会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Method of fabricating annealed wafer
    • 制造退火晶圆的方法
    • US06818569B2
    • 2004-11-16
    • US10323733
    • 2002-12-20
    • Young-Hee MunGun KimSung-Ho Yoon
    • Young-Hee MunGun KimSung-Ho Yoon
    • H01L2126
    • H01L21/324H01L21/3221
    • A method of fabricating an annealed wafer of high quality by forming a defect-free active region of a device and controlling an irregular resistivity characteristic. The method includes a first annealing step of pre-heating a silicon wafer at a temperature of about 500° C. in a furnace in an ambience of a gas selected from the group consisting of Ar, N2 and an inert gas including Ar and N2; a second annealing step of changing the ambience of the gas into a 100% H2 gas ambience, increasing the temperature to 850° C.-1,150° C., and carrying out annealing for about an hour by maintaining the increased temperature; a third annealing step of changing the ambience of the gas into a 100% Ar gas ambience, increasing the temperature to about 1,200° C., and carrying out annealing for about an hour while the temperature of about 1,200° C. is maintained; and a temperature dropping step of decreasing the temperature in the furnace below about 500° C.
    • 通过形成器件的无缺陷有源区域并控制不规则电阻率特性来制造高质量的退火晶片的方法。 该方法包括第一退火步骤,在选自Ar,N 2和包括Ar和N 2的惰性气体的气体的氛围下,在炉中在约500℃的温度下预热硅晶片; 将气体的气氛改变为100%H2气氛的第二退火步骤,将温度升高至850℃-1.150℃,并通过维持升高的温度进行约1小时的退火; 将气体的气氛改变为100%Ar气体环境的第三退火步骤,将温度升高至约1200℃,并且在保持约1200℃的温度下进行约1小时的退火; 以及降低炉内温度低于约500℃的降温步骤。
    • 6. 发明申请
    • Organic silver complex compound used in paste for conductive pattern forming
    • 用于导电图案形成的糊料中的有机银络合物
    • US20100021704A1
    • 2010-01-28
    • US12311345
    • 2007-09-21
    • Sung-Ho YoonSo-Won KimSang-Ki ChunDong-Wook LeeSeoung-Wook KimWon-Jong Kwon
    • Sung-Ho YoonSo-Won KimSang-Ki ChunDong-Wook LeeSeoung-Wook KimWon-Jong Kwon
    • C07F1/10H01B1/12B32B3/00
    • H01B1/22H05K1/097H05K2203/121Y10T428/24802Y10T428/24917
    • Disclosed is an organic silver complex compound in which an organic ligand, containing an amine group (—NH2) and a hydroxyl group (—OH), is bonded with aliphatic silver (Ag) carboxylate at an equivalent ratio of 2:1 to form a complex. Also disclosed is a conductive paste comprising: a silver source selected from the group consisting of silver oxide powder, silver powder and silver flake; and organic silver complex compound in which an organic ligand, containing an amine group and a hydroxyl group, is bonded with an organic silver compound to form a complex. The organic silver complex compound has high solubility in a solvent and is present in the liquid state at room temperature. Thus, an extra solvent is not used in a conductive pattern-forming paste containing the complex compound or is used in a small amount, such that the content of silver in the conductive pattern-forming paste can be increased. Also, the conductive pattern-forming paste containing the complex compound has high viscosity, and thus shows excellent stability without adding a dispersant and, at the same time, is easily industrially applied.
