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    • 1. 发明授权
    • Semiconductor structure and method for manufacturing the same
    • 半导体结构及其制造方法
    • US09419108B2
    • 2016-08-16
    • US14406904
    • 2012-08-17
    • Qingqing LiangHuicai ZhongHuilong ZhuChao ZhaoTianchun Ye
    • Qingqing LiangHuicai ZhongHuilong ZhuChao ZhaoTianchun Ye
    • H01L29/66H01L29/78
    • H01L29/66795H01L29/785H01L29/7855
    • One embodiment of present invention provides a method for manufacturing a semiconductor structure, which comprises: forming a gate stack on a semiconductor substrate and removing parts of the substrates situated on two sides of the gate stack; forming sidewall spacers on sidewalls of the gate stack and on sidewalls of the part of the substrate under the gate stack; forming doped regions in parts of the substrate on two sides of the gate stack, and forming a first dielectric layer to cover the entire semiconductor structure; selectively removing parts of the gate stack and parts of the first dielectric layer to form a channel region opening and source/drain region openings; forming a high K dielectric layer on sidewalls of the channel region opening; and implementing epitaxy process to form a continuous fin structure that spans across the channel region opening and the source/drain region openings.
    • 本发明的一个实施例提供了一种用于制造半导体结构的方法,其包括:在半导体衬底上形成栅极叠层并去除位于栅极叠层两侧的衬底的部分; 在所述栅极堆叠的侧壁上以及在所述栅极堆叠下的所述衬底的所述部分的侧壁上形成侧壁间隔物; 在所述栅极堆叠的两侧上在所述衬底的部分中形成掺杂区域,以及形成覆盖整个半导体结构的第一介电层; 选择性地去除所述栅极堆叠的部分和所述第一介电层的部分以形成沟道区域开口和源极/漏极区域开口; 在沟道区域开口的侧壁上形成高K电介质层; 并且实现外延工艺以形成跨越沟道区域开口和源极/漏极区域开口的连续翅片结构。
    • 2. 发明申请
    • SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体结构及其制造方法
    • US20150311319A1
    • 2015-10-29
    • US14406904
    • 2012-08-17
    • Qingqing LiangHuicai ZhongHuilong ZhuChao ZhaoTianchun Ye
    • Qingqing LiangHuicai ZhongHuilong ZhuChao ZhaoTianchun Ye
    • H01L29/66H01L29/78
    • H01L29/66795H01L29/785H01L29/7855
    • One embodiment of present invention provides a method for manufacturing a semiconductor structure, which comprises: forming a gate stack on a semiconductor substrate and removing parts of the substrates situated on two sides of the gate stack; forming sidewall spacers on sidewalls of the gate stack and on sidewalls of the part of the substrate under the gate stack; forming doped regions in parts of the substrate on two sides of the gate stack, and forming a first dielectric layer to cover the entire semiconductor structure; selectively removing parts of the gate stack and parts of the first dielectric layer to form a channel region opening and source/drain region openings; forming a high K dielectric layer on sidewalls of the channel region opening; and implementing epitaxy process to form a continuous fin structure that spans across the channel region opening and the source/drain region openings.
    • 本发明的一个实施例提供了一种用于制造半导体结构的方法,其包括:在半导体衬底上形成栅极叠层并去除位于栅极叠层两侧的衬底的部分; 在所述栅极堆叠的侧壁上以及在所述栅极堆叠下的所述衬底的所述部分的侧壁上形成侧壁间隔物; 在所述栅极堆叠的两侧上在所述衬底的部分中形成掺杂区域,以及形成覆盖整个半导体结构的第一介电层; 选择性地去除所述栅极堆叠的部分和所述第一介电层的部分以形成沟道区域开口和源极/漏极区域开口; 在沟道区域开口的侧壁上形成高K电介质层; 并且实现外延工艺以形成跨越沟道区域开口和源极/漏极区域开口的连续翅片结构。