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1. 发明授权

US06783427B2 Polishing system with air exhaust system 有权
标题翻译：带排气系统的抛光系统
公开(公告)号：US06783427B2
公开(公告)日：2004-08-31
申请号：US10277131
申请日：2002-10-22
申请人： Soichi Isobe , Tadakazu Sone , Takuji Hayama , Manabu Tsujimura
发明人： Soichi Isobe , Tadakazu Sone , Takuji Hayama , Manabu Tsujimura
IPC分类号： B24B100
CPC分类号： B24B37/005 , B24B55/06 , Y10S134/902
摘要： A polishing apparatus comprises: a housing defining a chamber wherein articles to be polished are subject to polishing and cleaning operations; partition walls for dividing the chamber of the housing into a plurality of sections; and, an air exhaust device. The exhaust device comprises: air exhaust conduits which are fluidly connected to the sections in the housing to exhaust air from the sections; valves for closing and opening the air exhaust conduits, respectively; and, a controller for independently controlling the valves to regulate air flows exhausted through the conduits. The conduits have inlet openings located in a vicinity of spaces where any air pollutant is generated in the sections in the housing.
摘要翻译：抛光装置包括：限定腔室的壳体，其中要抛光的物品经受抛光和清洁操作; 隔壁，用于将壳体的腔室分成多个部分; 和排气装置。排气装置包括：排气管道，其流体地连接到壳体中的部分以从部分排出空气; 用于分别关闭和打开排气管道的阀门; 以及用于独立地控制阀以调节通过导管排出的空气流的控制器。导管具有位于空间附近的入口开口，其中在壳体中的部分中产生任何空气污染物。

2. 发明申请

US20120220196A1 POLISHING APPARATUS HAVING TEMPERATURE REGULATOR FOR POLISHING PAD 有权
标题翻译：具有抛光垫温度调节器的抛光装置
公开(公告)号：US20120220196A1
公开(公告)日：2012-08-30
申请号：US13397908
申请日：2012-02-16
申请人： Toru MARUYAMA , Tadakazu Sone , Yasuyuki Motoshima
发明人： Toru MARUYAMA , Tadakazu Sone , Yasuyuki Motoshima
IPC分类号： B24B37/015
CPC分类号： B24B37/04 , B24B37/015
摘要： A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.
摘要翻译：衬底抛光装置包括：支撑抛光垫的抛光台; 顶环，构造成将衬底压靠在抛光垫上; 以及衬垫温度调节器，其构造成调节抛光垫的表面温度。焊盘温度调节器包括焊盘接触元件和液体供应系统，该液体供应系统被配置为将温度控制的液体供应到焊盘接触元件。垫接触元件在其中具有空间和将空间分成串联连接的第一液体通道和第二液体通道的隔板。在第一液体通道和第二液体通道的每一个中设置至少一个基本上垂直于抛光台的径向的挡板。

3. 发明授权

US09475167B2 Polishing apparatus having temperature regulator for polishing pad 有权
标题翻译：具有抛光垫温度调节器的抛光装置
公开(公告)号：US09475167B2
公开(公告)日：2016-10-25
申请号：US13397908
申请日：2012-02-16
申请人： Toru Maruyama , Tadakazu Sone , Yasuyuki Motoshima
发明人： Toru Maruyama , Tadakazu Sone , Yasuyuki Motoshima
IPC分类号： B24B37/015 , B24B37/04
CPC分类号： B24B37/04 , B24B37/015
摘要： A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.
摘要翻译：衬底抛光装置包括：支撑抛光垫的抛光台; 顶环，构造成将衬底压靠在抛光垫上; 以及衬垫温度调节器，其构造成调节抛光垫的表面温度。焊盘温度调节器包括焊盘接触元件和液体供应系统，该液体供应系统被配置为将温度控制的液体供应到焊盘接触元件。垫接触元件在其中具有空间和将空间分成串联连接的第一液体通道和第二液体通道的隔板。在第一液体通道和第二液体通道的每一个中设置至少一个基本上垂直于抛光台的径向的挡板。

