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    • 3. 发明申请
    • Apparatus and method for optical interference fringe based integrated circuit processing
    • 用于光干涉条纹集成电路处理的装置和方法
    • US20060188797A1
    • 2006-08-24
    • US11362240
    • 2006-02-24
    • Erwan RoyChun-Cheng TsaoTheodore Lundquist
    • Erwan RoyChun-Cheng TsaoTheodore Lundquist
    • G03C5/00A61N5/00G21G5/00
    • H01J37/3174B23K26/03B23K26/032B82Y10/00B82Y40/00
    • An apparatus and method for processing an integrated circuit employing optical interference fringes. During processing, light is directed on the integrated circuit and based upon the detection of interference fringes, further processing may be controlled. One implementation involves charged particle beam processing of an integrated circuit as function of detection of interference fringes. A charged particle beam trench milling operation is performed in or on the substrate of an integrated circuit. Light is directed on the floor of the trench. When the floor approaches the underlying circuit structures, some light is reflected from the floor of the trench and some light penetrates the substrate and is reflected off the underlying circuit structures. Interference fringes may be formed from the constructive or destructive interference between the light reflected from the floor and the light from the circuit structures. Processing may be controlled as function of the detection of interference fringes.
    • 一种使用光学干涉条纹处理集成电路的装置和方法。 在处理期间,光被引导到集成电路上,并且基于干涉条纹的检测,可以控制进一步的处理。 一种实施方案涉及集成电路的带电粒子束处理作为干涉条纹检测的功能。 在集成电路的衬底中或其上执行带电粒子束沟槽铣削操作。 光照在沟槽的地板上。 当地板接近下面的电路结构时,一些光从沟槽的底部反射,并且一些光穿透衬底并从下面的电路结构反射。 干涉条纹可以由从地板反射的光与来自电路结构的光之间的建构性或破坏性干扰形成。 作为检测干涉条纹的功能,可以控制处理。
    • 6. 发明申请
    • APPARATUS AND METHOD FOR INTEGRATED CIRCUIT DESIGN FOR CIRCUIT EDIT
    • 用于电路编辑的集成电路设计的装置和方法
    • US20080028345A1
    • 2008-01-31
    • US11869336
    • 2007-10-09
    • Hitesh SuriTahir MalikTheodore Lundquist
    • Hitesh SuriTahir MalikTheodore Lundquist
    • G06F17/50H01L29/00
    • G06F17/5045
    • A method and apparatus for optimizing an integrated circuit design for post-fabrication circuit editing and diagnostics. The method and apparatus is specifically directed to adding designed-for-edit modifications and designed-for-diagnostics structures to an integrated circuit design for post-fabrication circuit editing with a charged-particle beam tool. An integrated circuit design may be modified to create efficient and reliable access to specified nodes and structures, such as spare gates, by the charged-particle beam tool during subsequent testing and debugging of the fabricated device. Additionally, structures such as spare gates, spare transistors, spare metal wires, and debug circuitry may be added to an integrated circuit design to provide for easier editing of portions of the design that may fail.
    • 一种用于优化后制造电路编辑和诊断的集成电路设计的方法和装置。 该方法和装置特别涉及将设计的编辑修改和设计的诊断结构添加到用于利用带电粒子束工具的后制造电路编辑的集成电路设计。 可以修改集成电路设计,以便在随后的制造的器件的测试和调试期间通过带电粒子束工具高效且可靠地访问指定的节点和结构,例如备用栅极。 此外,诸如备用栅极,备用晶体管,备用金属线和调试电路的结构可以被添加到集成电路设计中,以便更容易地编辑可能失败的部分设计。
    • 9. 发明申请
    • Precise, in-situ endpoint detection for charged particle beam processing
    • 用于带电粒子束处理的精确的原位端点检测
    • US20050109956A1
    • 2005-05-26
    • US10984096
    • 2004-11-09
    • Theodore LundquistKenneth Wilsher
    • Theodore LundquistKenneth Wilsher
    • H01J37/304H01J37/305H01J27/00
    • H01J37/304H01J37/3056
    • A system and method for determining precisely in-situ the endpoint of halogen-assisted charged particle beam milling of a hole or trench in the backside of the substrate of a flipchip packaged IC. The backside of the IC is mechanically thinned. Optionally, a coarse trench is then milled in the thinned backside of the IC using either laser chemical etching or halogen-assisted charged particle beam milling. A further small trench is milled using a halogen-assisted charged-particle beam (electron or ion beam). The endpoint for milling this small trench is determined precisely by monitoring the power supply leakage current of the IC induced by electron-hole pairs created by the milling process. A precise in-situ endpoint detection signal is generated by modulating the beam at a reference frequency and then amplifying that frequency component in the power supply leakage current with an amplifier, narrow-band amplifier or lock-in amplifier. The precise, in-situ, endpoint signal is processed and displayed for manual or automatic precise in-situ endpoint detection. This approach avoids or minimizes unintentional damage or perturbation of the active diffusion regions in the IC. A range of further operations on the IC can then be performed.
    • 用于准确地确定倒装芯片封装IC的衬底的背面中的空穴或沟槽的卤素辅助带电粒子束铣削的终点的系统和方法。 IC的背面机械变薄。 可选地,使用激光化学蚀刻或卤素辅助带电粒子束研磨,在IC的薄化背面中研磨粗沟槽。 使用卤素辅助带电粒子束(电子或离子束)研磨另外的小沟槽。 通过监测由铣削过程产生的电子 - 空穴对引起的IC的电源漏电流,精确地确定了用于铣削该小沟槽的端点。 通过以参考频率调制光束然后用放大器,窄带放大器或锁定放大器放大该电源漏电流中的该频率分量来产生精确的原位端点检测信号。 精确的原位端点信号被处理和显示用于手动或自动精确的原位端点检测。 该方法避免或最小化IC中的有源扩散区域的无意的损坏或扰动。 然后可以执行IC上的一系列进一步的操作。