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    • 3. 发明申请
    • Defect inspection method and apparatus
    • 缺陷检查方法和装置
    • US20070285653A1
    • 2007-12-13
    • US11580870
    • 2006-10-16
    • Naohiro TakahashiTamihide YasumotoTadamasa Noguchi
    • Naohiro TakahashiTamihide YasumotoTadamasa Noguchi
    • G01N21/00
    • G01N21/9501G01N21/95607G01N2021/8854
    • (a) Scattered light from the surface of a sample subjected to the same process as a process for an inspection object is observed, a defect is detected from an intensity of scatted light, and a position of the detected defect and an intensity of scattered light caused by the detected defect are acquired.(b) Defects detected at the step (a) are classified into a group detectable by observing secondary electrons emitted when an electron beam is applied to the surface of the sample and a group not detectable. (c) A decision threshold value of a scattered light intensity for extracting defects to be counted is determined, in accordance with a result of classification by the step (b) and the intensity of scattered light caused by the detected defect.
    • (a)观察到与经过与检查对象的处理相同的处理的样品的表面的散射光,从散射光的强度,检测到的缺陷的位置和散射光的强度检测缺陷 由检测到的缺陷获得。 (b)在步骤(a)中检测到的缺陷被分类为可以通过观察将电子束施加到样品表面上发射的二次电子和不可检测的组来检测的组。 (c)根据步骤(b)的分类结果和由检测到的缺陷引起的散射光的强度,确定用于提取要计数的缺陷的散射光强度的判定阈值。
    • 4. 发明申请
    • Semiconductor wafer defect inspection method and apparatus
    • 半导体晶圆缺陷检查方法及装置
    • US20080073523A1
    • 2008-03-27
    • US11600855
    • 2006-11-17
    • Naohiro TakahashiTamihide Yasumoto
    • Naohiro TakahashiTamihide Yasumoto
    • G01N23/00
    • G01N23/225H01J37/21H01J37/28H01J2237/20228H01J2237/216
    • A semiconductor wafer whose position information on defects on a surface of the semiconductor wafer is already known, is placed on a stage of an imaging apparatus. Positions in a height direction of a plurality points on the surface of the semiconductor wafer are measured. In accordance with the measured positions in the height direction, the surface is partitioned into a plurality of partial areas. One partial area for which images of defects are still not acquired, is selected from the partial areas. The height of the stage is adjusted so as to set the selected partial area in an auto focusing range. Defects in the selected partial area are imaged with the imaging apparatus to acquire images of defects. Steps between the step of selecting the partial area and the step of acquiring the images of defects are repeated until images of defects in all partial areas are acquired.
    • 将半导体晶片的表面上的缺陷的位置信息已知的半导体晶片放置在成像装置的台上。 测量半导体晶片的表面上的多个点的高度方向的位置。 根据高度方向上的测量位置,将表面划分为多个局部区域。 从部分区域中选择一个部分区域,其中仍未获取缺陷图像。 调整舞台的高度,以便将所选择的部分区域设置在自动对焦范围内。 所选部分区域中的缺陷用成像装置成像以获得缺陷图像。 重复选择部分区域的步骤和获取缺陷图像的步骤之间的步骤,直到获取所有部分区域中的缺陷的图像。