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1. 发明授权

US5013248A Multicircuit connector assembly 失效
标题翻译：多路连接器总成
公开(公告)号：US5013248A
公开(公告)日：1991-05-07
申请号：US444577
申请日：1989-11-30
申请人： Thomas E. Brown , Thomas F. Davis
发明人： Thomas E. Brown , Thomas F. Davis
IPC分类号： H05K7/14
CPC分类号： H05K7/1428 , H01R12/714 , Y10T29/4922
摘要： An integrally molded electrical connector 10 for interconnecting an array 60 of conductors of a first article 58 with a corresponding array 64 of conductors of a second article 62 includes a plurality of substantially rigid bifurcated tines joined by a bight section 30, each tine having arm portions 18, 24 deflectable toward each other; and compressible support means 46 extending between the arm portions 18, 24 of the tines 16; and continuous circuit means 36 defined along outer surfaces of tine arm portions 18, 24 and bight section 30. The array of tines is formed from a dielectric material. The compressible support means 46 has sufficient durometer to maintain contact normal force between the continuous circuit means 36 and the corresponding contact means of opposed first and second electrical articles 58, 62 upon the arm portions 18, 24 being compressively held between the pair of electrical articles 58, 62.
摘要翻译：用于将第一制品58的导体的阵列60与第二制品62的导体的相应阵列64互连的整体模制的电连接器10包括多个基本上刚性的分叉齿，其由弯曲部分30连接，每个齿具有臂部分 18,24彼此偏向; 以及在尖齿16的臂部18,24之间延伸的可压缩支撑装置46; 以及沿着叉臂部分18,24和弯曲部分30的外表面限定的连续电路装置36.尖齿阵列由电介质材料形成。可压缩支撑装置46具有足够的硬度计，以在臂部分18,24被压缩地保持在一对电气制品之间时在连续电路装置36和相对的第一和第二电气制品58,62的对应接触装置之间保持接触法向力 58，62。

2. 发明授权

US4904364A Anode assembly for selectively plating interior surfaces of electrical terminals 失效
标题翻译：用于选择性地电镀端子的内表面的阳极组件
公开(公告)号：US4904364A
公开(公告)日：1990-02-27
申请号：US275812
申请日：1988-11-23
申请人： Thomas F. Davis , Richard M. Wagner
发明人： Thomas F. Davis , Richard M. Wagner
IPC分类号： C25D5/02 , C25D7/04 , H01R13/03 , H01R43/16
CPC分类号： C25D5/02
摘要： An anode assembly 30 for selectively plating contact areas 102 on the interior surface of cathodically charged socket terminals 96 is disclosed, which comprises a conductive body member 32 having an anode means or member 54 extending forwardly from a body section 38, a dielectric body member 58 adapted to be secured to a forward portion 34 of said conductive body member 32 and having a passageway 62 therethrough for receiving the anode means 54; sheath means 64 extending forwardly from the dielectric body member and along the anode means 54 and extending angularly around at least one selected circumferential portion thereof, and lateral edge surfaces 68 of the sheath means 64 defining at least one slot 70 extending axially along the anode means 54 such that at least one axially extending portion 55 of the anode means 54 is exposed along the slot 70, the sheath means 64 having a diameter smaller than the inner diameter of a terminal 96 to be plated; and means for securing said dielectric body member 58 to said forward portion 34 of said conductive body member 32. Upon moving the sheathed anode means 54 into the interior of an electrical terminal 96, supplying plating solution upon the exposed anode portion 55 of the anode means 54, and providing an electrical current flow from the anode means 54, through the plating solution and into the cathodically charged terminal 96, a layer of plating is selectively deposited on the internal surface portion 102 of the terminal 96 that is generally aligned with the at least one exposed anode portion 55, the sheath means 64 providing a barrier to prevent plating on the remaining internal terminal surface portions.

