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1. 发明授权

US08962731B2 Preparation method of metal nanobelt 有权
标题翻译：金属纳米带的制备方法
公开(公告)号：US08962731B2
公开(公告)日：2015-02-24
申请号：US13578792
申请日：2011-03-10
申请人： Won-Jong Kwon , Sung-Ho Yoon , Kyung-Hoon Lee
发明人： Won-Jong Kwon , Sung-Ho Yoon , Kyung-Hoon Lee
IPC分类号： C08L79/02 , B22F1/00 , B22F7/04 , B22F9/20 , C09D11/52
CPC分类号： B22F1/0062 , B22F1/0025 , B22F7/04 , B22F9/20 , C09D11/52 , Y10S977/89
摘要： This disclosure relates to a method of preparing a metal nanobelt. According to the method, a metal nanobelt having various applicabilities, for example, capable of easily forming a conductive film or a conductive pattern with excellent conductivity, may be easily prepared by a simple process at room temperature and atmospheric pressure. The method comprises reacting a conductive polymer and a metal salt.
摘要翻译：本公开涉及一种制备金属纳米带的方法。根据该方法，可以通过在室温和大气压下的简单方法容易地制备具有各种适用性的金属纳米带，例如能够容易地形成具有优异导电性的导电膜或导电图案。该方法包括使导电聚合物与金属盐反应。

2. 发明申请

US20130059984A1 PREPARATION METHOD OF METAL NANOBELT 有权
标题翻译：金属纳米粒子的制备方法
公开(公告)号：US20130059984A1
公开(公告)日：2013-03-07
申请号：US13578792
申请日：2011-03-10
申请人： Won-Jong Kwon , Sung-Ho Yoon , Kyung-Hoon Lee
发明人： Won-Jong Kwon , Sung-Ho Yoon , Kyung-Hoon Lee
IPC分类号： C08L79/02 , B05D5/12 , C08L79/04 , B82Y40/00
CPC分类号： B22F1/0062 , B22F1/0025 , B22F7/04 , B22F9/20 , C09D11/52 , Y10S977/89
摘要： This disclosure relates to a method of preparing a metal nanobelt. According to the method, a metal nanobelt having various applicabilities, for example, capable of easily forming a conductive film or a conductive pattern with excellent conductivity, may be easily prepared by a simple process at room temperature and atmospheric pressure. The method comprises reacting a conductive polymer and a metal salt.
摘要翻译：本公开涉及一种制备金属纳米带的方法。根据该方法，可以通过在室温和大气压下的简单方法容易地制备具有各种适用性的金属纳米带，例如能够容易地形成具有优异导电性的导电膜或导电图案。该方法包括使导电聚合物与金属盐反应。

3. 发明授权

US09492866B2 Belt-shaped metal nanostructure and method for preparing same 有权
标题翻译：带状金属纳米结构及其制备方法
公开(公告)号：US09492866B2
公开(公告)日：2016-11-15
申请号：US13582683
申请日：2011-03-10
申请人： Won-Jong Kwon , Gyo-Hyun Hwang , Sang-Uck Lee , Hyuk Kim , Jung-Won Park , Sung-Ho Yoon , Kyung-Hoon Lee
发明人： Won-Jong Kwon , Gyo-Hyun Hwang , Sang-Uck Lee , Hyuk Kim , Jung-Won Park , Sung-Ho Yoon , Kyung-Hoon Lee
IPC分类号： B22F1/02 , B22F1/00 , B82Y30/00
CPC分类号： B22F1/0018 , B22F1/0025 , B82Y30/00
摘要： The present invention relates to a belt-shaped metal nanostructure in which a wide surface area of catalytically active material can be realized even by a relatively small amount thereof so that it shows an excellent catalytic activity, and a method for preparing same.
摘要翻译：本发明涉及一种带状金属纳米结构体，其中甚至可以通过相对少的量实现催化活性材料的广泛表面积，从而显示出优异的催化活性及其制备方法。

