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    • 4. 发明申请
    • SCANNING ELECTRON MICROSCOPE AND METHOD FOR PREPARING SPECIMEN
    • 扫描电子显微镜及其制备方法
    • US20140084159A1
    • 2014-03-27
    • US14116697
    • 2012-03-14
    • Kaori YaeshimaSatoshi TakadaFumiaki EndoTetsuya Niibori
    • Kaori YaeshimaSatoshi TakadaFumiaki EndoTetsuya Niibori
    • H01J37/28G01N23/225
    • H01J37/28G01N23/2251H01J2237/2817H01L22/12H01L2924/0002H01L2924/00
    • In related art, when a location to be analyzed is selected from inspection data, a relatively highly critical defect among entire defects is not selected as a defect to be analyzed. Further, when a mark is placed in a fixed position associated with a defect, the mark affects the defect itself depending on the shape and size of the defect, which is problematic in the following analysis made in an analysis apparatus. Moreover, in the case of a wafer with no pattern, a defect invisible to a SEM cannot be marked.To select a highly critical defect as a defect to be analyzed, an automatic classification result from a review SEM is used to select a defect to be analyzed. Further, to avoid an effect on a defect itself, a mark is placed in a position associated with the defect with the distance from the defect to the marking position changed on a defect basis. To this end, the shape and size of a defect is recognized based on ADR or ADC, and a mark is placed in a position set apart from the defect by a distance in consideration of a range to be affected by the mark. Further, in the case of a defect that is not observable with a SEM, a mark is placed by using an observation result from an optical microscope.
    • 在相关技术中,当从检查数据中选择待分析的位置时,不会选择整个缺陷中相当高度关键的缺陷作为要分析的缺陷。 此外,当标记被放置在与缺陷相关联的固定位置时,标记根据缺陷的形状和尺寸影响缺陷本身,这在分析装置中进行的以下分析中是有问题的。 此外,在没有图案的晶片的情况下,不能对SEM不可见的缺陷进行标记。 为了选择非常关键的缺陷作为要分析的缺陷,使用复查SEM的自动分类结果来选择要分析的缺陷。 此外,为了避免对缺陷本身的影响,将标记放置在与缺陷相关联的位置中,从缺陷到标记位置的距离在缺陷的基础上改变。 为此,基于ADR或ADC识别缺陷的形状和尺寸,并且考虑到受标记影响的范围,将标记放置在与缺陷相距一定距离的位置。 此外,在通过SEM不能观察到的缺陷的情况下,通过使用光学显微镜的观察结果来放置标记。