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1. 发明授权

US09073286B2 Composite molded article and manufacturing method thereof 有权
标题翻译：复合成形品及其制造方法
公开(公告)号：US09073286B2
公开(公告)日：2015-07-07
申请号：US13807757
申请日：2011-07-01
申请人： Akihiro Suzuki , Kohji Kamiya , Tetsuro Yamada
发明人： Akihiro Suzuki , Kohji Kamiya , Tetsuro Yamada
IPC分类号： B32B3/08 , B29C45/00 , B29C45/16 , B29C45/17 , B60J10/00 , B60J10/02 , B29C45/14 , B29L31/30
CPC分类号： B32B3/08 , B29C45/0055 , B29C45/14467 , B29C45/1657 , B29C45/1676 , B29C45/1704 , B29C2045/0058 , B29C2045/1668 , B29L2031/3005 , B29L2031/302 , B60J7/16 , B60J10/20 , B60J10/34 , B60J10/365 , B60J10/70 , Y10T428/24289
摘要： A method for manufacturing a composite molded article including: preparing a main body member to which a through hole is formed to a peripheral wall by removing a protruding portion protruding from a face of the peripheral wall surrounding a hollow space in the main body member having the hollow space formed therein along the longitudinal direction; setting the main body member in an injection molding die; forming a cushion member molding cavity by the main body member and a molding die face formed inside the injection molding die in the longitudinal direction of the main body member and allowing the through hole to communicate with the cavity; and filling a heated and melted elastic polymer material injected from an injection gate into the cavity and the hollow space from the through hole, thereby forming a cushion member and a filling portion.
摘要翻译：一种复合成形体的制造方法，其特征在于，具有：将具有通孔的主体部件形成为周壁的步骤，该主体部件通过从具有所述主体部件的主体部件中的围绕中空空间的周壁的表面突出的突出部沿纵向形成在其中的中空空间; 将主体部件设置在注射成型模具中; 通过主体构件形成缓冲构件成型腔，以及在主体构件的纵向方向上形成在注射成型模具内部的成型模面，并允许通孔与空腔连通; 以及将从注射口注入的加热熔融的弹性聚合物材料从通孔填充到空腔和中空空间中，由此形成缓冲构件和填充部分。

2. 发明授权

US08513537B2 Printed board and method of manufacturing printed board 有权
标题翻译：印刷板和制造印刷电路板的方法
公开(公告)号：US08513537B2
公开(公告)日：2013-08-20
申请号：US12859829
申请日：2010-08-20
申请人： Takahiro Ooi , Tetsuro Yamada , Yoshihiro Morita , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukouyama
发明人： Takahiro Ooi , Tetsuro Yamada , Yoshihiro Morita , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukouyama
IPC分类号： H05K1/11
CPC分类号： H05K1/025 , H05K1/024 , H05K1/0248 , H05K1/0366 , H05K3/0052 , H05K2201/029
摘要： A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.
摘要翻译：印刷电路板包括具有平坦表面的绝缘体，并且包括绝缘布，其包括第一纤维和第二纤维，所述第一纤维和第二纤维在平坦表面上与第一纤维成直角交叉;以及印刷布线，包括彼此平行延伸的多条信号线并且布置在绝缘体的平坦表面上，使得信号线的方向以基于绝缘体的板切割效率确定的角度和预定的绝缘体的角度倾斜到第一或第二纤维的方向信号线之间的延迟时间差。

3. 发明申请

US20110073354A1 PRINTED BOARD AND METHOD OF MANUFACTURING PRINTED BOARD 有权
标题翻译：印刷板和制造印刷板的方法
公开(公告)号：US20110073354A1
公开(公告)日：2011-03-31
申请号：US12859829
申请日：2010-08-20
申请人： Takahiro OOI , Tetsuro YAMADA , Yoshihiro MORITA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOUYAMA
发明人： Takahiro OOI , Tetsuro YAMADA , Yoshihiro MORITA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOUYAMA
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K1/025 , H05K1/024 , H05K1/0248 , H05K1/0366 , H05K3/0052 , H05K2201/029
摘要： A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.
摘要翻译：印刷电路板包括具有平坦表面的绝缘体，并且包括绝缘布，其包括第一纤维和第二纤维，所述第一纤维和第二纤维在平坦表面上与第一纤维成直角交叉;以及印刷布线，包括彼此平行延伸的多条信号线并且布置在绝缘体的平坦表面上，使得信号线的方向以基于绝缘体的板切割效率确定的角度和预定的绝缘体的角度倾斜到第一或第二纤维的方向信号线之间的延迟时间差。

