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1. 发明授权

US08197177B2 Semiconductor wafer handling and transport 有权
标题翻译：半导体晶圆处理和运输
公开(公告)号：US08197177B2
公开(公告)日：2012-06-12
申请号：US12025541
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/306
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
摘要翻译：模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。

2. 发明申请

US20080187418A1 SEMICONDUCTOR WAFER HANDLING AND TRANSPORT 有权
公开(公告)号：US20080187418A1
公开(公告)日：2008-08-07
申请号：US12025516
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/67
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

3. 发明授权

US06844992B2 Opto-mechanical platform 失效
标题翻译：光机械平台
公开(公告)号：US06844992B2
公开(公告)日：2005-01-18
申请号：US10390176
申请日：2003-03-18
申请人： Thomas A. Schaefer , Gregory G. Cappiello , Ninghui Zhu , Kurt E. Abdelmaseh , Evgueni V. Babenko , William J. Hubbard , Kevin J. McIntyre , Brian J. McKeen , Paul Ouellette , Andrew Radl , Dick Rolfe
发明人： Thomas A. Schaefer , Gregory G. Cappiello , Ninghui Zhu , Kurt E. Abdelmaseh , Evgueni V. Babenko , William J. Hubbard , Kevin J. McIntyre , Brian J. McKeen , Paul Ouellette , Andrew Radl , Dick Rolfe
IPC分类号： G02B6/34 , G02B7/00 , G02B7/02
CPC分类号： G02B6/2931 , G02B6/3628 , G02B7/00 , G02B7/008
摘要： An opto-mechanical platform for supporting truncated optical elements having at least one substantially flat side surface is disclosed. In one particular exemplary embodiment, the opto-mechanical platform may be realized as an apparatus for supporting truncated optical elements having at least one substantially flat side surface. Such an apparatus may comprise a platform having a substantially flat surface area for supporting the substantially flat side surface of the truncated optical elements. Such an apparatus may also comprise at least one substantially vertical wall formed on at least a portion of the platform for providing mechanical rigidity to the platform.
摘要翻译：公开了一种用于支撑具有至少一个基本上平坦的侧表面的截头光学元件的光学机械平台。在一个特定的示例性实施例中，光机械平台可以被实现为用于支撑具有至少一个基本上平坦的侧表面的截头光学元件的装置。这种装置可以包括具有用于支撑截短的光学元件的基本上平坦的侧表面的基本上平坦的表面区域的平台。这种装置还可以包括形成在平台的至少一部分上的至少一个基本垂直的壁，用于向平台提供机械刚性。

4. 发明授权

US06825997B2 Optical element mounting technique 失效
标题翻译：光学元件安装技术
公开(公告)号：US06825997B2
公开(公告)日：2004-11-30
申请号：US10390153
申请日：2003-03-18
申请人： William J. Hubbard , Kevin J. McIntyre , Andrew Radl , Thomas A. Schaefer , Ian C. Prees
发明人： William J. Hubbard , Kevin J. McIntyre , Andrew Radl , Thomas A. Schaefer , Ian C. Prees
IPC分类号： G02B702
CPC分类号： G02B7/008 , G02B7/00
摘要： A technique for attaching an optical element to a structural element is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for attaching an optical element to a structural element. Such an apparatus may comprise an optical element formed of a material having a first coefficient of thermal expansion value, a structural element formed of a material having a second coefficient of thermal expansion value, and an intermediate element formed of a material having a third coefficient of thermal expansion value that is between the first coefficient of thermal expansion value and the second coefficient of thermal expansion value. The intermediate element is disposed between the optical element and the structural element such that thermal stress between the optical element and the structural element are transferred to the intermediate element.
摘要翻译：公开了一种用于将光学元件附接到结构元件的技术。在一个特定的示例性实施例中，该技术可以被实现为用于将光学元件附接到结构元件的装置。这样的装置可以包括由具有第一热膨胀系数值的材料形成的光学元件，由具有第二热膨胀系数的材料形成的结构元件，以及由具有第三系数的材料形成的中间元件第一热膨胀系数与第二热膨胀系数之间的热膨胀值。中间元件设置在光学元件和结构元件之间，使得光学元件和结构元件之间的热应力传递到中间元件。

5. 发明授权

US08672605B2 Semiconductor wafer handling and transport 有权
标题翻译：半导体晶圆处理和运输
公开(公告)号：US08672605B2
公开(公告)日：2014-03-18
申请号：US12025477
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/677
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
摘要翻译：模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。

6. 发明授权

US08500388B2 Semiconductor wafer handling and transport 有权
标题翻译：半导体晶圆处理和运输
公开(公告)号：US08500388B2
公开(公告)日：2013-08-06
申请号：US12025516
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： B65G49/07
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
摘要翻译：模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。

7. 发明申请

US20080232948A1 SEMICONDUCTOR WAFER HANDLING AND TRANSPORT 审中-公开
标题翻译：半导体波浪处理和运输
公开(公告)号：US20080232948A1
公开(公告)日：2008-09-25
申请号：US12025582
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/67
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
摘要翻译：模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。

8. 发明申请

US20080232947A1 SEMICONDUCTOR WAFER HANDLING AND TRANSPORT 有权
公开(公告)号：US20080232947A1
公开(公告)日：2008-09-25
申请号：US12025541
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/67
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

9. 发明申请

US20080187417A1 SEMICONDUCTOR WAFER HANDLING AND TRANSPORT 有权
公开(公告)号：US20080187417A1
公开(公告)日：2008-08-07
申请号：US12025477
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/67
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

10. 发明授权

US07109499B2 Apparatus and methods for two-dimensional ion beam profiling 有权
标题翻译：二维离子束分析的装置和方法
公开(公告)号：US07109499B2
公开(公告)日：2006-09-19
申请号：US10981887
申请日：2004-11-05
申请人： Gordon C. Angel , Edward D. MacIntosh , Thomas A. Schaefer
发明人： Gordon C. Angel , Edward D. MacIntosh , Thomas A. Schaefer
IPC分类号： H01J37/04
CPC分类号： G01T1/29 , H01J37/304 , H01J37/3171
摘要： Methods and apparatus are provided for measuring a profile of an ion beam. The apparatus includes an array of beam current sensors, each producing a sensor signal in response to incident ions of the ion beam, a translation mechanism configured to translate the array of beam current sensors along a translation path with respect to the ion beam, and a controller configured to acquire the sensor signals produced by the beam current sensors at a plurality of positions along the translation path, wherein the acquired sensor signals are representative of a two-dimensional profile of the ion beam.
摘要翻译：提供了用于测量离子束轮廓的方法和装置。该装置包括一束束电流传感器，每个射束电流传感器响应于离子束的入射离子产生传感器信号;平移机构，被配置为沿着相对于离子束的平移路径平移束电流传感器阵列;以及控制器被配置为在沿着平移路径的多个位置处获取由束电流传感器产生的传感器信号，其中所获取的传感器信号表示离子束的二维轮廓。

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