4. 发明申请

US20120329636A1 BELT-SHAPED METAL NANOSTRUCTURE AND METHOD FOR PREPARING SAME 有权
标题翻译：带形金属纳米结构及其制备方法
公开(公告)号：US20120329636A1
公开(公告)日：2012-12-27
申请号：US13582683
申请日：2011-03-10
申请人： Won-Jong Kwon , Gyo-Hyun Hwang , Sang-Uck Lee , Hyuk Kim , Jung-Won Park , Sung-Ho Yoon , Kyung-Hoon Lee
发明人： Won-Jong Kwon , Gyo-Hyun Hwang , Sang-Uck Lee , Hyuk Kim , Jung-Won Park , Sung-Ho Yoon , Kyung-Hoon Lee
IPC分类号： B01J31/26 , B01J31/28 , B82Y30/00 , B82Y40/00
CPC分类号： B22F1/0018 , B22F1/0025 , B82Y30/00
摘要： The present invention relates to a belt-shaped metal nanostructure in which a wide surface area of catalytically active material can be realized even by a relatively small amount thereof so that it shows an excellent catalytic activity, and a method for preparing same.The belt-shaped metal nanostructure comprises a metal nanobelt containing the first metal and a conductive polymer, in the shape of a belt having a nanoscale thickness, a width larger than the thickness and a length larger than the width; and the second metal coupled to one or both planes of the metal nanobelt defined by said width and length.
摘要翻译：本发明涉及一种带状金属纳米结构体，其中甚至可以通过相对少的量实现催化活性材料的广泛表面积，从而显示出优异的催化活性及其制备方法。带状金属纳米结构包括含有第一金属和导电聚合物的金属纳米带，其形状为具有纳米级厚度的带，宽度大于厚度，宽度大于宽度; 并且所述第二金属耦合到由所述宽度和长度限定的所述金属纳米带的一个或两个平面。

5. 发明申请

US20100021704A1 Organic silver complex compound used in paste for conductive pattern forming 审中-公开
标题翻译：用于导电图案形成的糊料中的有机银络合物
公开(公告)号：US20100021704A1
公开(公告)日：2010-01-28
申请号：US12311345
申请日：2007-09-21
申请人： Sung-Ho Yoon , So-Won Kim , Sang-Ki Chun , Dong-Wook Lee , Seoung-Wook Kim , Won-Jong Kwon
发明人： Sung-Ho Yoon , So-Won Kim , Sang-Ki Chun , Dong-Wook Lee , Seoung-Wook Kim , Won-Jong Kwon
IPC分类号： C07F1/10 , H01B1/12 , B32B3/00
CPC分类号： H01B1/22 , H05K1/097 , H05K2203/121 , Y10T428/24802 , Y10T428/24917
摘要： Disclosed is an organic silver complex compound in which an organic ligand, containing an amine group (—NH2) and a hydroxyl group (—OH), is bonded with aliphatic silver (Ag) carboxylate at an equivalent ratio of 2:1 to form a complex. Also disclosed is a conductive paste comprising: a silver source selected from the group consisting of silver oxide powder, silver powder and silver flake; and organic silver complex compound in which an organic ligand, containing an amine group and a hydroxyl group, is bonded with an organic silver compound to form a complex. The organic silver complex compound has high solubility in a solvent and is present in the liquid state at room temperature. Thus, an extra solvent is not used in a conductive pattern-forming paste containing the complex compound or is used in a small amount, such that the content of silver in the conductive pattern-forming paste can be increased. Also, the conductive pattern-forming paste containing the complex compound has high viscosity, and thus shows excellent stability without adding a dispersant and, at the same time, is easily industrially applied.
摘要翻译：公开了一种有机银络合物，其中含有胺基（-NH 2）和羟基（-OH）的有机配体以2:1的当量比与脂肪族银（Ag）羧酸盐键合，形成复杂。还公开了一种导电膏，其包括：选自氧化银粉末，银粉和银片的银源; 和其中含有胺基和羟基的有机配体与有机银化合物键合以形成络合物的有机银络合物。有机银络合物在溶剂中的溶解性高，在室温下呈液态。因此，在含有配位化合物的导电图案形成糊剂中不使用额外的溶剂，或者少量使用，可以提高导电图案形成膏剂中的银含量。此外，含有配合化合物的导电图形形成糊具有高粘度，因此在不添加分散剂的情况下显示出优异的稳定性，同时容易在工业上使用。