4. 发明授权

US4911113A Valve actuating device for multiple valve type engine 失效
标题翻译：多阀式发动机的阀门致动装置
公开(公告)号：US4911113A
公开(公告)日：1990-03-27
申请号：US290443
申请日：1988-12-27
申请人： Tetsuro Yamada
发明人： Tetsuro Yamada
IPC分类号： F01L1/26 , F02F1/24 , F02F1/42
CPC分类号： F01L1/265 , F02B2275/18 , F02F1/4214 , F02F2001/247
摘要： A valve actuating arrangement for a multiple valve engine wherein the valves are positioned so that they have their heads lying at different distances from the axis of rotation of the actuating camshaft. The valve stems are kept at the same length by employing cam lobes for actuating those that have different base circles.

5. 发明授权

US08354600B2 Printed wiring board and electronic device 有权
标题翻译：印刷电路板和电子设备
公开(公告)号：US08354600B2
公开(公告)日：2013-01-15
申请号：US12612870
申请日：2009-11-05
申请人： Tetsuro Yamada
发明人： Tetsuro Yamada
IPC分类号： H05K1/11
CPC分类号： H05K1/114 , H05K1/0263 , H05K1/113 , H05K3/429 , H05K2201/09309 , H05K2201/09509 , H05K2201/09518 , H05K2201/09627 , H05K2201/0979 , H05K2201/10734
摘要： A printed wiring board includes a land formed on a surface layer, at least one power supply pattern formed on a layer except the surface layer on which the land is formed, a plurality of vias which includes a first via electrically connected to the power supply pattern and a second via electrically connected to the power supply pattern and the first via and the second via are electrically connected to the land.
摘要翻译：印刷布线板包括形成在表面层上的焊盘，形成在除了形成焊盘的表面层之外的层上的至少一个电源图案;多个通孔，其包括电连接到电源图案的第一通孔并且电连接到电源图案的第二通孔和第一通孔和第二通孔电连接到焊盘。

6. 发明申请

US20120106105A1 WIRING BOARD HAVING A PLURALITY OF VIAS 审中-公开
标题翻译：有多个VIAS的接线板
公开(公告)号：US20120106105A1
公开(公告)日：2012-05-03
申请号：US13271171
申请日：2011-10-11
申请人： Mitsuhiko SUGANE , Takahide Mukoyama , Tetsuro Yamada , Yoshiyuki Hiroshima , Takahiro Ooi , Midori Kobayashi , Akiko Matsui
发明人： Mitsuhiko SUGANE , Takahide Mukoyama , Tetsuro Yamada , Yoshiyuki Hiroshima , Takahiro Ooi , Midori Kobayashi , Akiko Matsui
IPC分类号： H05K5/00 , H05K3/30 , H05K1/11
CPC分类号： H05K3/306 , H05K3/0047 , H05K3/421 , H05K2201/10303 , H05K2201/10424 , H05K2201/1059 , H05K2203/0207 , Y10T29/49139
摘要： A wiring board unit includes a connector having a plurality of terminals; and a wiring board on which the connector is mounted. The wiring board includes a first wiring pattern provided on a first wiring layer, a second wiring pattern provided on a second wiring layer at a position shallower than the first wiring layer, a first via formed in a first recess having a first depth, the first via being in contact with the first wiring pattern, and a second via formed in a second recess having a second depth that is smaller than the first depth, the second via being in contact with the second wiring pattern.
摘要翻译：线路板单元包括具有多个端子的连接器; 以及其上安装有连接器的布线板。布线基板包括设置在第一布线层上的第一布线图形，设置在比第一布线层浅的位置的第二布线层上的第二布线图案，形成在具有第一深度的第一凹部中的第一通孔，通过与第一布线图形相接触，以及形成在第二凹部中的第二通孔，第二凹槽的第二深度小于第一深度，第二通孔与第二布线图案接触。

7. 发明申请

US20110308842A1 WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE 有权
标题翻译：接线基板及制造接线基板的方法
公开(公告)号：US20110308842A1
公开(公告)日：2011-12-22
申请号：US13075865
申请日：2011-03-30
申请人： Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOYAMA
发明人： Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOYAMA
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K1/0366 , D03D1/0088 , D03D15/0011 , D03D15/0088 , D10B2401/18 , D10B2505/02 , H05K1/024 , H05K1/0245 , H05K1/0248 , H05K2201/029 , H05K2201/091 , H05K2203/0195 , Y10T29/49124
摘要： A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.
摘要翻译：布线基板包括：绝缘层，包括热固性树脂和具有多个第一纤维束的加强件和编织在一起的多个第二纤维束，第二纤维束与第一纤维束相交，以及一对彼此并排设置的差动布线在绝缘层上。第一纤维束和第二纤维束在布置有一对差动布线的区域中相对于绝缘层的平面方向具有弯曲部分。