4. 发明授权

US08845391B2 Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus 有权
标题翻译：基板研磨装置，基板研磨方法以及调整抛光装置所使用的抛光垫的研磨面温度的装置
公开(公告)号：US08845391B2
公开(公告)日：2014-09-30
申请号：US12974123
申请日：2010-12-21
申请人： Tadakazu Sone , Yasuyuki Motoshima , Toru Maruyama , Katsutoshi Ono , Yoichi Shiokawa
发明人： Tadakazu Sone , Yasuyuki Motoshima , Toru Maruyama , Katsutoshi Ono , Yoichi Shiokawa
IPC分类号： B24B1/00 , B24B55/02 , B24B37/015 , B24B37/34 , B24B37/10
CPC分类号： B24B37/015 , B24B37/042 , B24B37/10 , B24B37/34 , B24B55/02
摘要： An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.
摘要翻译：用于抛光基板的装置包括：支撑抛光垫的可旋转的抛光台;衬底保持器，其构造成保持基板，并将基板压靠在旋转的抛光台上的抛光垫的抛光表面上，以便抛光基板;以及衬垫温度检测器，被配置为测量抛光垫的抛光表面的温度。该装置还包括：衬垫温度调节器，其被配置为接触抛光表面以调节抛光表面的温度;以及温度控制器，其被配置为通过基于关于温度的信息控制焊盘温度调节器来控制抛光表面的温度由焊盘温度检测器检测到的抛光表面。

5. 发明申请

US20090247057A1 Polishing platen and polishing apparatus 审中-公开
标题翻译：抛光台板和抛光装置
公开(公告)号：US20090247057A1
公开(公告)日：2009-10-01
申请号：US11990848
申请日：2006-09-12
申请人： Takuji Kobayashi , Hideo Aizawa , Masao Umemoto , Tadakazu Sone , Hiroomi Torii , Nobuyuki Takahashi , Takashi Tsuzuki
发明人： Takuji Kobayashi , Hideo Aizawa , Masao Umemoto , Tadakazu Sone , Hiroomi Torii , Nobuyuki Takahashi , Takashi Tsuzuki
IPC分类号： B24B37/04 , B24B41/00
CPC分类号： B24B37/16
摘要： The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provides a polishing apparatus having such polishing platen. The polishing platen (12) according to the present invention includes a surface to which a polishing pad is attached. The surface of the polishing platen (12) includes a combination of a first surface (20) and a second surface (21) having a surface roughness which is different from that of the first surface (20).
摘要翻译：本发明提供一种研磨台板，其不需要大的力来从研磨台板的上表面去除抛光垫，因此能够相对容易地从其上去除抛光垫。本发明还提供一种具有这种研磨台板的抛光装置。根据本发明的抛光台板（12）包括安装有抛光垫的表面。研磨台板（12）的表面包括具有不同于第一表面（20）表面粗糙度的第一表面（20）和第二表面（21）的组合。

6. 发明申请

US20090067959A1 Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus 审中-公开
标题翻译：基板处理装置，基板输送装置，基板夹紧装置和药液处理装置
公开(公告)号：US20090067959A1
公开(公告)日：2009-03-12
申请号：US11665963
申请日：2007-02-21
申请人： Nobuyuki Takahashi , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
发明人： Nobuyuki Takahashi , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
IPC分类号： H01L21/67
CPC分类号： H01L21/67219 , B24B37/345 , H01L21/6719 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67751 , H01L21/67766 , H01L21/68707
摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).
摘要翻译：本发明涉及能够提高基板处理的节拍时间的基板处理装置。作为基板处理装置的研磨装置包括：用于研磨半导体晶片（W）的多个研磨部（3a，3b）和用于转印晶片（W）的摆动传送装置（7）。摆动传送器（7）包括适于夹紧晶片（W）的晶片夹紧机构（112），用于沿着晶片夹持机构（102）的框架（102）垂直移动的垂直移动机构（104,106）抛光部分（3a）的外壳和用于使晶片夹紧机构（112）围绕与框架（102）相邻的轴摆动的摆动机构（108,110）。

7. 发明申请

US20120193506A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE CLAMP APPARATUS, AND CHEMICAL LIQUID TREATMENT APPARATUS 审中-公开
标题翻译：基板加工装置，基板转印装置，基板夹装置和化学液体处理装置
公开(公告)号：US20120193506A1
公开(公告)日：2012-08-02
申请号：US13404409
申请日：2012-02-24
申请人： Nobuyuki TAKAHASHI , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
发明人： Nobuyuki TAKAHASHI , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
IPC分类号： F16M11/20
CPC分类号： H01L21/67219 , B24B37/345 , H01L21/6719 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67751 , H01L21/67766 , H01L21/68707
摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.
摘要翻译：本发明涉及能够提高基板处理的节拍时间的基板处理装置。作为基板处理设备的抛光装置包括用于抛光半导体晶片（W）的多个抛光部分和用于传送晶片（W）的摆动传送器。摆动传送器包括适于夹紧晶片（W）的晶片夹持机构，用于沿着抛光部分的壳体的框架垂直移动晶片夹持机构的垂直移动机构，以及用于使晶片夹紧机构摆动的摆动机构靠近框架的轴。

