专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20200266050A1 OPTIMAL EXPOSURE OF A BOTTOM SURFACE OF A SUBSTRATE MATERIAL AND/OR EDGES THEREOF FOR CLEANING IN A SPIN COATING DEVICE 审中-公开
公开(公告)号：US20200266050A1
公开(公告)日：2020-08-20
申请号：US16865438
申请日：2020-05-04
申请人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
发明人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
IPC分类号： H01L21/02 , G03F7/16 , B08B3/02 , H01L21/687 , H01L21/67 , B05C11/08
摘要： A non-transitory medium includes instructions to control a spin coating device including instructions to render a cleaning nozzle of the spin coating device below a base plate and out of optimal exposure to a bottom surface and edges of a substrate material placed on a spin chuck in a state of engagement of the base plate with the spin chuck. In response to disengagement of a lid from the base plate, the non-transitory medium also includes instructions to disengage the base plate from the spin chuck to lower the base plate to a locking point whereupon a portion of the cleaning nozzle below the base plate passes through a hole in the base plate and emerges completely out of and above the base plate, and instructions to clean the bottom surface and/or the edges of the substrate material utilizing the cleaning nozzle based on an optimal exposure thereof.

2. 发明申请

US20060048153A1 Locally operated desktop environment for a remote computing system 有权
标题翻译：用于远程计算系统的本地操作桌面环境
公开(公告)号：US20060048153A1
公开(公告)日：2006-03-02
申请号：US11215956
申请日：2005-08-30
申请人： Thanh Truong
发明人： Thanh Truong
IPC分类号： G06F9/46 , G06F15/16 , G06F15/173
CPC分类号： H04L67/02 , G06F9/452 , G06F9/5072 , H04L63/083
摘要： A system and method is provided for a remote desktop environment for a grid enabled system. The system can include a grid enabled server capable of being connected into a grid network. A client computer can be in communication with the grid enabled server. A user desktop environment can be provided for the client computer, and the user desktop environment can securely connect to the grid enabled server, a grid computing network, and map to client computer operating system resources. In addition, a file manager can be in communication with the user desktop environment. The file manager may be configured to allow users to own and directly access user accounts and directories on the grid enabled server.
摘要翻译：为启用网格的系统提供了远程桌面环境的系统和方法。该系统可以包括能够连接到网格网络中的启用网格的服务器。客户端计算机可以与启用网格的服务器进行通信。可以为客户端计算机提供用户桌面环境，用户桌面环境可以安全地连接到启用网格的服务器，网格计算网络，并映射到客户端计算机操作系统资源。此外，文件管理器可以与用户桌面环境通信。文件管理器可能被配置为允许用户拥有并直接访问启用网格的服务器上的用户帐户和目录。

3. 发明授权

US11495451B2 Optimal exposure of a bottom surface of a substrate material and/or edges thereof for cleaning in a spin coating device 有权
公开(公告)号：US11495451B2
公开(公告)日：2022-11-08
申请号：US16865438
申请日：2020-05-04
申请人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
发明人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
IPC分类号： H01L21/02 , G03F7/16 , B05C11/08 , H01L21/67 , B08B3/02 , H01L21/687
摘要： A non-transitory medium includes instructions to control a spin coating device to render a cleaning nozzle of the spin coating device below a base plate and out of optimal exposure to a substrate material placed on a spin chuck when the base plate is engaged with the spin chuck. In response to disengagement of a lid from the base plate, the non-transitory medium also includes instructions to disengage the base plate from the spin chuck to lower the base plate to a locking point whereupon a portion of the cleaning nozzle below the base plate passes through a hole in the base plate and emerges completely out of and above the base plate, and instructions to clean the bottom surface and/or the edges of the substrate material utilizing the cleaning nozzle based on an optimal exposure to the bottom surface and the edges of the substrate material.

4. 发明授权

US10679844B2 Optimal exposure of a bottom surface of a substrate material and/or edges thereof for cleaning in a spin coating device 有权
公开(公告)号：US10679844B2
公开(公告)日：2020-06-09
申请号：US16459613
申请日：2019-07-02
申请人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
发明人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
IPC分类号： H01L21/02 , G03F7/16 , B05C11/08 , H01L21/67 , B08B3/02 , H01L21/687
摘要： A spin coating device includes a base plate, a spin chuck on which a substrate material is placed, and an actuator mechanism to engage the base plate with the spin chuck such that the base plate synchronously spins along with the spin chuck. The substrate material includes a top surface coated with a film-forming substance and a bottom surface. The cleaning mechanism is below the base plate and out of optimal exposure to the bottom surface and edges of the substrate material in a state of base plate engagement. In response to disengagement of a lid configured to synchronously co-rotate with the base plate, the actuator mechanism is further configured to disengage the base plate from the spin chuck and to enable the optimal exposure of the cleaning mechanism to the bottom surface and the edges of the substrate material.