8. 发明申请

US20110308840A1 WIRING SUBSTRATE 有权
标题翻译：接线基板
公开(公告)号：US20110308840A1
公开(公告)日：2011-12-22
申请号：US13075838
申请日：2011-03-30
申请人： Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Tetsuro YAMADA , Mitsuhiko SUGANE , Takahide MUKOYAMA
发明人： Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Tetsuro YAMADA , Mitsuhiko SUGANE , Takahide MUKOYAMA
IPC分类号： H05K1/02 , H01R43/00
CPC分类号： H05K1/0248 , H05K1/024 , H05K1/0245 , H05K1/0269 , H05K1/0366 , H05K2201/029 , H05K2201/09272 , H05K2203/166 , H05K2203/167
摘要： A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.
摘要翻译：布线基板包括差分布线; 与所述差分布线的一侧相邻的第一绝缘层，包括平行于所述差分布线的第一光纤束; 与所述差分布线的另一侧相邻的第二绝缘层，包括与所述差分布线平行并且以与所述第一纤维束相同的间距设置的第二纤维束; 在所述第一绝缘层上的与所述差分布线相反的一侧的第三绝缘层，包括与所述差分布线平行的第三纤维束; 以及在所述第二绝缘层上的与所述差分布线相反的一侧的第四绝缘层，包括与所述差分布线平行的第四纤维束。第三和第四纤维束的间隔分别比第一和第二纤维束的间隔窄。差分布线设置在相邻的第一纤维束之间以及相邻的第二纤维束之间。

9. 发明申请

US20110232949A1 Printed Wiring Board Manufacturing Method and Printed Wiring Board 有权
标题翻译：印刷线路板制造方法和印刷线路板
公开(公告)号：US20110232949A1
公开(公告)日：2011-09-29
申请号：US13046076
申请日：2011-03-11
申请人： Tetsuro YAMADA , Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Misuhiko SUGANE , Takahide MUKOYAMA
发明人： Tetsuro YAMADA , Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Misuhiko SUGANE , Takahide MUKOYAMA
IPC分类号： H05K1/03 , B32B38/00 , B32B37/02 , B32B38/08 , B32B38/10
CPC分类号： H05K1/0245 , H05K1/0248 , H05K1/0269 , H05K1/0366 , H05K3/4638 , H05K2201/029 , H05K2201/09236 , H05K2201/0969 , H05K2203/167
摘要： A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
摘要翻译：一种印刷线路板的制造方法，其特征在于，以经纱和纬纱编织玻璃纤维布，使经纱和纬纱在至少一个区域上视觉区分。玻璃纤维布被树脂浸渍以制造基材。在基板的至少一个表面上形成铜箔以制造芯基板。在芯基板上的区域内去除铜箔以形成开口。检测出在经纱之间或介于纬纱之间的间距。基于经纱之间或纬纱之间的间距来确定要被图案化的一对差动布线之间的间距。根据所述一对差动配线之间的所确定的间距，在所述芯基板上图案化所述一对差分布线。

10. 发明申请

US20100116538A1 PRINTED WIRING BOARD AND ELECTRONIC DEVICE 有权
标题翻译：印刷线路板和电子设备
公开(公告)号：US20100116538A1
公开(公告)日：2010-05-13
申请号：US12612870
申请日：2009-11-05
申请人： Tetsuro Yamada
发明人： Tetsuro Yamada
IPC分类号： H05K1/11
CPC分类号： H05K1/114 , H05K1/0263 , H05K1/113 , H05K3/429 , H05K2201/09309 , H05K2201/09509 , H05K2201/09518 , H05K2201/09627 , H05K2201/0979 , H05K2201/10734
摘要： A printed wiring board includes a land formed on a surface layer, at least one power supply pattern formed on a layer except the surface layer on which the land is formed, a plurality of vias which includes a first via electrically connected to the power supply pattern and a second via electrically connected to the power supply pattern and the first via and the second via are electrically connected to the land.
摘要翻译：印刷布线板包括形成在表面层上的焊盘，形成在除了形成焊盘的表面层之外的层上的至少一个电源图案;多个通孔，其包括电连接到电源图案的第一通孔并且电连接到电源图案的第二通孔和第一通孔和第二通孔电连接到焊盘。

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