G01N27/121 , G01N27/223 , H01L23/528 , H01L27/0629 , H01L27/105 , H01L27/15 , H01L2924/0002 , H01L2924/00
摘要： A single chip wireless sensor comprises a microcontroller connected by a transmit/receive interface to a wireless antenna. The microcontroller is also connected to an 8 kB RAM, a USB interface, an RS232 interface, 64 kB flash memory, and a 32 kHz crystal. The device senses humidity and temperature, and a humidity sensor is connected by an 18 bit ΣΔ A-to-D converter to the microcontroller and a temperature sensor is connected by a 12 bit SAR A-to-D converter to the microcontroller. The device is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process.
摘要翻译：单芯片无线传感器包括通过发射/接收接口连接到无线天线的微控制器。微控制器还连接到8 kB RAM，USB接口，RS232接口，64 kB闪存和32 kHz晶振。该设备感测湿度和温度，湿度传感器通过18位＆Sgr＆Dgr连接; 微控制器的A / D转换器和温度传感器由12位SAR A / D转换器连接到微控制器。该器件是在单个工艺中制造的集成芯片，其中电子器件和传感器元件都使用标准CMOS处理技术制造，应用于在集成过程中实现电子和感测元件。

3. 发明授权

US07554134B2 Integrated CMOS porous sensor 有权
公开(公告)号：US07554134B2
公开(公告)日：2009-06-30
申请号：US11092725
申请日：2005-03-30
申请人： Timothy Cummins
发明人： Timothy Cummins
IPC分类号： H01L29/80
CPC分类号： G01N27/22 , G01N27/121 , G01N27/223 , H01L23/528 , H01L27/0629 , H01L27/105 , H01L27/15 , H01L2924/0002 , H01L2924/00
摘要： A single chip wireless sensor (1) comprises a microcontroller (2) connected by a transmit/receive interface (3) to a wireless antenna (4). The microcontroller (2) is also connected to an 8 kB RAM (5), a USB interface (6), an RS232 interface (8), 64 kB flash memory (9), and a 32 kHz crystal (10). The device (1) senses humidity and temperature, and a humidity sensor (11) is connected by an 18 bit ΣΔ A-to-D converter (12) to the microcontroller (2) and a temperature sensor (13) is connected by a 12 bit SAR A-to-D converter (14) to the microcontroller (2). The device (1) is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process.

4. 发明申请

US20090141767A1 Integrated Electronic Sensor 有权
标题翻译：集成电子传感器
公开(公告)号：US20090141767A1
公开(公告)日：2009-06-04
申请号：US11992470
申请日：2006-10-02
申请人： Timothy Cummins
发明人： Timothy Cummins
IPC分类号： G01K1/00 , G01N7/00 , H01L21/02 , G01N27/22
CPC分类号： G01N27/223
摘要： A single chip wireless sensor (1) comprises a microcontroller (2) connected to a transmit/receive interface (3), which is coupled to a wireless antenna (4) by an L-C matching circuit. The sensor (1) senses gas or humidity and temperature. The device (1) is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process. A Low-K material (57) with an organic polymer component is spun onto the wafer to form a top layer incorporating also sensing electrodes (60). This material is cured at 300° C., which is much lower than CVD temperatures. The polyimide when cured becomes thermoset, and the lower mass-to-volume ratio resulting in K, its dielectric constant, reducing to 2.9. The thermoset dielectric, while not regarded as porous in the conventional sense, has sufficient free space volume to admit enough gas or humidity for sensing.
摘要翻译：单芯片无线传感器（1）包括连接到发射/接收接口（3）的微控制器（2），其通过L-C匹配电路耦合到无线天线（4）。传感器（1）感测气体或湿度和温度。器件（1）是在单个工艺中制造的集成芯片，其中电子器件和传感器部件都使用标准CMOS处理技术制造，其被应用于在集成过程中实现电子和感测部件。将具有有机聚合物组分的低K材料（57）旋转到晶片上以形成还具有感测电极（60）的顶层。该材料在300℃下固化，其比CVD温度低得多。固化时的聚酰亚胺变得热固化，并且导致K的较低质量体积比其介电常数降低到2.9。热固性电介质虽然在传统意义上不被认为是多孔的，但具有足够的自由空间体积以允许足够的气体或湿度用于感测。

