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    • 2. 发明申请
    • SILICON ELECTRODE PLATE FOR PLASMA ETCHING
    • 用于等离子体蚀刻的硅电极板
    • US20120193030A1
    • 2012-08-02
    • US13330110
    • 2011-12-19
    • Takashi KOMEKYUKota TAKABATAKE
    • Takashi KOMEKYUKota TAKABATAKE
    • C23F1/08
    • H01J37/3255
    • [Problems] To provide a silicon electrode plate for plasma etching that suppresses the unevenness of the surface caused by plasma etching so as to ensure uniform etching.[Means for Solving the Problems] The silicon electrode plate for plasma etching is constituted by single-crystal silicon in which B and Al have been added as dopants, wherein the concentration of Al is equal to or greater than 1×1013 atoms/cm3. In the silicon electrode plate for plasma etching, the electrical characteristic of single-crystal silicon is made uniform in a plane. Thus, the occurrence of unevenness of the surface may be minimized when the surface is depleted during plasma etching, and the occurrence of cracks may be suppressed.
    • [问题]提供一种用于等离子体蚀刻的硅电极板,其抑制由等离子体蚀刻引起的表面不均匀性,以确保均匀的蚀刻。 解决问题的手段用于等离子体蚀刻的硅电极板由其中添加了B和Al作为掺杂剂的单晶硅构成,其中Al的浓度等于或大于1×1013原子/ cm3。 在用于等离子体蚀刻的硅电极板中,使单晶硅的电特性在平面内均匀。 因此,当在等离子体蚀刻期间表面耗尽时,表面的不均匀性的发生可能被最小化,并且可以抑制裂纹的发生。