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1. 发明申请

US20110304031A1 SEMICONDUCTOR DEVICE EQUIPPED WITH BONDING WIRES AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE EQUIPPED WITH BONDING WIRES 有权
标题翻译：配有连接线的半导体器件和配有接线的半导体器件的制造方法
公开(公告)号：US20110304031A1
公开(公告)日：2011-12-15
申请号：US13157491
申请日：2011-06-10
申请人： Teiji SHINDO , Shinji Ota
发明人： Teiji SHINDO , Shinji Ota
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/60 , H01L23/3107 , H01L23/3192 , H01L23/49838 , H01L23/5223 , H01L24/04 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/06133 , H01L2224/06135 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49173 , H01L2224/49175 , H01L2224/78313 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1424 , H01L2924/1427 , H01L2924/1431 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/00 , H01L2924/00014 , H01L2924/00015 , H01L2924/00012
摘要： Disclosed is a semiconductor device including a printed-circuit board which includes a plurality of first electrodes, a plurality of second electrodes and a semiconductor chip on which a plurality of first connection pads are aligned in a first line being disposed along an outer circumference side of a top surface and a plurality of second connection pads are aligned in a second line being disposed inside of and apart from the first line, when the semiconductor chip is seen from above, and any of the plurality of first connection pads are used for a power voltage terminal and a system reset terminal of the semiconductor device.
摘要翻译：公开了一种半导体器件，其包括印刷电路板，该印刷电路板包括多个第一电极，多个第二电极和半导体芯片，多个第一连接焊盘沿着第一线的外周侧沿第一线排列，当从上方观察半导体芯片时，顶表面和多个第二连接焊盘在第二线中排列，第二线设置在第一线的内部并与第一线分离，并且多个第一连接焊盘中的任一个用于功率电压端子和半导体器件的系统复位端子。

2. 发明授权

US08531013B2 Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires 有权
标题翻译：配备有接合线的半导体装置和配备有接合线的半导体装置的制造方法
公开(公告)号：US08531013B2
公开(公告)日：2013-09-10
申请号：US13157491
申请日：2011-06-10
申请人： Teiji Shindo , Shinji Ota
发明人： Teiji Shindo , Shinji Ota
IPC分类号： H01L23/495
CPC分类号： H01L23/60 , H01L23/3107 , H01L23/3192 , H01L23/49838 , H01L23/5223 , H01L24/04 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/06133 , H01L2224/06135 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49173 , H01L2224/49175 , H01L2224/78313 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1424 , H01L2924/1427 , H01L2924/1431 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/00 , H01L2924/00014 , H01L2924/00015 , H01L2924/00012
摘要： Disclosed is a semiconductor device including a printed-circuit board which includes a plurality of first electrodes, a plurality of second electrodes and a semiconductor chip on which a plurality of first connection pads are aligned in a first line being disposed along an outer circumference side of a top surface and a plurality of second connection pads are aligned in a second line being disposed inside of and apart from the first line, when the semiconductor chip is seen from above, and any of the plurality of first connection pads are used for a power voltage terminal and a system reset terminal of the semiconductor device.
摘要翻译：公开了一种半导体器件，其包括印刷电路板，该印刷电路板包括多个第一电极，多个第二电极和半导体芯片，多个第一连接焊盘沿着第一线的外周侧沿第一线排列，当从上方观察半导体芯片时，顶表面和多个第二连接焊盘在第二线中排列，第二线设置在第一线的内部并与第一线分离，并且多个第一连接焊盘中的任一个用于功率电压端子和半导体器件的系统复位端子。

3. 发明授权

US5901074A Calculation data display devices and methods 失效
标题翻译：计算数据显示装置和方法
公开(公告)号：US5901074A
公开(公告)日：1999-05-04
申请号：US681011
申请日：1996-07-22
申请人： Yukihiro Nakano , Takuya Mashimo , Makoto Takenaka , Teiji Shindo , Tomoaki Satoh , Mitsuru Okano , Yoshinori Asayama
发明人： Yukihiro Nakano , Takuya Mashimo , Makoto Takenaka , Teiji Shindo , Tomoaki Satoh , Mitsuru Okano , Yoshinori Asayama
IPC分类号： G06F15/02 , G06F3/023 , G06F3/147
CPC分类号： G06F15/0225
摘要： A calculation data display device includes a display which displays input calculation data in colors. When specified calculation data is input, the calculation data display device displays the calculation data input after the specified calculation data in a color different from a regular color. The calculation data displayed in the different color is operated as calculation data belonging to the specified calculation data. First, when the specified calculation data is input in the calculation data inputting process, the calculation data input after the specified calculation data is displayed in a color different from the regular one until the user inputs releasing data. When the input calculation data is operated, the data displayed in the color different from the regular one is operated as the data belonging to the specified data input immediately before the data displayed in the different color.
摘要翻译：计算数据显示装置包括以颜色显示输入计算数据的显示器。当输入指定的计算数据时，计算数据显示装置以与常规颜色不同的颜色在指定的计算数据之后输入输入的计算数据。以不同颜色显示的计算数据作为属于指定计算数据的计算数据进行操作。首先，当在计算数据输入处理中输入指定的计算数据时，在指定的计算数据之后输入的计算数据以与常规的颜色不同的颜色显示，直到用户输入释放数据为止。当操作输入计算数据时，以与不规则颜色不同的颜色显示的数据作为紧接在以不同颜色显示的数据之前的属于指定数据输入的数据进行操作。

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