3. 发明授权

US4194913A Electroless tin and tin-lead alloy plating baths 失效
标题翻译：化学锡和锡铅合金电镀浴
公开(公告)号：US4194913A
公开(公告)日：1980-03-25
申请号：US857069
申请日：1977-12-05
申请人： Thomas F. Davis
发明人： Thomas F. Davis
IPC分类号： C23C18/48 , H05K3/24 , H05K3/34 , C23C3/02
CPC分类号： C23C18/48 , H05K3/244 , H05K3/3473
摘要： An aqueous bath useful in, and methods for, immersion plating of tin and tin-lead alloys which give greatly increased deposition rates and thicker coatings of better quality accomplished by incorporating into immersion plating tin bath compositions soluble plumbous salts in the amount from 0.5 grams per liter calculated on the basis of elemental lead to the maximum amount soluble in the bath and a sulphur-containing complexing agent for the tin and lead such as thiourea or a thiourea-type derivative; the bath solution contains stannous chloride, lead chloride, sodium hypophosphite (as a solubility enhancer) and with hydrochloric acid used as an agent for adjusting the pH in the resulting bath from 0.5 to 1.0.
摘要翻译：用于锡和锡铅合金浸渍电镀的水浴，以及沉积速度大大提高的较高质量的较厚涂层，通过将浸镀电镀锡浴组合物的可溶性铅酸盐以0.5克/ 以元素为基准计算，溶于最大量的溶液，以及锡和铅的含硫络合剂如硫脲或硫脲型衍生物; 浴溶液含有氯化亚锡，氯化铅，次磷酸钠（作为溶解度增强剂）和盐酸用作将所得浴中的pH调节为0.5至1.0的试剂。

4. 发明授权

US5382928A RF filter having composite dielectric layer and method of manufacture 失效
标题翻译：具有复合介电层的RF滤波器及其制造方法
公开(公告)号：US5382928A
公开(公告)日：1995-01-17
申请号：US8277
申请日：1993-01-22
申请人： Thomas F. Davis , James F. Iannella
发明人： Thomas F. Davis , James F. Iannella
IPC分类号： H01G4/35 , H03H1/00 , H03H7/01 , H05K9/00
CPC分类号： H03H1/0007 , Y10T29/49002
摘要： A distributed element filter member (10) comprises a semi-conductor member (12) having a composite dielectric layer (24) disposed on and secured to a first major surface (16) of the member (12), the layer (24) being comprised of a polymerized dielectric material made of either barium titanate or strontium titanate particles in various ranges of mixture; a conductive layer (34) is disposed on portions of the dielectric layer defining an outer ground conductor and an inner conductive layer (36) is disposed on a second major surface of the semi-conductor member defining a signal conductor. The polymer utilized may be selected from an aqueous solution containing acrylic styrene as a copolymer or a solid polyester dissolved in carbitol acetate, or a solid bisphenol A-based epoxy resin dissolved in butyl carbitol acetate with various mixtures of barium or strontium titanate utilized. A filter (12') embodiment includes three layers of polymerized material.
摘要翻译：分布式元件过滤构件（10）包括半导体构件（12），其具有设置在构件（12）的第一主表面（16）上并固定到构件（12）的第一主表面（16）上的复合介电层（24），所述层（24）包括由各种混合范围的钛酸钡或钛酸锶颗粒制成的聚合电介质材料; 导电层（34）设置在限定外部接地导体的介电层的部分上，并且内部导电层（36）设置在限定信号导体的半导体构件的第二主表面上。所使用的聚合物可以选自含有丙烯酸苯乙烯作为共聚物或溶解在乙酸卡必醇酯中的固体聚酯的水溶液，或溶解在丁基卡必醇乙酸酯中的固体双酚A型环氧树脂，其中所用的钡或钛酸锶的各种混合物。过滤器（12'）实施例包括三层聚合材料。