6. 发明申请

US20100119828A1 SPHERICAL ASSEMBLY PARTICLE COMPOSITION OF CUPROUS OXIDE AND PREPARATION METHOD THEREOF 有权
标题翻译：氧化丙烯的球形组装颗粒组合物及其制备方法
公开(公告)号：US20100119828A1
公开(公告)日：2010-05-13
申请号：US12452794
申请日：2008-06-25
申请人： Woo-Ram Lee , Sang-Ho Kim , Sung-Ho Yoon
发明人： Woo-Ram Lee , Sang-Ho Kim , Sung-Ho Yoon
IPC分类号： C01G3/02 , B32B5/00
CPC分类号： C01G3/02 , B01J23/72 , B01J35/0013 , B01J35/08 , B01J37/16 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/32 , C01P2004/50 , C01P2004/52 , C01P2004/61 , C01P2004/62 , H01L31/0328 , H01L31/035281 , Y02E10/50 , Y10T428/2991 , Y10T428/2998
摘要： A Cu2O spherical assembly particle composition is composed of Cu2O spherical assembly particles, each of which is formed by agglomerating a plurality of Cu2O ultrafine particles that have an average diameter in the range from 1 to 100 nm and a standard deviation on the diameter in the range from 0 to 10%. The Cu2O spherical assembly particles have an average diameter in the range from 0.1 to 10 μm and a standard deviation on the diameter in the range from 0 to 40%. This Cu2O spherical assembly particle composition is composed of Cu2O assembly particles with excellent uniformity, so it shows excellent properties such as realizing a good electric conductivity during a curing process for wiring. Accordingly, the spherical Cu2O assembly particle composition may be usefully used as precursors for solar energy conversion, magnetic storage medium, catalyst, gas sensor, and copper wire formation.
摘要翻译： Cu2O球形组件颗粒组合物由Cu2O球形组件颗粒组成，每个颗粒通过使平均直径在1至100nm范围内的多个Cu 2 O超细颗粒聚集而形成，并且在该范围内的直径的标准偏差从0到10％。 Cu2O球形组件颗粒的平均直径在0.1至10μm的范围内，直径的标准偏差在0至40％的范围内。该Cu 2 O球形组合物颗粒组合物由均匀性良好的Cu 2 O组合颗粒组成，因此在布线固化过程中实现良好的导电性。因此，球形Cu 2 O组合粒子组合物可以有用地用作太阳能转换，磁存储介质，催化剂，气体传感器和铜线形成的前体。

7. 发明授权

US06818569B2 Method of fabricating annealed wafer 有权
标题翻译：制造退火晶圆的方法
公开(公告)号：US06818569B2
公开(公告)日：2004-11-16
申请号：US10323733
申请日：2002-12-20
申请人： Young-Hee Mun , Gun Kim , Sung-Ho Yoon
发明人： Young-Hee Mun , Gun Kim , Sung-Ho Yoon
IPC分类号： H01L2126
CPC分类号： H01L21/324 , H01L21/3221
摘要： A method of fabricating an annealed wafer of high quality by forming a defect-free active region of a device and controlling an irregular resistivity characteristic. The method includes a first annealing step of pre-heating a silicon wafer at a temperature of about 500° C. in a furnace in an ambience of a gas selected from the group consisting of Ar, N2 and an inert gas including Ar and N2; a second annealing step of changing the ambience of the gas into a 100% H2 gas ambience, increasing the temperature to 850° C.-1,150° C., and carrying out annealing for about an hour by maintaining the increased temperature; a third annealing step of changing the ambience of the gas into a 100% Ar gas ambience, increasing the temperature to about 1,200° C., and carrying out annealing for about an hour while the temperature of about 1,200° C. is maintained; and a temperature dropping step of decreasing the temperature in the furnace below about 500° C.
摘要翻译：通过形成器件的无缺陷有源区域并控制不规则电阻率特性来制造高质量的退火晶片的方法。该方法包括第一退火步骤，在选自Ar，N 2和包括Ar和N 2的惰性气体的气体的氛围下，在炉中在约500℃的温度下预热硅晶片; 将气体的气氛改变为100％H2气氛的第二退火步骤，将温度升高至850℃-1.150℃，并通过维持升高的温度进行约1小时的退火; 将气体的气氛改变为100％Ar气体环境的第三退火步骤，将温度升高至约1200℃，并且在保持约1200℃的温度下进行约1小时的退火; 以及降低炉内温度低于约500℃的降温步骤。

8. 发明申请

US20090263656A1 Organic-inorganic hybrid structures having nanoparticles adhering thereon and method for preparing the same 审中-公开
标题翻译：具有纳米颗粒的有机 - 无机杂化结构及其制备方法
公开(公告)号：US20090263656A1
公开(公告)日：2009-10-22
申请号：US12311686
申请日：2007-10-10
申请人： Byung-Joon Chae , Sung-Ho Yoon
发明人： Byung-Joon Chae , Sung-Ho Yoon
IPC分类号： C08G79/00 , B32B1/00
CPC分类号： C08G83/001 , B82Y30/00 , C08J7/06 , Y10T428/2978
摘要： The invention disclosed herein provides an organic-inorganic hybrid structure having nanoparticles attached to the surface thereof, wherein the structure comprises a self-assembled structure of a coordination polymer, which includes a metal-organic ligand complex, as well as a preparation method thereof. According to the invention, through the use of the self-assembly phenomenon of coordination polymer and the use of nanoparticles having a surface component, which is the same as or similar to that of the surface of the coordination polymer, an organic-inorganic hybrid structure, which has nanoparticles attached to the surface of a self-assembled structure of coordination polymer, can be prepared in a relatively simple process without needing several steps.
摘要翻译：本文公开的本发明提供了具有附着到其表面上的纳米颗粒的有机 - 无机杂化结构，其中该结构包括配位聚合物的自组装结构，其包括金属 - 有机配体络合物及其制备方法。根据本发明，通过使用配位聚合物的自组装现象和使用与配位聚合物表面相同或相似的表面成分的纳米颗粒，可以使用有机 - 无机杂化结构，其具有附着在配位聚合物的自组装结构的表面上的纳米颗粒，可以在相对简单的过程中制备而不需要几个步骤。