5. 发明申请

US20120256236A1 INTEGRATED CMOS POROUS SENSOR 审中-公开
标题翻译：集成CMOS多孔传感器
公开(公告)号：US20120256236A1
公开(公告)日：2012-10-11
申请号：US13494392
申请日：2012-06-12
申请人： Timothy CUMMINS
发明人： Timothy CUMMINS
IPC分类号： H01L29/80
CPC分类号： G01N27/22 , G01N27/121 , G01N27/223 , H01L23/528 , H01L27/0629 , H01L27/105 , H01L27/15 , H01L2924/0002 , H01L2924/00
摘要： A single chip wireless sensor comprises a microcontroller connected by a transmit/receive interface to a wireless antenna. The microcontroller is also connected to an 8 kB RAM, a USB interface, an RS232 interface, 64 kB flash memory, and a 32 kHz crystal. The device senses humidity and temperature, and a humidity sensor is connected by an 18 bit ΣΔ A-to-D converter to the microcontroller and a temperature sensor is connected by a 12 bit SAR A-to-D converter to the microcontroller. The device is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process.
摘要翻译：单芯片无线传感器包括通过发射/接收接口连接到无线天线的微控制器。微控制器还连接到8 kB RAM，USB接口，RS232接口，64 kB闪存和32 kHz晶振。该设备感测湿度和温度，湿度传感器通过18位＆Sgr＆Dgr连接; 微控制器的A / D转换器和温度传感器由12位SAR A / D转换器连接到微控制器。该器件是在单个工艺中制造的集成芯片，其中电子器件和传感器元件都使用标准CMOS处理技术制造，应用于在集成过程中实现电子和感测元件。

6. 发明授权

US08007167B2 Integrated electronic sensor 有权
标题翻译：集成电子传感器
公开(公告)号：US08007167B2
公开(公告)日：2011-08-30
申请号：US11992470
申请日：2006-10-02
申请人： Timothy Cummins
发明人： Timothy Cummins
IPC分类号： G01K7/01 , G01N25/26 , G01N25/66 , H01L29/02
CPC分类号： G01N27/223
摘要： A single chip wireless sensor (1) comprises a microcontroller (2) connected to a transmit/receive interface (3), which is coupled to a wireless antenna (4) by an L-C matching circuit. The sensor (1) senses gas or humidity and temperature. The device (1) is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process. A Low-K material (57) with an organic polymer component is spun onto the wafer to form a top layer incorporating also sensing electrodes (60). This material is cured at 300° C., which is much lower than CVD temperatures. The polyimide when cured becomes thermoset, and the lower mass-to-volume ratio resulting in K, its dielectric constant, reducing to 2.9. The thermoset dielectric, while not regarded as porous in the conventional sense, has sufficient free space volume to admit enough gas or humidity for sensing.
摘要翻译：单芯片无线传感器（1）包括连接到发射/接收接口（3）的微控制器（2），其通过L-C匹配电路耦合到无线天线（4）。传感器（1）感测气体或湿度和温度。器件（1）是在单个工艺中制造的集成芯片，其中电子器件和传感器部件都使用标准CMOS处理技术制造，其被应用于在集成过程中实现电子和感测部件。将具有有机聚合物组分的低K材料（57）旋转到晶片上以形成还具有感测电极（60）的顶层。该材料在300℃下固化，其比CVD温度低得多。固化时的聚酰亚胺变得热固化，并且导致K的较低质量体积比其介电常数降低到2.9。热固性电介质虽然在传统意义上不被认为是多孔的，但具有足够的自由空间体积以允许足够的气体或湿度用于感测。

7. 发明申请

US20110098937A1 INTEGRATED MOS WIRELESS SENSOR 有权
标题翻译：集成MOS无线传感器
公开(公告)号：US20110098937A1
公开(公告)日：2011-04-28
申请号：US12977358
申请日：2010-12-23
申请人： Timothy Cummins
发明人： Timothy Cummins
IPC分类号： G06F19/00
CPC分类号： G01N27/22 , G01N27/121 , G01N27/223 , H01L23/528 , H01L27/0629 , H01L27/105 , H01L27/15 , H01L2924/0002 , H01L2924/00
摘要： A single chip wireless sensor comprises a microcontroller connected by a transmit/receive interface to a wireless antenna. The microcontroller is also connected to an 8 kB RAM, a USB interface, an RS232 interface, 64 kB flash memory, and a 32 kHz crystal. The device senses humidity and temperature, and a humidity sensor is connected by an 18 bit ΣΔ A-to-D converter to the microcontroller and a temperature sensor is connected by a 12 bit SAR A-to-D converter to the microcontroller. The device is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process.
摘要翻译：单芯片无线传感器包括通过发射/接收接口连接到无线天线的微控制器。微控制器还连接到8 kB RAM，USB接口，RS232接口，64 kB闪存和32 kHz晶振。该设备感测湿度和温度，湿度传感器通过18位＆Sgr＆Dgr连接; 微控制器的A / D转换器和温度传感器由12位SAR A / D转换器连接到微控制器。该器件是在单个工艺中制造的集成芯片，其中电子器件和传感器元件都使用标准CMOS处理技术制造，应用于在集成过程中实现电子和感测元件。