8. 发明申请

US20090041563A1 Wafer Transferring Apparatus, Polishing Apparatus, and Wafer Receiving Method 有权
标题翻译：晶圆转移装置，抛光装置和晶圆接收方法
公开(公告)号：US20090041563A1
公开(公告)日：2009-02-12
申请号：US11918254
申请日：2006-04-20
申请人： Nobuyuki Takahashi , Tadakazu Sone , Takuji Kobayashi , Hiroomi Torii
发明人： Nobuyuki Takahashi , Tadakazu Sone , Takuji Kobayashi , Hiroomi Torii
IPC分类号： H01L21/677 , B24B7/00
CPC分类号： H01L21/67259 , B24B37/345 , H01L21/30625 , H01L21/67751 , Y10S414/136 , Y10S414/137
摘要： A wafer transferring apparatus includes a top ring (60) for holding a wafer (W) on a lower end surface thereof and a pusher mechanism (10) for transferring the wafer (W) to and from the top ring (60). The pusher mechanism (10) has a wafer rest (40a) for placing the wafer (W) thereon and is arranged to allow the wafer (W) released from the lower end surface of the top ring (60) to be seated on the wafer rest (40a). The pusher mechanism (10) also has a sensor mechanism (50) for detecting when the wafer (W) is properly seated on the wafer rest (40a). The sensor mechanism (50) is adapted to block sensor light emitted from a light-emitting device (51) by the wafer (W) seated on the wafer rest (40a).
摘要翻译：晶片传送装置包括用于在其下端表面上保持晶片（W）的顶环（60）和用于将晶片（W）传送到顶环（60）的推动机构（10）。推动器机构（10）具有用于将晶片（W）放置在其上的晶片托架（40a），并且布置成允许从顶环（60）的下端表面释放的晶片（W）被放置在晶片休息（40a）。推动器机构（10）还具有用于检测晶片（W）何时被正确地安置在晶片托架（40a）上的传感器机构（50）。传感器机构（50）适于阻挡由位于晶片座（40a）上的晶片（W）从发光器件（51）发射的传感器光。

9. 发明授权

US06824454B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06824454B2
公开(公告)日：2004-11-30
申请号：US09777707
申请日：2001-02-07
申请人： Norio Kimura , Tadakazu Sone
发明人： Norio Kimura , Tadakazu Sone
IPC分类号： B24B700
CPC分类号： B24B53/017 , B24B49/16
摘要： A polishing apparatus for polishing a substrate comprises a turntable having a polishing surface, a substrate holder for holding a substrate and bringing the substrate into contact under pressure with the polishing surface, a dresser including a dresser tool adapted to be brought into contact under a pressure with the polishing surface to dress or condition the polishing surface and a pressure device connected to the dresser for moving the dresser between a raised position where the dresser is spaced away from the polishing surface and a dressing position where the dresser rests on the polishing surface such that the dresser tool is in contact with the polishing surface under a pressure exerted by the weight of the dresser itself, the pressure device including a member for applying an upward force to the dresser to decrease the pressure.
摘要翻译：用于抛光衬底的抛光装置包括具有抛光表面的转盘，用于保持衬底并使衬底在压力下与抛光表面接触的衬底保持器，包括修整器工具的修整器，其适于在压力下接触抛光表面用于打磨或调理抛光表面，以及连接到修整器的压力装置，用于在修整器与抛光表面间隔开的升高位置和修整器搁置在抛光表面上的修整位置之间移动修整器，修整器工具在由修整器本身的重量施加的压力下与抛光表面接触，压力装置包括用于向修整器施加向上的力以降低压力的构件。

10. 发明授权

US06435949B1 Workpiece polishing apparatus comprising a fluid pressure bag provided between a pressing surface and the workpiece and method of use thereof 失效
标题翻译：工件抛光装置，包括设置在挤压表面和工件之间的流体压力袋及其使用方法
公开(公告)号：US06435949B1
公开(公告)日：2002-08-20
申请号：US09652148
申请日：2000-08-31
申请人： Seiji Katsuoka , Hozumi Yasuda , Tadakazu Sone , Shunichiro Kojima , Manabu Tsujimura
发明人： Seiji Katsuoka , Hozumi Yasuda , Tadakazu Sone , Shunichiro Kojima , Manabu Tsujimura
IPC分类号： B24B100
CPC分类号： B24B37/30 , B24B37/32
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface, a holding surface of the top ring for holding the workpiece, and a retainer ring for retaining the workpiece within the holding surface of the top ring. The holding surface is deformable by fluid having variable pressure, and the retainer ring presses the polishing surface under a variable pressing force.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有抛光表面的转台，用于保持工件的顶环和将工件压靠在抛光表面上的压板，用于保持工件的顶环的保持表面和用于将工件保持在保持件内的保持环顶环的表面。保持表面由具有可变压力的流体变形，并且保持环以可变的压力按压抛光表面。

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