5. 发明授权

US4934968A Nickel plated contact surface having preferred crystallographic orientation 失效
标题翻译：镀镍的接触表面具有优选的晶体取向
公开(公告)号：US4934968A
公开(公告)日：1990-06-19
申请号：US331707
申请日：1989-03-31
申请人： Thomas F. Davis , David Kahn
发明人： Thomas F. Davis , David Kahn
IPC分类号： C25D3/12 , H01R13/03
CPC分类号： C25D3/12 , H01R13/03 , H01R12/716 , Y10S428/929 , Y10S428/935 , Y10T428/12944
摘要： Electrical contact device such as a terminal or a contact surface, has electrodeposited nickel thereon. The crystallites of the nickel are preferentially oriented with at least 50 percent of the volume {100} atomic planes substantially parallel to the contact surface. For many purposes, the preferentially oriented nickel surface is comparable to a gold plated contact surface.
摘要翻译：诸如端子或接触表面的电接触装置在其上电沉积镍。镍的微晶优先取决于体积{100}原子平面的至少50％基本上平行于接触表面。出于许多目的，优先取向的镍表面与镀金接触表面相当。

6. 再颁专利

USRE30434E Electroless tin and tin-lead alloy plating baths 失效
标题翻译：化学锡和锡铅合金电镀浴
公开(公告)号：USRE30434E
公开(公告)日：1980-11-11
申请号：US972088
申请日：1978-12-21
申请人： Thomas F. Davis
发明人： Thomas F. Davis
IPC分类号： C23C18/31 , C23C18/48
CPC分类号： C23C18/48 , C23C18/31
摘要： Salt compositions and baths thereof useful in, and methods for, immersion plating of tin and tin-lead alloys which give greatly increased deposition rates and thicker coatings of better quality accomplished by incorporating into immersion plating tin bath compositions soluble plumbous salts in the amount of from 0.5 grams per liter calculated on the basis of elemental lead to the maximum amount soluble in the bath and a sulphur-containing complexing agent for the tin and lead such as thiourea or a thiourea-type derivative. Preferably the salt elements are stannous chloride, lead chloride, sodium hypophosphite (as a solubility enhancer) and with hydrochloric acid used as a agent for adjusting the pH in the resulting bath from 0.5 to 1.0.

7. 发明授权

US4143186A Process for electroless copper deposition from an acidic bath 失效
标题翻译：从酸性浴中电沉积铜的方法
公开(公告)号：US4143186A
公开(公告)日：1979-03-06
申请号：US815409
申请日：1977-07-13
申请人： Thomas F. Davis
发明人： Thomas F. Davis
IPC分类号： C23C18/40 , H05K1/03 , H05K3/18 , C23C3/02
CPC分类号： C23C18/40 , H05K1/0346 , H05K3/181
摘要： An electroless plating process for copper in an acidic bath whereby copper by a chemical reduction process is continuously being plated to a desired thickness on a suitable substrate; this process is especially applicable to plating of copper and substrates which are susceptible to alkaline solutions such as polyimides, polyparabanic acids, etc.

8. 发明授权

US4234631A Method for immersion deposition of tin and tin-lead alloys 失效
标题翻译：锡和锡铅合金浸渍沉积方法
公开(公告)号：US4234631A
公开(公告)日：1980-11-18
申请号：US59767
申请日：1979-07-20
申请人： Thomas F. Davis
发明人： Thomas F. Davis
IPC分类号： C23C18/48 , H05K3/24 , H05K3/34 , C23C3/02
CPC分类号： C23C18/48 , H05K3/244 , H05K3/3473
摘要： An aqueous bath useful in, and methods for, immersion plating of tin and tin-lead alloys which give greatly increased deposition rates and thicker coatings of better quality accomplished by incorporating into immersion plating tin bath compositions soluble plumbous salts in the amount from 0.5 grams per liter calculated on the basis of elemental lead to the maximum amount soluble in the bath and a sulphur-containing complexing agent for the tin and lead such as thiourea or a thiourea-type derivative; the bath solution contains stannous chloride, lead chloride, sodium hypophosphite (as a solubility enhancer) and with hydrochloric acid used as an agent for adjusting the pH in the resulting bath from 0.5 to 1.0.
摘要翻译：用于锡和锡铅合金浸渍电镀的水浴，以及沉积速度大大提高的较高质量的较厚涂层，通过将浸镀电镀锡浴组合物的可溶性铅酸盐以0.5克/ 以元素为基准计算，溶于最大量的溶液，以及锡和铅的含硫络合剂如硫脲或硫脲型衍生物; 浴溶液含有氯化亚锡，氯化铅，次磷酸钠（作为溶解度增强剂）和盐酸用作将所得浴中的pH调节为0.5至1.0的试剂。