8. 发明申请

US20090273009A1 Integrated CMOS porous sensor 有权
标题翻译：集成CMOS多孔传感器
公开(公告)号：US20090273009A1
公开(公告)日：2009-11-05
申请号：US12453965
申请日：2009-05-28
申请人： Timothy Cummins
发明人： Timothy Cummins
IPC分类号： H01L29/66 , H01L29/80 , H01L21/04
CPC分类号： G01N27/22 , G01N27/121 , G01N27/223 , H01L23/528 , H01L27/0629 , H01L27/105 , H01L27/15 , H01L2924/0002 , H01L2924/00
摘要： A single chip wireless sensor (1) comprises a microcontroller (2) connected by a transmit/receive interface (3) to a wireless antenna (4). The microcontroller (2) is also connected to an 8 kB RAM (5), a USB interface (6), an RS232 interface (8), 64 kB flash memory (9), and a 32 kHz crystal (10). The device (1) senses humidity and temperature, and a humidity sensor (11) is connected by an 18 bit ΣΔ A-to-D converter (12) to the microcontroller (2) and a temperature sensor (13) is connected by a 12 bit SAR A-to-D converter (14) to the microcontroller (2). The device (1) is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process.
摘要翻译：单芯片无线传感器（1）包括通过发射/接收接口（3）连接到无线天线（4）的微控制器（2）。微控制器（2）还连接到8kB RAM（5），USB接口（6），RS232接口（8），64kB闪存（9）和32kHz晶体（10）。设备（1）感测湿度和温度，并且湿度传感器（11）通过18位SigmaDelta A-D转换器（12）连接到微控制器（2），并且温度传感器（13）通过 12位SAR A到D转换器（14）连接到微控制器（2）。器件（1）是在单个工艺中制造的集成芯片，其中电子器件和传感器部件都使用标准CMOS处理技术制造，其被应用于在集成过程中实现电子和感测部件。

9. 发明授权

US5784120A Video decoder adapted to compensate for time variations between successive horizontal/vertical synchronization pulses 失效
标题翻译：视频解码器适于补偿连续水平/垂直同步脉冲之间的时间变化
公开(公告)号：US5784120A
公开(公告)日：1998-07-21
申请号：US656056
申请日：1996-05-31
申请人： Timothy Cummins , Brian P. Murray , Christian Bohm
发明人： Timothy Cummins , Brian P. Murray , Christian Bohm
IPC分类号： H04N9/87 , G09G5/00 , G09G5/14 , H04N5/04 , H04N5/12 , H04N9/44 , H04N9/64 , H04N9/66 , H04N9/89 , H04N11/04 , H03L7/00
CPC分类号： G09G5/005 , H04N9/641 , G09G2340/125 , G09G5/006 , H04N5/04 , H04N5/12 , H04N9/44 , H04N9/64 , H04N9/8707 , H04N9/89
摘要： A video decoder is provided wherein digitized samples of an input video signal are produced at a fixed sampling rate and, from such digitized samples, a fixed number of re-sampled digitized samples are produced for each detected sync pulse included in the video signal. The re-sampled digitized samples are stored in a buffer memory and are retrieved from such buffer memory at a rate synchronized to the sync pulse. With such an arrangement, the analog to digital converter operates at a fixed sampling rate, and overflow situations are avoided.
摘要翻译：提供了一种视频解码器，其中输入视频信号的数字化采样以固定采样率产生，并且从这些数字化样本中，为包括在视频信号中的每个检测到的同步脉冲产生固定数量的重新采样的数字化采样。重新采样的数字化样本被存储在缓冲存储器中，并且以与同步脉冲同步的速率从这种缓冲存储器检索。通过这样的配置，模数转换器以固定的采样速率工作，避免溢出情况。

10. 发明授权

US08497531B2 Integrated MOS gas or humidity sensor having a wireless transceiver 有权
标题翻译：具有无线收发器的集成MOS气体或湿度传感器
公开(公告)号：US08497531B2
公开(公告)日：2013-07-30
申请号：US12977358
申请日：2010-12-23
申请人： Timothy Cummins
发明人： Timothy Cummins
IPC分类号： H01L29/66
CPC分类号： G01N27/22 , G01N27/121 , G01N27/223 , H01L23/528 , H01L27/0629 , H01L27/105 , H01L27/15 , H01L2924/0002 , H01L2924/00
摘要： A single chip wireless sensor comprises a microcontroller connected by a transmit/receive interface to a wireless antenna. The microcontroller is also connected to an 8 kB RAM, a USB interface, an RS232 interface, 64 kB flash memory, and a 32 kHz crystal. The device senses humidity and temperature, and a humidity sensor is connected by an 18 bit ΣΔ A-to-D converter to the microcontroller and a temperature sensor is connected by a 12 bit SAR A-to-D converter to the microcontroller. The device is an integrated chip manufactured in a single process in which both the electronics and sensor components are manufactured using standard CMOS processing techniques, applied to achieve both electronic and sensing components in an integrated process.
摘要翻译：单芯片无线传感器包括通过发射/接收接口连接到无线天线的微控制器。微控制器还连接到8 kB RAM，USB接口，RS232接口，64 kB闪存和32 kHz晶振。该器件感测湿度和温度，湿度传感器由18位SigmaDelta A-D转换器连接到微控制器，温度传感器通过12位SAR A-D转换器连接到微控制器。该器件是在单个工艺中制造的集成芯片，其中电子器件和传感器元件都使用标准CMOS处理技术制造，应用于在集成过程中实现电子和感测元件。

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