5. 发明申请

US20200013614A1 OPTIMAL EXPOSURE OF A BOTTOM SURFACE OF A SUBSTRATE MATERIAL AND/OR EDGES THEREOF FOR CLEANING IN A SPIN COATING DEVICE 审中-公开
公开(公告)号：US20200013614A1
公开(公告)日：2020-01-09
申请号：US16459613
申请日：2019-07-02
申请人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
发明人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
IPC分类号： H01L21/02 , G03F7/16 , B08B3/02
摘要： A spin coating device includes a base plate, a spin chuck on which a substrate material is placed, and an actuator mechanism to engage the base plate with the spin chuck such that the base plate synchronously spins along with the spin chuck. The substrate material includes a top surface coated with a film-forming substance and a bottom surface. The cleaning mechanism is below the base plate and out of optimal exposure to the bottom surface of the substrate material and edges thereof in a state of the base plate engagement. In response to disengagement of a lid configured to synchronously co-rotate with the base plate, the actuator mechanism is further configured to disengage the base plate from the spin chuck and to enable the optimal exposure of the cleaning mechanism to the bottom surface of the substrate material and the edges thereof.

6. 发明授权

US08999107B2 Laser ashing of polyimide for semiconductor manufacturing 有权
标题翻译：用于半导体制造的聚酰亚胺的激光灰化
公开(公告)号：US08999107B2
公开(公告)日：2015-04-07
申请号：US13285408
申请日：2011-10-31
申请人： Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
发明人： Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
IPC分类号： B32B38/10 , H01L21/301 , H01L21/02 , B08B7/00 , B23K26/40 , H01L21/311 , H01L23/00
CPC分类号： H01L24/799 , B08B7/0042 , B23K2103/42 , B23K2103/50 , B32B38/0008 , B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/02076 , H01L21/31127 , H01L24/27 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/05442 , H01L2924/07025 , H01L2924/12042 , H01L2924/3025 , H01L2924/40501 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1158 , Y10T156/1917 , H01L2924/00
摘要： A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
摘要翻译：一种使用结构的半导体制造方法的聚酰亚胺的激光灰化方法，包括通过聚酰亚胺胶粘在半导体芯片上的支撑材料的结构，包括从聚酰亚胺胶释放支撑材料，使得聚酰亚胺胶保持在半导体芯片; 并使用烧蚀激光将半导体芯片上的聚酰亚胺胶粉化。

7. 发明申请

US20100326702A1 INTEGRATED CIRCUIT ASSEMBLY 有权
标题翻译：集成电路总成
公开(公告)号：US20100326702A1
公开(公告)日：2010-12-30
申请号：US12490804
申请日：2009-06-24
申请人： Bing Dang , David Hirsch Danovitch , Mario John Interrante , John Ulrich Knickerbocker , Michael Jay Shapiro , Van Thanh Truong
发明人： Bing Dang , David Hirsch Danovitch , Mario John Interrante , John Ulrich Knickerbocker , Michael Jay Shapiro , Van Thanh Truong
IPC分类号： H05K1/02 , H05K3/00
CPC分类号： H01L21/6836 , H01L21/6835 , H01L24/02 , H01L24/11 , H01L24/16 , H01L24/81 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68354 , H01L2221/68372 , H01L2224/0401 , H01L2224/11002 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16235 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/80006 , H01L2224/81005 , H01L2224/81011 , H01L2224/81801 , H01L2224/83005 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , H01L2224/81 , H01L2924/00012 , H01L2224/11 , H01L2224/83
摘要： Methods and apparatus for forming an integrated circuit assembly are presented, for example, three dimensional integrated circuit assemblies. Lower height 3DIC assemblies due Use of, for example, thinned wafers, low-height solder bumps, and through silicon vias provide for low height three dimensional integrated circuit assemblies. For example, a method for forming an integrated circuit assembly comprises forming first solder bumps on a first die, and forming a first structure comprising the first die, the first solder bumps, a first flux, and a first substratum. The first die is placed upon the first substratum. The first solder bumps are between the first die and the first substratum. The first flux holds the first die substantially flat and onto the first substratum.
摘要翻译：提出了用于形成集成电路组件的方法和装置，例如，三维集成电路组件。较低的高度3DIC组件由于使用例如薄化晶片，低高度焊料凸块和通过硅通孔，可提供低高度三维集成电路组件。例如，一种用于形成集成电路组件的方法包括在第一裸片上形成第一焊料凸块，以及形成包括第一裸片，第一焊料凸块，第一焊剂和第一衬底的第一结构。第一个模具被放置在第一个基础上。第一焊锡凸块位于第一裸片和第一衬底之间。第一通量使第一模具基本平坦并保持在第一基底上。