9. 发明授权

US5002493A Panel mounted electronic assembly 失效
标题翻译：面板安装电子组件
公开(公告)号：US5002493A
公开(公告)日：1991-03-26
申请号：US407762
申请日：1989-09-19
申请人： Thomas E. Brown , Thomas F. Davis
发明人： Thomas E. Brown , Thomas F. Davis
IPC分类号： G09F9/00 , H01R12/71 , H05K7/14
CPC分类号： H01R12/714 , H05K7/1428 , Y10S439/931 , Y10T29/49158
摘要： An electronic assembly is disclosed comprising a molded dielectric connector means including an electronic package mounted therewithin, the connector means 80 being adapted to be secured to a framework. The connector means includes first and second molded member 82,110 securable together at an interface. The first molded member has outwardly facing surface portion including an interconnection region 94, and includes compliant spring portions 90 integral therewith portions and extending outwardly therefrom at the interface. The compliant spring portions 90 are adapted to be deflected by the second molded member 110 upon assembly of the molded members. Circuit means 92 are included on the first molded member 82 and are defined along the outside surface portions and extending along outwardly facing surface portions of the compliant spring portions 90 and further extending to interconnection region 94. The second molded member 110 includes a portion engagable with the compliant spring portion 90 and circuit means 164, defined on said engagable portion. Upon assembly of the first and second molded members the conductive portions 164 of the second molded member 110 are held under compression against the spring circuit surface 91 and upon mounting the assembly to said framework, the interconnection section 94 of the first molded member circuitry is electrically connected to corresponding contact means along the framework. In the preferred embodiment, resilient member 93 is used to support the spring arm portions 90 to minimize stress on the spring portions 90.

10. 发明授权

US4969842A Molded electrical connector having integral spring contact beams 失效
标题翻译：具有整体弹簧接触梁的模制电连接器
公开(公告)号：US4969842A
公开(公告)日：1990-11-13
申请号：US443979
申请日：1989-11-30
申请人： Thomas F. Davis
发明人： Thomas F. Davis
IPC分类号： H01R12/71 , H01R13/03 , H01R24/00
CPC分类号： H01R13/035 , H01R12/714 , Y10S439/931
摘要： The molded connector 10 includes a dielectric housing 12 having a transverse wall 14 with a plurality of apertures 20 extending therethrough and first and second molded sections 24, 32 extending outwardly from the periphery of and at opposite ends of respective apertures 20, the corresponding first and second molded sections 24, 32 being associated with each other and including first surface portions 26, 34 extending continuously from a common sidewall 22 of the respective aperture 20. The first and second molded sections 24, 32 include an inner dielectric core integrally molded with the housing wall 14 and at least one layer 40 of plating disposed on first surface portions 26, 34 thereof and along the respective common aperture sidewall 22 thereby defining first and second contact sections 42, 46 connected by a continuous conductive surface 44 extending therebetween. The first and second molded sections 24, 42 are adapted to interconnect first and second contact means in engagement with the first and second contact sections 42, 46 respectively. In the preferred embodiment at least one contact section is a complient beam and the plating thereon strengthens the beam such that the beam provides sufficient compression force to maintain electrical contact with a mating article without the need for elastomeric support.

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