    • 公开了一种有机银络合物,其中含有胺基(-NH 2)和羟基(-OH)的有机配体以2:1的当量比与脂肪族银(Ag)羧酸盐键合,形成 复杂。 还公开了一种导电膏,其包括:选自氧化银粉末,银粉和银片的银源; 和其中含有胺基和羟基的有机配体与有机银化合物键合以形成络合物的有机银络合物。 有机银络合物在溶剂中的溶解性高,在室温下呈液态。 因此,在含有配位化合物的导电图案形成糊剂中不使用额外的溶剂,或者少量使用,可以提高导电图案形成膏剂中的银含量。 此外,含有配合化合物的导电图形形成糊具有高粘度,因此在不添加分散剂的情况下显示出优异的稳定性,同时容易在工业上使用。
    • 7. 发明申请
    • Apparatus and method for displaying graphic objects concurrently
    • 同时显示图形对象的装置和方法
    • US20060164431A1
    • 2006-07-27
    • US11231898
    • 2005-09-22
    • Sung-ho YoonBom-jun KwonJang-seok Seo
    • Sung-ho YoonBom-jun KwonJang-seok Seo
    • G09G5/00
    • G09G5/14
    • An apparatus is provided for displaying all graphic objects after having captured a point in time when an event is transmitted to the last graphic object, when a double buffering method is used, to prevent a transition of a windows system generated by visually observable intervals occurring between events where graphic objects are displayed on a screen by an event handler. Similarly, a method is provided for concurrently displaying graphic objects, the method including checking whether an event to display a graphic object has been generated, storing the graphic object processed according to the event, checking the number of times the event, whose generation has been checked, and the graphic object have been processed, and displaying the stored graphic object as a result of the check.
    • 提供了一种装置,用于在使用双重缓冲方法之后捕获事件被发送到最后一个图形对象的时间点之后显示所有图形对象,以防止通过视觉上可观察到的间隔产生的Windows系统的转变 图形对象由事件处理程序在屏幕上显示的事件。 类似地,提供了一种用于同时显示图形对象的方法,该方法包括检查是否已经生成了显示图形对象的事件,存储根据事件处理的图形对象,检查其生成的事件的次数 检查,并且图形对象已被处理,并且作为检查的结果显示存储的图形对象。
    • 9. 发明授权
    • Method of fabricating a silicon wafer including steps of different temperature ramp-up rates and cool-down rates
    • 制造硅晶片的方法包括不同温度升温速率和冷却速率的步骤
    • US06642123B2
    • 2003-11-04
    • US10156180
    • 2002-05-29
    • Young-Hee MunGun KimSung-Ho Yoon
    • Young-Hee MunGun KimSung-Ho Yoon
    • H01L2176
    • C30B33/00C30B29/06H01L21/3225
    • A method of fabricating a silicon wafer, which includes the steps of preparing a silicon wafer by slicing, grinding, and cleaning an ingot, inserting the silicon wafer in a diffusion furnace having an ambience of one of Ar, N2 and inert gas including Ar and N2, pre-heating and maintaining the diffusion furnace at about 500° C., changing the ambience into one of H2, Ar and inert gas including H2 and Ar successively, increasing a temperature of the diffusion furnace by a temperature-increasing speed of 50˜70° C./min between 500˜800° C., 10˜50° C./min between 800˜900° C., 0.5˜10° C./min between 900˜1000° C., and 0.1˜0.5° C./min between 1000˜1250° C., maintaining the diffusion furnace at 1200˜1250° C. for 1˜120 min, changing the ambience inside the diffusion furnace into one of Ar, N2 and inert gas ambience including Ar and N2 successively, and decreasing the temperature of the diffusion furnace down to 500 ° C. by a temperature-decreasing speed of 0.1˜0.5° C./min between 1000˜1250° C., 0.5˜10° C./min between 900˜1000° C., 10˜50° C./min between 800˜900° C., and 50˜70° C./min between 500˜800° C.
    • 一种制造硅晶片的方法,包括以下步骤:通过切片,研磨和清洁锭来制备硅晶片,将硅晶片插入具有Ar,N2和包括Ar的惰性气体之一的扩散炉中, N2,将扩散炉预热并维持在约500℃,连续地将气氛改变为包括H 2和Ar的H 2,Ar和惰性气体中的一种,将扩散炉的温度升高50℃ 在500〜800℃之间为〜70℃/分钟,800〜900℃之间为10〜50℃/分钟,900〜1000℃为0.5〜10℃/分钟, 在1000〜1250℃之间为0.5℃/分钟,将扩散炉保持在1200〜1250℃1〜120分钟,将扩散炉内的氛围改变为Ar,N2和惰性气体环境中的一种,包括Ar N2连续下降,扩散炉温度降至500℃,降温速度为0.1〜0.5℃/ min,1000〜 在900〜1000℃之间为0.5〜10℃/分钟,800〜900℃为10〜50℃/分钟,500〜800℃为50〜70℃/分钟 C。