9. 发明授权

US08236089B2 Preparation method of copper particle composition 有权
标题翻译：铜粒子组成的制备方法
公开(公告)号：US08236089B2
公开(公告)日：2012-08-07
申请号：US12452751
申请日：2008-07-24
申请人： Woo-Ram Lee , Sang-Ho Kim , Sung-Ho Yoon
发明人： Woo-Ram Lee , Sang-Ho Kim , Sung-Ho Yoon
IPC分类号： B22F9/24
CPC分类号： C01G3/02 , B22F9/24 , B22F2998/00 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/32 , C01P2004/51 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2004/64 , B22F1/0018
摘要： A preparation method of a copper particle composition includes dissolving a copper carboxyl compound, or a carboxyl group-containing compound and a copper salt, in a solvent to prepare a copper(II) precursor solution; putting a weak reducing agent with a standard reduction potential of −0.2 to −0.05V to the prepared copper(II) precursor solution to assemble a plurality of Cu2O fine particles having an average diameter of 1 to 100 nm with a standard deviation of 0 to 10%, thereby forming spherical Cu2O assembly particles having an average diameter of 0.1 to 10 μm with a standard deviation of 0 to 40%; reducing the spherical Cu2O assembly particles into copper particles by using a reducing agent; and separating the copper particles from the result product. Thus, copper particles can be produced fast, economically, and the obtained copper particles have good crystallinity and good resistance against oxidation.
摘要翻译：铜颗粒组合物的制备方法包括将铜羧基化合物或含羧基化合物和铜盐溶解在溶剂中以制备前体铜（II）溶液; 将具有-0.2〜-0.05V的标准还原电位的弱还原剂加入到所制备的铜（II）前体溶液中，以将标准偏差为0的平均直径为1〜100nm的多个Cu 2 O微粒组装成 10％，由此形成平均直径为0.1至10μm的球形Cu2O组装颗粒，标准偏差为0至40％; 通过使用还原剂将球形Cu2O组装颗粒还原成铜颗粒; 并从结果产物中分离出铜颗粒。因此，可以快速，经济地制造铜粒子，所得到的铜粒子具有良好的结晶性和良好的抗氧化性。

10. 发明申请

US20100116089A1 PREPARATION METHOD OF COPPER PARTICLE COMPOSITION 有权
标题翻译：铜颗粒组合物的制备方法
公开(公告)号：US20100116089A1
公开(公告)日：2010-05-13
申请号：US12452751
申请日：2008-07-24
申请人： Woo-Ram Lee , Sang-Ho Kim , Sung-Ho Yoon
发明人： Woo-Ram Lee , Sang-Ho Kim , Sung-Ho Yoon
IPC分类号： B22F9/18
CPC分类号： C01G3/02 , B22F9/24 , B22F2998/00 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/32 , C01P2004/51 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2004/64 , B22F1/0018
摘要： A preparation method of a copper particle composition includes dissolving a copper carboxyl compound, or a carboxyl group-containing compound and a copper salt, in a solvent to prepare a copper(II) precursor solution; putting a weak reducing agent with a standard reduction potential of −0.2 to −0.05V to the prepared copper(II) precursor solution to assemble a plurality of Cu2O fine particles having an average diameter of 1 to 100 nm with a standard deviation of 0 to 10%, thereby forming spherical Cu2O assembly particles having an average diameter of 0.1 to 10 μm with a standard deviation of 0 to 40%; reducing the spherical Cu2O assembly particles into copper particles by using a reducing agent; and separating the copper particles from the result product. Thus, copper particles can be produced fast, economically, and the obtained copper particles have good crystallinity and good resistance against oxidation.
摘要翻译：铜颗粒组合物的制备方法包括将铜羧基化合物或含羧基化合物和铜盐溶解在溶剂中以制备前体铜（II）溶液; 将具有-0.2〜-0.05V的标准还原电位的弱还原剂加入到所制备的铜（II）前体溶液中，以将标准偏差为0的平均直径为1〜100nm的多个Cu 2 O微粒组装成 10％，由此形成平均直径为0.1至10μm的球形Cu2O组装颗粒，标准偏差为0至40％; 通过使用还原剂将球形Cu2O组装颗粒还原成铜颗粒; 并从结果产物中分离出铜颗粒。因此，可以快速，经济地制造铜粒子，所得到的铜粒子具有良好的结晶性和良好的抗氧化性。

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