8. 发明申请

US20220097236A1 Robotic Systems and Methods for Collecting Trash Outdoors 有权
公开(公告)号：US20220097236A1
公开(公告)日：2022-03-31
申请号：US17037926
申请日：2020-09-30
申请人： William Daniel Bellinger , Camden Henry Denk , Ethan Frederick Egger , Emmett Monroe Fountain , Owen Keith Gulick , Amanda Nicole Jaworsky , Katelyn Suzanne Kersten , Steven Michael Kersten , Gabriel Steven Lounsbury , Noah Riley Palmatier , Joseph Andrew Rasmus , Faith Mae Schafer , Jack Arthur Schafer , Allyson Christine Suandi , Trucy Thanh Truong-Phan
发明人： William Daniel Bellinger , Camden Henry Denk , Ethan Frederick Egger , Emmett Monroe Fountain , Owen Keith Gulick , Amanda Nicole Jaworsky , Katelyn Suzanne Kersten , Steven Michael Kersten , Gabriel Steven Lounsbury , Noah Riley Palmatier , Joseph Andrew Rasmus , Faith Mae Schafer , Jack Arthur Schafer , Allyson Christine Suandi , Trucy Thanh Truong-Phan
IPC分类号： B25J9/16 , E01H1/08 , B25J11/00 , B25J5/00
摘要： Robotic systems and methods for collecting trash are provided. The robotic system includes a vehicle, a camera, a trash collection unit, an actuator, and a controller. The vehicle includes a drive. The camera moves with the vehicle to capture images of the trash while the vehicle moves along ground. The trash collection unit is carried by the vehicle to collect the trash. The trash collection unit includes a vacuum pump and a collection conduit. The actuator is operatively coupled to the collection conduit to adjust a position of the collection conduit relative to the vehicle to position the collection conduit adjacent to the trash to collect the trash. The controller is coupled to the drive, the camera, the trash collection unit, and the actuator to coordinate movement of the vehicle, positioning of the collection conduit, and operation of the vacuum pump to collect the trash.

9. 发明授权

US11239070B2 Optimal exposure of a bottom surface of a substrate material and/or edges thereof for cleaning in a spin coating device 有权
公开(公告)号：US11239070B2
公开(公告)日：2022-02-01
申请号：US16865433
申请日：2020-05-04
申请人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
发明人： Thanh Truong , Tri Dang , Tu Tran , Hieu Charlie Nguyen
IPC分类号： H01L21/02 , B08B3/02 , G03F7/16 , B05C11/08 , H01L21/67 , H01L21/687
摘要： A method includes rendering a cleaning nozzle of a spin coating device below a base plate and out of optimal exposure to a bottom surface and edges of a substrate material placed on a spin chuck in a state of engagement of the base plate with the spin chuck, and rendering the base plate completely under the spin chuck even in the aforementioned state of engagement. In response to disengagement of a lid from the base plate, the method also includes disengaging the base plate from the spin chuck to lower the base plate to a locking point whereupon a portion of the cleaning nozzle below the base plate passes through a hole in the base plate and emerges completely out of and above the base plate, and cleaning the bottom surface and/or the edges of the substrate material utilizing the cleaning nozzle based on an optimal exposure thereof.

10. 发明申请

US20120111496A1 LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING 有权
标题翻译：用于半导体制造的聚酰亚胺的激光吸附
公开(公告)号：US20120111496A1
公开(公告)日：2012-05-10
申请号：US13285408
申请日：2011-10-31
申请人： Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
发明人： Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
IPC分类号： B32B38/10 , B29C35/08
CPC分类号： H01L24/799 , B08B7/0042 , B23K2103/42 , B23K2103/50 , B32B38/0008 , B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/02076 , H01L21/31127 , H01L24/27 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/05442 , H01L2924/07025 , H01L2924/12042 , H01L2924/3025 , H01L2924/40501 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1158 , Y10T156/1917 , H01L2924/00
摘要： A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
摘要翻译：一种使用结构的半导体制造方法的聚酰亚胺的激光灰化方法，包括通过聚酰亚胺胶粘在半导体芯片上的支撑材料的结构，包括从聚酰亚胺胶释放支撑材料，使得聚酰亚胺胶保持在半导体芯片; 并使用烧蚀激光将半导体芯片上的聚酰亚胺胶粉化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式